JP4163756B2 - ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法 - Google Patents

ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法 Download PDF

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Publication number
JP4163756B2
JP4163756B2 JP53109098A JP53109098A JP4163756B2 JP 4163756 B2 JP4163756 B2 JP 4163756B2 JP 53109098 A JP53109098 A JP 53109098A JP 53109098 A JP53109098 A JP 53109098A JP 4163756 B2 JP4163756 B2 JP 4163756B2
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Prior art keywords
pad
precursor
pattern
substrate
photomask
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Expired - Lifetime
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JP53109098A
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Japanese (ja)
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JP2001507997A5 (enExample
JP2001507997A (ja
Inventor
リー メルボルン クック
デヴィド ビー． ジェームス
ニナ ジー． チェチック
ウイリアム ディー． バディンガー
Original Assignee
ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド
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Publication of JP2001507997A publication Critical patent/JP2001507997A/ja
Publication of JP2001507997A5 publication Critical patent/JP2001507997A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP53109098A 1997-01-13 1998-01-12 ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法 Expired - Lifetime JP4163756B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3449297P 1997-01-13 1997-01-13
US60/034,492 1997-01-13
PCT/US1998/000317 WO1998030356A1 (en) 1997-01-13 1998-01-12 Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto

Publications (3)

Publication Number Publication Date
JP2001507997A JP2001507997A (ja) 2001-06-19
JP2001507997A5 JP2001507997A5 (enExample) 2005-09-08
JP4163756B2 true JP4163756B2 (ja) 2008-10-08

Family

ID=21876756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53109098A Expired - Lifetime JP4163756B2 (ja) 1997-01-13 1998-01-12 ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法

Country Status (6)

Country Link
US (2) US6036579A (enExample)
EP (1) EP0984846B1 (enExample)
JP (1) JP4163756B2 (enExample)
KR (1) KR100487455B1 (enExample)
DE (1) DE69827789T2 (enExample)
WO (1) WO1998030356A1 (enExample)

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Also Published As

Publication number Publication date
US6210254B1 (en) 2001-04-03
DE69827789T2 (de) 2005-11-10
US6036579A (en) 2000-03-14
JP2001507997A (ja) 2001-06-19
DE69827789D1 (de) 2004-12-30
EP0984846A1 (en) 2000-03-15
KR20000070068A (ko) 2000-11-25
EP0984846B1 (en) 2004-11-24
WO1998030356A1 (en) 1998-07-16
KR100487455B1 (ko) 2005-05-09
EP0984846A4 (en) 2000-03-15

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