KR100464579B1 - 반도체 장치 제조 방법 - Google Patents
반도체 장치 제조 방법 Download PDFInfo
- Publication number
- KR100464579B1 KR100464579B1 KR10-2002-0017006A KR20020017006A KR100464579B1 KR 100464579 B1 KR100464579 B1 KR 100464579B1 KR 20020017006 A KR20020017006 A KR 20020017006A KR 100464579 B1 KR100464579 B1 KR 100464579B1
- Authority
- KR
- South Korea
- Prior art keywords
- processing
- lot
- rie
- cleaning
- lots
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001095306A JP2002299315A (ja) | 2001-03-29 | 2001-03-29 | 半導体装置の製造方法 |
| JPJP-P-2001-00095306 | 2001-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020077191A KR20020077191A (ko) | 2002-10-11 |
| KR100464579B1 true KR100464579B1 (ko) | 2005-01-03 |
Family
ID=18949375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2002-0017006A Expired - Fee Related KR100464579B1 (ko) | 2001-03-29 | 2002-03-28 | 반도체 장치 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6911398B2 (enExample) |
| JP (1) | JP2002299315A (enExample) |
| KR (1) | KR100464579B1 (enExample) |
| CN (1) | CN1197122C (enExample) |
| TW (1) | TW538435B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101227235B1 (ko) * | 2008-03-17 | 2013-01-28 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템의 세정 방법, 기억 매체 및 기판 처리 시스템 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004221313A (ja) * | 2003-01-15 | 2004-08-05 | Kawasaki Microelectronics Kk | 半導体製造工程の管理方法および半導体製造ラインの管理システム |
| US7113253B2 (en) * | 2003-09-16 | 2006-09-26 | Asml Netherlands B.V. | Method, apparatus and computer product for substrate processing |
| CN101365822A (zh) * | 2006-07-31 | 2009-02-11 | 东京毅力科创株式会社 | 基板处理装置、程序、存储介质和决定是否需要调节的方法 |
| JP2009024229A (ja) * | 2007-07-20 | 2009-02-05 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2010098053A (ja) * | 2008-10-15 | 2010-04-30 | Tokyo Electron Ltd | クリーニング方法及び記録媒体 |
| JP5431901B2 (ja) * | 2008-12-26 | 2014-03-05 | キヤノンアネルバ株式会社 | インライン真空処理装置、インライン真空処理装置の制御方法、情報記録媒体の製造方法 |
| US10157741B1 (en) * | 2017-07-31 | 2018-12-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of manufacturing a semiconductor structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0785155A (ja) * | 1993-06-23 | 1995-03-31 | Sony Corp | ロット管理装置 |
| JPH08102458A (ja) * | 1994-08-01 | 1996-04-16 | Tokyo Electron Ltd | 洗浄処理装置およびその制御方法 |
| JPH10149990A (ja) * | 1996-11-19 | 1998-06-02 | Kokusai Electric Co Ltd | ガスクリーニング方法 |
| KR19990073317A (ko) * | 1999-07-02 | 1999-10-05 | 김광교 | 반도체세정설비의구동제어방법및그장치 |
| JP2001351868A (ja) * | 2000-06-07 | 2001-12-21 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985032A (en) * | 1995-05-17 | 1999-11-16 | Matsushita Electric Industrial Co., Ltd. | Semiconductor manufacturing apparatus |
| JPH10199817A (ja) | 1997-01-10 | 1998-07-31 | Kokusai Electric Co Ltd | 成膜装置 |
| US6280790B1 (en) * | 1997-06-30 | 2001-08-28 | Applied Materials, Inc. | Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system |
| EP1030745A4 (en) * | 1997-11-14 | 2006-12-13 | Tokyo Electron Ltd | PLASMA SOURCE WITH RADIO FREQUENCY AND ELECTROSTATIC PROTECTION, POLARIZABLE ON ALL ITS FACES AND / OR TEMPERATURE CONTROL |
| US6168672B1 (en) * | 1998-03-06 | 2001-01-02 | Applied Materials Inc. | Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system |
| KR19990076407A (ko) * | 1998-03-31 | 1999-10-15 | 윤종용 | 반도체장치의 제조공정에 있어서의 박막 형성방법 |
| US6270576B1 (en) * | 1998-08-05 | 2001-08-07 | Tokyo Electron Limited | Coating and developing apparatus |
-
2001
- 2001-03-29 JP JP2001095306A patent/JP2002299315A/ja not_active Abandoned
-
2002
- 2002-03-25 TW TW091105746A patent/TW538435B/zh not_active IP Right Cessation
- 2002-03-28 US US10/107,434 patent/US6911398B2/en not_active Expired - Fee Related
- 2002-03-28 KR KR10-2002-0017006A patent/KR100464579B1/ko not_active Expired - Fee Related
- 2002-03-29 CN CNB021087113A patent/CN1197122C/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0785155A (ja) * | 1993-06-23 | 1995-03-31 | Sony Corp | ロット管理装置 |
| JPH08102458A (ja) * | 1994-08-01 | 1996-04-16 | Tokyo Electron Ltd | 洗浄処理装置およびその制御方法 |
| JPH10149990A (ja) * | 1996-11-19 | 1998-06-02 | Kokusai Electric Co Ltd | ガスクリーニング方法 |
| KR19990073317A (ko) * | 1999-07-02 | 1999-10-05 | 김광교 | 반도체세정설비의구동제어방법및그장치 |
| JP2001351868A (ja) * | 2000-06-07 | 2001-12-21 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101227235B1 (ko) * | 2008-03-17 | 2013-01-28 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템의 세정 방법, 기억 매체 및 기판 처리 시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6911398B2 (en) | 2005-06-28 |
| TW538435B (en) | 2003-06-21 |
| CN1379438A (zh) | 2002-11-13 |
| KR20020077191A (ko) | 2002-10-11 |
| US20020155727A1 (en) | 2002-10-24 |
| CN1197122C (zh) | 2005-04-13 |
| JP2002299315A (ja) | 2002-10-11 |
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