KR100420272B1 - 오프셋 측정방법, 툴위치 검출방법 및 본딩장치 - Google Patents

오프셋 측정방법, 툴위치 검출방법 및 본딩장치 Download PDF

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Publication number
KR100420272B1
KR100420272B1 KR10-2001-0011101A KR20010011101A KR100420272B1 KR 100420272 B1 KR100420272 B1 KR 100420272B1 KR 20010011101 A KR20010011101 A KR 20010011101A KR 100420272 B1 KR100420272 B1 KR 100420272B1
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South Korea
Prior art keywords
tool
position detecting
reference member
imager
offset
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Expired - Fee Related
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English (en)
Korean (ko)
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KR20010087325A (ko
Inventor
하야타시게루
교마스류이치
에노키도사토시
사사노도시아키
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가부시키가이샤 신가와
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
KR10-2001-0011101A 2000-03-06 2001-03-05 오프셋 측정방법, 툴위치 검출방법 및 본딩장치 Expired - Fee Related KR100420272B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000059843A JP3967518B2 (ja) 2000-03-06 2000-03-06 オフセット測定方法、ツール位置検出方法およびボンディング装置
JP2000-059843 2000-03-06

Publications (2)

Publication Number Publication Date
KR20010087325A KR20010087325A (ko) 2001-09-15
KR100420272B1 true KR100420272B1 (ko) 2004-03-02

Family

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KR10-2001-0011101A Expired - Fee Related KR100420272B1 (ko) 2000-03-06 2001-03-05 오프셋 측정방법, 툴위치 검출방법 및 본딩장치

Country Status (4)

Country Link
US (2) US6762848B2 (enExample)
JP (1) JP3967518B2 (enExample)
KR (1) KR100420272B1 (enExample)
TW (1) TW475229B (enExample)

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JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置
JP4620262B2 (ja) * 2001-01-16 2011-01-26 富士機械製造株式会社 電子部品装着装置
DE10119018A1 (de) * 2001-04-18 2002-10-24 Emhart Llc Newark Positionier- und/oder Montagehilfe sowie dementsprechendes Verfahren
CN100394577C (zh) * 2002-04-04 2008-06-11 东丽工程株式会社 定位方法及使用该方法的安装方法
JP4105926B2 (ja) * 2002-09-30 2008-06-25 株式会社新川 ボンディング装置におけるオフセット測定機構及びボンディング装置におけるオフセット測定方法
JP4128540B2 (ja) * 2003-06-05 2008-07-30 株式会社新川 ボンディング装置
DE10338809B4 (de) * 2003-08-21 2008-05-21 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Justage von Bondkopfelementen
JP4088232B2 (ja) * 2003-10-07 2008-05-21 株式会社新川 ボンディング方法、ボンディング装置及びボンディングプログラム
US20070260420A1 (en) * 2006-05-03 2007-11-08 Data I/O Corporation Automated calibration system
JP4247299B1 (ja) * 2008-03-31 2009-04-02 株式会社新川 ボンディング装置及びボンディング方法
JP5301329B2 (ja) * 2008-03-31 2013-09-25 Ｊｕｋｉ株式会社 電子部品の実装方法
US7810698B2 (en) * 2008-11-20 2010-10-12 Asm Assembly Automation Ltd. Vision system for positioning a bonding tool
JP2010256341A (ja) * 2009-03-31 2010-11-11 Toshiba Mach Co Ltd 刃先位置検出方法および刃先位置検出装置
KR101360289B1 (ko) 2012-02-28 2014-02-12 국립대학법인 울산과학기술대학교 산학협력단 공구의 깊이 방향의 이동 위치 측정 방법
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
JP5389995B1 (ja) * 2012-08-21 2014-01-15 安田工業株式会社 計測システム及びその計測システムを備えた工作機械
TWI498179B (zh) * 2012-12-19 2015-09-01 Genesis Photonics Inc 工作機台及晶圓的處理方法
CN104690424B (zh) * 2013-12-05 2016-08-24 大族激光科技产业集团股份有限公司 丝端面熔球激光焊接装置及方法
TWI580511B (zh) * 2014-06-10 2017-05-01 新川股份有限公司 A bonding device, and a method of estimating the placement position of the engagement tool
CN107615465B (zh) * 2015-03-31 2020-05-12 株式会社新川 引线接合装置以及引线接合方法
CN104741297B (zh) * 2015-04-08 2018-01-16 常州铭赛机器人科技股份有限公司 易损件顶点坐标校正装置及校正方法
US11031367B2 (en) 2016-10-25 2021-06-08 Kulicke and Soffa Industries, In. Bond head assemblies including reflective optical elements, related bonding machines, and related methods
DE102017204657A1 (de) 2017-03-21 2018-09-27 Schunk Sonosystems Gmbh Verfahren und Vorrichtung zur Herstellung einer Schweißbaugruppe
US11047795B2 (en) * 2019-06-03 2021-06-29 Formfactor, Inc. Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems
CN113136721B (zh) * 2020-01-17 2024-06-18 青岛海尔洗衣机有限公司 一种叠衣机的自动纠偏方法
US11540399B1 (en) * 2020-04-09 2022-12-27 Hrl Laboratories, Llc System and method for bonding a cable to a substrate using a die bonder
CN115649799A (zh) * 2022-11-16 2023-01-31 河南中烟工业有限责任公司 一种烟箱的输送姿态检测系统及方法
CN117324271B (zh) * 2023-11-26 2024-05-10 广州奥图弹簧有限公司 一种高精密ccd全检打二维码一体设备
CN119870975B (zh) * 2025-03-28 2025-06-06 江苏筑一智能装备科技有限公司 一种压板、导向平键组装与合膛组合加工设备

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JP3416091B2 (ja) * 2000-01-21 2003-06-16 株式会社新川 ボンディング装置およびボンディング方法
JP3566166B2 (ja) * 2000-02-10 2004-09-15 株式会社新川 ツール位置測定方法、オフセット測定方法、基準部材およびボンディング装置
JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置

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Also Published As

Publication number Publication date
TW475229B (en) 2002-02-01
JP2001249007A (ja) 2001-09-14
KR20010087325A (ko) 2001-09-15
US20010042770A1 (en) 2001-11-22
US6762848B2 (en) 2004-07-13
US20030030821A1 (en) 2003-02-13
US6814121B2 (en) 2004-11-09
JP3967518B2 (ja) 2007-08-29

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