KR100417042B1 - 카드형데이터매체와데이터매체용리드프레임 - Google Patents
카드형데이터매체와데이터매체용리드프레임 Download PDFInfo
- Publication number
 - KR100417042B1 KR100417042B1 KR1019970706861A KR19970706861A KR100417042B1 KR 100417042 B1 KR100417042 B1 KR 100417042B1 KR 1019970706861 A KR1019970706861 A KR 1019970706861A KR 19970706861 A KR19970706861 A KR 19970706861A KR 100417042 B1 KR100417042 B1 KR 100417042B1
 - Authority
 - KR
 - South Korea
 - Prior art keywords
 - card
 - data
 - lead frame
 - contacts
 - data medium
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Expired - Fee Related
 
Links
Images
Classifications
- 
        
- G—PHYSICS
 - G06—COMPUTING OR CALCULATING; COUNTING
 - G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
 - G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
 - G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
 - G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
 - G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
 - G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L23/00—Details of semiconductor or other solid state devices
 - H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
 - H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
 - H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
 
 - 
        
- G—PHYSICS
 - G06—COMPUTING OR CALCULATING; COUNTING
 - G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
 - G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
 - G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
 - G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
 - G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
 - G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
 - G06K19/07743—External electrical contacts
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
 - H01L2924/0001—Technical content checked by a classifier
 - H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
 
 - 
        
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
 - Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
 - Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
 - Y10T29/00—Metal working
 - Y10T29/49—Method of mechanical manufacture
 - Y10T29/49002—Electrical device making
 - Y10T29/49117—Conductor or circuit manufacturing
 - Y10T29/49119—Brush
 
 
Landscapes
- Engineering & Computer Science (AREA)
 - Computer Hardware Design (AREA)
 - Microelectronics & Electronic Packaging (AREA)
 - Physics & Mathematics (AREA)
 - General Physics & Mathematics (AREA)
 - Theoretical Computer Science (AREA)
 - Condensed Matter Physics & Semiconductors (AREA)
 - Power Engineering (AREA)
 - Credit Cards Or The Like (AREA)
 - Coupling Device And Connection With Printed Circuit (AREA)
 
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| DE19512191.0 | 1995-03-31 | ||
| DE19512191A DE19512191C2 (de) | 1995-03-31 | 1995-03-31 | Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| KR19980703457A KR19980703457A (ko) | 1998-11-05 | 
| KR100417042B1 true KR100417042B1 (ko) | 2004-03-19 | 
Family
ID=7758497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| KR1019970706861A Expired - Fee Related KR100417042B1 (ko) | 1995-03-31 | 1996-03-15 | 카드형데이터매체와데이터매체용리드프레임 | 
Country Status (11)
| Country | Link | 
|---|---|
| US (1) | US6209790B1 (en:Method) | 
| EP (1) | EP0818024B1 (en:Method) | 
| KR (1) | KR100417042B1 (en:Method) | 
| CN (1) | CN1097249C (en:Method) | 
| AR (1) | AR001463A1 (en:Method) | 
| AT (1) | ATE176346T1 (en:Method) | 
| BR (1) | BR9607780A (en:Method) | 
| DE (2) | DE19512191C2 (en:Method) | 
| ES (1) | ES2128162T3 (en:Method) | 
| IN (1) | IN187268B (en:Method) | 
| WO (1) | WO1996030867A1 (en:Method) | 
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE19702532B4 (de) * | 1996-09-16 | 2005-12-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Chipkarte und Verfahren zum Erzeugen von Anschlußkontakten auf zwei Hauptoberflächen | 
| DE19708617C2 (de) | 1997-03-03 | 1999-02-04 | Siemens Ag | Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte | 
| US6651891B1 (en) * | 1997-11-04 | 2003-11-25 | Elke Zakel | Method for producing contactless chip cards and corresponding contactless chip card | 
| FR2803675B1 (fr) * | 2000-01-11 | 2002-03-29 | Sagem | Carte a puce avec capteur d'empreintes digitales | 
| US7107378B1 (en) * | 2000-09-01 | 2006-09-12 | Sandisk Corporation | Cooperative interconnection and operation of a non-volatile memory card and an input-output card | 
| DE10153217B4 (de) * | 2001-10-31 | 2007-01-18 | Heraeus Sensor Technology Gmbh | Manteldraht, insbesondere Anschlussdraht für elektrische Temperatursensoren | 
| US7440774B2 (en) * | 2002-04-08 | 2008-10-21 | Socket Mobile, Inc. | Wireless enabled memory module | 
| US7367503B2 (en) | 2002-11-13 | 2008-05-06 | Sandisk Corporation | Universal non-volatile memory card used with various different standard cards containing a memory controller | 
| DE10340129B4 (de) * | 2003-08-28 | 2006-07-13 | Infineon Technologies Ag | Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben | 
| US20060255160A1 (en) * | 2005-05-13 | 2006-11-16 | Otto Winkler | Memory card, the fabrication thereof and a mobile phone apparatus having a memory card | 
| DE102006039929A1 (de) | 2006-08-25 | 2008-03-06 | Printed Systems Gmbh | Verfahren und System zur elektrischen Kopplung eines Informationsträgers mit einem Kontaktelement | 
| USD729808S1 (en) | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface | 
| USD759022S1 (en) | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface | 
| US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O | 
| US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O | 
| USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface | 
| USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface | 
| USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface | 
| CN115430585A (zh) * | 2022-08-23 | 2022-12-06 | 西安微电子技术研究所 | 一种tsop引线自动三防涂覆保护模具装置 | 
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US4578573A (en) * | 1983-03-23 | 1986-03-25 | Datakey, Inc. | Portable electronic information devices and method of manufacture | 
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3702464A (en) * | 1971-05-04 | 1972-11-07 | Ibm | Information card | 
| DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein | 
| DE3111516A1 (de) * | 1981-03-24 | 1982-12-23 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | "ausweiskarte mit ic-baustein" | 
| US4501960A (en) * | 1981-06-22 | 1985-02-26 | Motorola, Inc. | Micropackage for identification card | 
| IT1212711B (it) * | 1983-03-09 | 1989-11-30 | Ates Componenti Elettron | Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione. | 
| US4727246A (en) * | 1984-08-31 | 1988-02-23 | Casio Computer Co., Ltd. | IC card | 
| US5203078A (en) * | 1985-07-17 | 1993-04-20 | Ibiden Co., Ltd. | Printed wiring board for IC cards | 
| JPS62107391A (ja) * | 1985-11-06 | 1987-05-18 | Nippon Texas Instr Kk | 情報記憶媒体 | 
| FR2590051B1 (fr) * | 1985-11-08 | 1991-05-17 | Eurotechnique Sa | Carte comportant un composant et micromodule a contacts de flanc | 
| US4996411A (en) * | 1986-07-24 | 1991-02-26 | Schlumberger Industries | Method of manufacturing a card having electronic memory and a card obtained by performing said method | 
| FR2631200B1 (fr) * | 1988-05-09 | 1991-02-08 | Bull Cp8 | Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit | 
| DE3935364C1 (en:Method) * | 1989-10-24 | 1990-08-23 | Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De | |
| US5049728A (en) * | 1990-04-04 | 1991-09-17 | Rovin George H | IC card system with removable IC modules | 
| JPH04168094A (ja) * | 1990-10-31 | 1992-06-16 | Mitsubishi Electric Corp | 携帯形半導体記憶装置 | 
| DE9100665U1 (de) * | 1991-01-21 | 1992-07-16 | TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen | Trägerelement für integrierte Halbleiter-Schaltkreise, insbesondere zum Einbau in Chip-Karten | 
| DE4105869C2 (de) * | 1991-02-25 | 2000-05-18 | Edgar Schneider | IC-Karte und Verfahren zu ihrer Herstellung | 
| US5281176A (en) * | 1991-07-22 | 1994-01-25 | Daido Tokushuko Kabushiki Kaisha | Contact member with composite sintered metal paste strip having 1-5 wt % carbon diffusion bonded therein | 
| CH686325A5 (de) * | 1992-11-27 | 1996-02-29 | Esec Sempac Sa | Elektronikmodul und Chip-Karte. | 
| JPH07117385A (ja) * | 1993-09-01 | 1995-05-09 | Toshiba Corp | 薄型icカードおよび薄型icカードの製造方法 | 
| DE4441931C1 (de) | 1994-04-27 | 1995-07-27 | Siemens Ag | Chipkarte | 
| US5925928A (en) * | 1994-09-30 | 1999-07-20 | Siemens Aktiengesellschaft | Data carrier card, assembly of at least two data carrier cards and method of accessing at least one of the data carrier cards | 
- 
        1995
        
- 1995-03-31 DE DE19512191A patent/DE19512191C2/de not_active Expired - Fee Related
 
 - 
        1996
        
- 1996-03-15 KR KR1019970706861A patent/KR100417042B1/ko not_active Expired - Fee Related
 - 1996-03-15 US US08/930,236 patent/US6209790B1/en not_active Expired - Lifetime
 - 1996-03-15 CN CN96194049A patent/CN1097249C/zh not_active Expired - Lifetime
 - 1996-03-15 DE DE59601229T patent/DE59601229D1/de not_active Expired - Lifetime
 - 1996-03-15 ES ES96905735T patent/ES2128162T3/es not_active Expired - Lifetime
 - 1996-03-15 BR BR9607780A patent/BR9607780A/pt not_active Application Discontinuation
 - 1996-03-15 EP EP96905735A patent/EP0818024B1/de not_active Expired - Lifetime
 - 1996-03-15 AT AT96905735T patent/ATE176346T1/de active
 - 1996-03-15 WO PCT/DE1996/000464 patent/WO1996030867A1/de active IP Right Grant
 - 1996-03-18 IN IN478CA1996 patent/IN187268B/en unknown
 - 1996-03-29 AR AR33596196A patent/AR001463A1/es unknown
 
 
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US4578573A (en) * | 1983-03-23 | 1986-03-25 | Datakey, Inc. | Portable electronic information devices and method of manufacture | 
Also Published As
| Publication number | Publication date | 
|---|---|
| ES2128162T3 (es) | 1999-05-01 | 
| DE19512191C2 (de) | 2000-03-09 | 
| CN1097249C (zh) | 2002-12-25 | 
| EP0818024B1 (de) | 1999-01-27 | 
| WO1996030867A1 (de) | 1996-10-03 | 
| BR9607780A (pt) | 1998-07-07 | 
| DE59601229D1 (de) | 1999-03-11 | 
| US6209790B1 (en) | 2001-04-03 | 
| KR19980703457A (ko) | 1998-11-05 | 
| EP0818024A1 (de) | 1998-01-14 | 
| ATE176346T1 (de) | 1999-02-15 | 
| DE19512191C1 (de) | 1996-08-08 | 
| CN1185221A (zh) | 1998-06-17 | 
| IN187268B (en:Method) | 2002-03-16 | 
| AR001463A1 (es) | 1997-10-22 | 
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Legal Events
| Date | Code | Title | Description | 
|---|---|---|---|
| PA0105 | International application | 
             St.27 status event code: A-0-1-A10-A15-nap-PA0105  | 
        |
| R17-X000 | Change to representative recorded | 
             St.27 status event code: A-3-3-R10-R17-oth-X000  | 
        |
| PG1501 | Laying open of application | 
             St.27 status event code: A-1-1-Q10-Q12-nap-PG1501  | 
        |
| PN2301 | Change of applicant | 
             St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301  | 
        |
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested | 
             St.27 status event code: A-2-2-P10-P11-nap-X000  | 
        |
| P13-X000 | Application amended | 
             St.27 status event code: A-2-2-P10-P13-nap-X000  | 
        |
| PA0201 | Request for examination | 
             St.27 status event code: A-1-2-D10-D11-exm-PA0201  | 
        |
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection | 
             St.27 status event code: A-1-2-D10-D21-exm-PE0902  | 
        |
| P11-X000 | Amendment of application requested | 
             St.27 status event code: A-2-2-P10-P11-nap-X000  | 
        |
| P13-X000 | Application amended | 
             St.27 status event code: A-2-2-P10-P13-nap-X000  | 
        |
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration | 
             St.27 status event code: A-1-2-D10-D22-exm-PE0701  | 
        |
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment | 
             St.27 status event code: A-2-4-F10-F11-exm-PR0701  | 
        |
| PR1002 | Payment of registration fee | 
             St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1  | 
        |
| PG1601 | Publication of registration | 
             St.27 status event code: A-4-4-Q10-Q13-nap-PG1601  | 
        |
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee | 
             St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20070120 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE  | 
        |
| PC1903 | Unpaid annual fee | 
             St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20070120  | 
        |
| R18-X000 | Changes to party contact information recorded | 
             St.27 status event code: A-5-5-R10-R18-oth-X000  | 
        |
| R18-X000 | Changes to party contact information recorded | 
             St.27 status event code: A-5-5-R10-R18-oth-X000  |