KR100444925B1 - 열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프 - Google Patents

열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프 Download PDF

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Publication number
KR100444925B1
KR100444925B1 KR1020040026527A KR20040026527A KR100444925B1 KR 100444925 B1 KR100444925 B1 KR 100444925B1 KR 1020040026527 A KR1020040026527 A KR 1020040026527A KR 20040026527 A KR20040026527 A KR 20040026527A KR 100444925 B1 KR100444925 B1 KR 100444925B1
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KR
South Korea
Prior art keywords
composition
adhesive
film
resin
epoxy resin
Prior art date
Application number
KR1020040026527A
Other languages
English (en)
Korean (ko)
Inventor
장경호
김광무
권정민
이경록
박덕하
Original Assignee
(주)새한마이크로닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)새한마이크로닉스 filed Critical (주)새한마이크로닉스
Priority to KR1020040026527A priority Critical patent/KR100444925B1/ko
Priority to TW093124645A priority patent/TWI280971B/zh
Application granted granted Critical
Publication of KR100444925B1 publication Critical patent/KR100444925B1/ko
Priority to JP2004264970A priority patent/JP2005307152A/ja
Priority to CNB2005100741300A priority patent/CN1311042C/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
KR1020040026527A 2004-04-19 2004-04-19 열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프 KR100444925B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020040026527A KR100444925B1 (ko) 2004-04-19 2004-04-19 열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프
TW093124645A TWI280971B (en) 2004-04-19 2004-08-17 Thermosetting adhesive composition and adhesive tape for electronic parts using the same
JP2004264970A JP2005307152A (ja) 2004-04-19 2004-09-13 熱硬化性接着剤用組成物及びそれを用いた電子部品用接着テープ
CNB2005100741300A CN1311042C (zh) 2004-04-19 2005-04-18 热固性粘合剂组合物和用于电子元件的使用该组合物的粘合带

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040026527A KR100444925B1 (ko) 2004-04-19 2004-04-19 열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프

Publications (1)

Publication Number Publication Date
KR100444925B1 true KR100444925B1 (ko) 2004-08-21

Family

ID=35345914

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040026527A KR100444925B1 (ko) 2004-04-19 2004-04-19 열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프

Country Status (4)

Country Link
JP (1) JP2005307152A (zh)
KR (1) KR100444925B1 (zh)
CN (1) CN1311042C (zh)
TW (1) TWI280971B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100806763B1 (ko) 2005-09-07 2008-02-27 김성민 피씨비 라미네이션 공정용 이형필름
KR101024937B1 (ko) * 2008-07-04 2011-03-31 에스디플렉스(주) 양면 연성 동박 적층판 및 이를 제조하는 방법
CN112271325A (zh) * 2020-09-15 2021-01-26 赖见 一种三维固态锂电池及其制备方法
CN112585182A (zh) * 2018-05-30 2021-03-30 阿克塞尔产业有限公司 粘合剂和形成粘合剂的方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006038330A1 (de) * 2006-08-15 2008-02-21 Phoenix Contact Gmbh & Co. Kg Verfahren zum Verbinden von Kunststoffteilen elektrischer oder elektronischer Bauteile, insbesondere von Steckverbindern, und auf diese Weise erhaltene Produkte
DE102008046873A1 (de) * 2008-09-11 2010-03-18 Tesa Se Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
CN102786805B (zh) * 2012-08-31 2014-10-22 广东银禧科技股份有限公司 一种高抗水损害的沥青混合料改性剂及其制备和应用于路面铺设方法
KR20170084672A (ko) * 2016-01-12 2017-07-20 후지모리 고교 가부시키가이샤 커버레이 필름
CN110628348A (zh) * 2019-10-28 2019-12-31 南昌正业科技有限公司 一种变压器用纯胶保护膜及其生产工艺
JP2021155495A (ja) * 2020-03-25 2021-10-07 大日本印刷株式会社 発泡性接着シートおよび物品の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2732020B2 (ja) * 1993-10-22 1998-03-25 株式会社巴川製紙所 電子部品用接着テープおよび液状接着剤
JP2684004B2 (ja) * 1993-10-22 1997-12-03 株式会社巴川製紙所 ピペラジニルエチルアミノカルボニル基含有ブタジエン−アクリロニトリル共重合体およびその製造方法
JP2732021B2 (ja) * 1993-10-22 1998-03-25 株式会社巴川製紙所 電子部品用接着テープおよび液状接着剤
JPH09241601A (ja) * 1996-03-14 1997-09-16 Tomoegawa Paper Co Ltd 電子部品用液状接着剤およびそれを用いる絶縁接着層の形成方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100806763B1 (ko) 2005-09-07 2008-02-27 김성민 피씨비 라미네이션 공정용 이형필름
KR101024937B1 (ko) * 2008-07-04 2011-03-31 에스디플렉스(주) 양면 연성 동박 적층판 및 이를 제조하는 방법
CN112585182A (zh) * 2018-05-30 2021-03-30 阿克塞尔产业有限公司 粘合剂和形成粘合剂的方法
CN112271325A (zh) * 2020-09-15 2021-01-26 赖见 一种三维固态锂电池及其制备方法
CN112271325B (zh) * 2020-09-15 2023-08-18 赖见 一种三维固态锂电池及其制备方法

Also Published As

Publication number Publication date
CN1690153A (zh) 2005-11-02
TW200535209A (en) 2005-11-01
JP2005307152A (ja) 2005-11-04
CN1311042C (zh) 2007-04-18
TWI280971B (en) 2007-05-11

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