KR100464579B1 - 반도체 장치 제조 방법 - Google Patents

반도체 장치 제조 방법 Download PDF

Info

Publication number
KR100464579B1
KR100464579B1 KR10-2002-0017006A KR20020017006A KR100464579B1 KR 100464579 B1 KR100464579 B1 KR 100464579B1 KR 20020017006 A KR20020017006 A KR 20020017006A KR 100464579 B1 KR100464579 B1 KR 100464579B1
Authority
KR
South Korea
Prior art keywords
processing
lot
rie
cleaning
lots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2002-0017006A
Other languages
English (en)
Korean (ko)
Other versions
KR20020077191A (ko
Inventor
나리따마사끼
오꾸무라가쯔야
오히와도꾸히사
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20020077191A publication Critical patent/KR20020077191A/ko
Application granted granted Critical
Publication of KR100464579B1 publication Critical patent/KR100464579B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR10-2002-0017006A 2001-03-29 2002-03-28 반도체 장치 제조 방법 Expired - Fee Related KR100464579B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001095306A JP2002299315A (ja) 2001-03-29 2001-03-29 半導体装置の製造方法
JPJP-P-2001-00095306 2001-03-29

Publications (2)

Publication Number Publication Date
KR20020077191A KR20020077191A (ko) 2002-10-11
KR100464579B1 true KR100464579B1 (ko) 2005-01-03

Family

ID=18949375

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2002-0017006A Expired - Fee Related KR100464579B1 (ko) 2001-03-29 2002-03-28 반도체 장치 제조 방법

Country Status (5)

Country Link
US (1) US6911398B2 (enExample)
JP (1) JP2002299315A (enExample)
KR (1) KR100464579B1 (enExample)
CN (1) CN1197122C (enExample)
TW (1) TW538435B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101227235B1 (ko) * 2008-03-17 2013-01-28 도쿄엘렉트론가부시키가이샤 기판 처리 시스템의 세정 방법, 기억 매체 및 기판 처리 시스템

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221313A (ja) * 2003-01-15 2004-08-05 Kawasaki Microelectronics Kk 半導体製造工程の管理方法および半導体製造ラインの管理システム
US7113253B2 (en) * 2003-09-16 2006-09-26 Asml Netherlands B.V. Method, apparatus and computer product for substrate processing
CN101365822A (zh) * 2006-07-31 2009-02-11 东京毅力科创株式会社 基板处理装置、程序、存储介质和决定是否需要调节的方法
JP2009024229A (ja) * 2007-07-20 2009-02-05 Hitachi Kokusai Electric Inc 基板処理装置
JP2010098053A (ja) * 2008-10-15 2010-04-30 Tokyo Electron Ltd クリーニング方法及び記録媒体
JP5431901B2 (ja) * 2008-12-26 2014-03-05 キヤノンアネルバ株式会社 インライン真空処理装置、インライン真空処理装置の制御方法、情報記録媒体の製造方法
US10157741B1 (en) * 2017-07-31 2018-12-18 Taiwan Semiconductor Manufacturing Company Ltd. Method of manufacturing a semiconductor structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785155A (ja) * 1993-06-23 1995-03-31 Sony Corp ロット管理装置
JPH08102458A (ja) * 1994-08-01 1996-04-16 Tokyo Electron Ltd 洗浄処理装置およびその制御方法
JPH10149990A (ja) * 1996-11-19 1998-06-02 Kokusai Electric Co Ltd ガスクリーニング方法
KR19990073317A (ko) * 1999-07-02 1999-10-05 김광교 반도체세정설비의구동제어방법및그장치
JP2001351868A (ja) * 2000-06-07 2001-12-21 Hitachi Kokusai Electric Inc 半導体製造装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5985032A (en) * 1995-05-17 1999-11-16 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus
JPH10199817A (ja) 1997-01-10 1998-07-31 Kokusai Electric Co Ltd 成膜装置
US6280790B1 (en) * 1997-06-30 2001-08-28 Applied Materials, Inc. Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system
EP1030745A4 (en) * 1997-11-14 2006-12-13 Tokyo Electron Ltd PLASMA SOURCE WITH RADIO FREQUENCY AND ELECTROSTATIC PROTECTION, POLARIZABLE ON ALL ITS FACES AND / OR TEMPERATURE CONTROL
US6168672B1 (en) * 1998-03-06 2001-01-02 Applied Materials Inc. Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
KR19990076407A (ko) * 1998-03-31 1999-10-15 윤종용 반도체장치의 제조공정에 있어서의 박막 형성방법
US6270576B1 (en) * 1998-08-05 2001-08-07 Tokyo Electron Limited Coating and developing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0785155A (ja) * 1993-06-23 1995-03-31 Sony Corp ロット管理装置
JPH08102458A (ja) * 1994-08-01 1996-04-16 Tokyo Electron Ltd 洗浄処理装置およびその制御方法
JPH10149990A (ja) * 1996-11-19 1998-06-02 Kokusai Electric Co Ltd ガスクリーニング方法
KR19990073317A (ko) * 1999-07-02 1999-10-05 김광교 반도체세정설비의구동제어방법및그장치
JP2001351868A (ja) * 2000-06-07 2001-12-21 Hitachi Kokusai Electric Inc 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101227235B1 (ko) * 2008-03-17 2013-01-28 도쿄엘렉트론가부시키가이샤 기판 처리 시스템의 세정 방법, 기억 매체 및 기판 처리 시스템

Also Published As

Publication number Publication date
US6911398B2 (en) 2005-06-28
TW538435B (en) 2003-06-21
CN1379438A (zh) 2002-11-13
KR20020077191A (ko) 2002-10-11
US20020155727A1 (en) 2002-10-24
CN1197122C (zh) 2005-04-13
JP2002299315A (ja) 2002-10-11

Similar Documents

Publication Publication Date Title
US6869542B2 (en) Hard mask integrated etch process for patterning of silicon oxide and other dielectric materials
JP2674488B2 (ja) ドライエッチング室のクリーニング方法
US7785484B2 (en) Mask trimming with ARL etch
TW202234140A (zh) 極紫外光(euv)光阻的圖案化顯影方法
EP0871211A2 (en) Plasma treatment method and manufacturing method of semiconductor device
WO2007021540A2 (en) Etch features with reduced line edge roughness
CN101448580A (zh) 具有室去氟化和晶片去氟化中间步骤的等离子体蚀刻和光刻胶剥离工艺
US20070128849A1 (en) Waferless automatic cleaning after barrier removal
JPH06177092A (ja) 半導体装置の製造方法
KR100464579B1 (ko) 반도체 장치 제조 방법
JP2003023072A (ja) 半導体装置の製造方法および半導体装置の製造装置
US6329294B1 (en) Method for removing photoresist mask used for etching of metal layer and other etching by-products
JP4755963B2 (ja) 半導体装置の製造方法
JPH05144779A (ja) シリコン酸化膜のドライエツチング方法
KR20000071322A (ko) 반도체 장치 제조 방법
JP5052313B2 (ja) 半導体装置の製造方法
JPH05109673A (ja) 半導体装置の製造方法
JP2001176843A (ja) ドライクリーニング方法
JPH1012734A (ja) 半導体装置の製造方法
JPH05217965A (ja) 半導体装置の製造方法
US7192874B2 (en) Method for reducing foreign material concentrations in etch chambers
US6403489B1 (en) Method for removing polymer stacked on a lower electrode within an etching reaction chamber
US6183819B1 (en) Method for processing a poly defect
KR100418121B1 (ko) 반도체소자의 제조방법
TW202522597A (zh) 矽基材料的選擇性原子層蝕刻

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20121130

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20131119

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20141120

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20151118

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20161223

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20161223

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000