JPS639406Y2 - - Google Patents

Info

Publication number
JPS639406Y2
JPS639406Y2 JP1981006579U JP657981U JPS639406Y2 JP S639406 Y2 JPS639406 Y2 JP S639406Y2 JP 1981006579 U JP1981006579 U JP 1981006579U JP 657981 U JP657981 U JP 657981U JP S639406 Y2 JPS639406 Y2 JP S639406Y2
Authority
JP
Japan
Prior art keywords
thermoplastic polyurethane
polisher
pattern mask
mesh
uneven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981006579U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56121565U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981006579U priority Critical patent/JPS639406Y2/ja
Publication of JPS56121565U publication Critical patent/JPS56121565U/ja
Application granted granted Critical
Publication of JPS639406Y2 publication Critical patent/JPS639406Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
JP1981006579U 1981-01-22 1981-01-22 Expired JPS639406Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981006579U JPS639406Y2 (enExample) 1981-01-22 1981-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981006579U JPS639406Y2 (enExample) 1981-01-22 1981-01-22

Publications (2)

Publication Number Publication Date
JPS56121565U JPS56121565U (enExample) 1981-09-16
JPS639406Y2 true JPS639406Y2 (enExample) 1988-03-19

Family

ID=29603249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981006579U Expired JPS639406Y2 (enExample) 1981-01-22 1981-01-22

Country Status (1)

Country Link
JP (1) JPS639406Y2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0984846B1 (en) * 1997-01-13 2004-11-24 Rodel, Inc. Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern
JP4996767B1 (ja) * 2010-11-12 2012-08-08 株式会社Ｆｉｌｗｅｌ 片面研磨用保持材の製造方法
JP7180976B2 (ja) * 2017-12-26 2022-11-30 富士紡ホールディングス株式会社 研磨パッドの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5363695A (en) * 1976-11-17 1978-06-07 Hitachi Ltd Method of finish polishing
JPS5373067A (en) * 1976-12-13 1978-06-29 Nippon Telegr & Teleph Corp <Ntt> Polisher
JPS5531582A (en) * 1978-08-15 1980-03-05 Ibm Free polishing device

Also Published As

Publication number Publication date
JPS56121565U (enExample) 1981-09-16

Similar Documents

Publication Publication Date Title
JP4151799B2 (ja) モザイク研磨パッド及びこれに関連する方法
US5101602A (en) Foam backing for use with semiconductor wafers
US5885135A (en) CMP wafer carrier for preferential polishing of a wafer
JPH09270401A (ja) 半導体ウェーハの研磨方法
JPH05212669A (ja) 半導体プロセスのための改良された複合研摩パッド
JPH0335063B2 (enExample)
JP6252098B2 (ja) 角形金型用基板
JPH10180599A (ja) 薄板ワーク平面研削装置及び方法
CN101853670A (zh) 磁盘用基板以及其制造方法
US5157877A (en) Method for preparing a semiconductor wafer
US6386957B1 (en) Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus
EP0798078A2 (en) Method for manufacturing backing pad and apparatus used therefor
US3924361A (en) Method of shaping semiconductor workpieces
JP2002046058A (ja) 両面研磨用研磨布のドレッシング方法
JP4887023B2 (ja) 研磨パッドの製造方法および研磨パッド
JP2024006625A (ja) ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム
JP2026022224A (ja) 研磨パッド及び研磨パッドの製造方法
JPH11277445A (ja) 基板研磨用砥石及び研磨装置
JPH0398759A (ja) ポリシングパッド及びその製造方法
JPH11347926A (ja) シリコンウエハのラッピング方法
JP2003080465A (ja) ラッピングフィルム及びその製造方法
JP3638138B2 (ja) ウエーハ保持盤の作製方法及びウエーハの研磨方法
JPH10277921A (ja) 研磨布
JPH08192353A (ja) 半導体ウェーハの研磨装置およびその製造方法
JPS6471661A (en) Mirror polishing method for semiconductor wafer