ES2128162T3 - Soporte de datos en forma de tarjeta. - Google Patents

Soporte de datos en forma de tarjeta.

Info

Publication number
ES2128162T3
ES2128162T3 ES96905735T ES96905735T ES2128162T3 ES 2128162 T3 ES2128162 T3 ES 2128162T3 ES 96905735 T ES96905735 T ES 96905735T ES 96905735 T ES96905735 T ES 96905735T ES 2128162 T3 ES2128162 T3 ES 2128162T3
Authority
ES
Spain
Prior art keywords
contacts
card
cards
requirements
data supports
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96905735T
Other languages
English (en)
Inventor
Detlef Houdeau
Josef Kirschbauer
Christoph Filser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Application granted granted Critical
Publication of ES2128162T3 publication Critical patent/ES2128162T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49119—Brush

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

LOS SOPORTES DE DATOS EN FORMA DE TARJETA SE CONOCEN COMO TARJETAS INTELIGENTES O TARJETAS CON MEMORIA. LA TARJETA INTELIGENTE EN SU VERSION DE TARJETA CON CHIP POSEE UN MODULO DE CHIP CON LOS CORRESPONDIENTES CONTACTOS DESLIZANTES. EN OTRAS TARJETAS CON MAS CAPACIDAD DE MEMORIA SE UTILIZAN CONTACTOS GALVANICOS, POR LO GENERAL DISPUESTOS HACIA FUERA EN UNA FILA A LO LARGO DE UN BORDE LONGITUDINAL. PARA MEJORAR LA ESTABILIDAD DEL CUERPO DE PLASTICO Y DE LOS CONTACTOS Y PARA FACILITAR EL PROCEDIMIENTO DE FABRICACION DE ESTOS SOPORTES DE DATOS, SE PROPONE EMPLEAR UN CUADRO DE MONTAJE, NECESARIO PARA LA SUJECION MECANICA Y EL CONTACTO ELECTRICO, QUE FORME UN TODO INTEGRAL O DE UNA SOLA PIEZA CON LOS CONTACTOS GALVANICOS O PARTES DE LOS MISMOS. SE INDICAN LAS VENTAJAS DE UTILIZAR LOS MATERIALES ELASTICOS ESPECIALES QUE CUMPLEN LOS REQUISITOS NECESARIOS EN LOS CONTACTOS ELASTICOS Y QUE SON CONOCIDOS EN LA TECNICA DE PRECISION, ASI COMO LOS REQUISITOS PARA EMPLEAR UN ELEMENTO SEMICONDUCTOR EN LA UNION MECANICA Y ELECTRICA.
ES96905735T 1995-03-31 1996-03-15 Soporte de datos en forma de tarjeta. Expired - Lifetime ES2128162T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19512191A DE19512191C2 (de) 1995-03-31 1995-03-31 Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger

Publications (1)

Publication Number Publication Date
ES2128162T3 true ES2128162T3 (es) 1999-05-01

Family

ID=7758497

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96905735T Expired - Lifetime ES2128162T3 (es) 1995-03-31 1996-03-15 Soporte de datos en forma de tarjeta.

Country Status (11)

Country Link
US (1) US6209790B1 (es)
EP (1) EP0818024B1 (es)
KR (1) KR100417042B1 (es)
CN (1) CN1097249C (es)
AR (1) AR001463A1 (es)
AT (1) ATE176346T1 (es)
BR (1) BR9607780A (es)
DE (2) DE19512191C2 (es)
ES (1) ES2128162T3 (es)
IN (1) IN187268B (es)
WO (1) WO1996030867A1 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19702532B4 (de) * 1996-09-16 2005-12-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chipkarte und Verfahren zum Erzeugen von Anschlußkontakten auf zwei Hauptoberflächen
DE19708617C2 (de) * 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
JP3687783B2 (ja) * 1997-11-04 2005-08-24 エルケ ツァケル コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード
FR2803675B1 (fr) * 2000-01-11 2002-03-29 Sagem Carte a puce avec capteur d'empreintes digitales
US7107378B1 (en) * 2000-09-01 2006-09-12 Sandisk Corporation Cooperative interconnection and operation of a non-volatile memory card and an input-output card
DE10153217B4 (de) * 2001-10-31 2007-01-18 Heraeus Sensor Technology Gmbh Manteldraht, insbesondere Anschlussdraht für elektrische Temperatursensoren
US7440774B2 (en) 2002-04-08 2008-10-21 Socket Mobile, Inc. Wireless enabled memory module
US7367503B2 (en) * 2002-11-13 2008-05-06 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
DE10340129B4 (de) * 2003-08-28 2006-07-13 Infineon Technologies Ag Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben
US20060255160A1 (en) * 2005-05-13 2006-11-16 Otto Winkler Memory card, the fabrication thereof and a mobile phone apparatus having a memory card
DE102006039929A1 (de) 2006-08-25 2008-03-06 Printed Systems Gmbh Verfahren und System zur elektrischen Kopplung eines Informationsträgers mit einem Kontaktelement
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
CN115430585A (zh) * 2022-08-23 2022-12-06 西安微电子技术研究所 一种tsop引线自动三防涂覆保护模具装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3111516A1 (de) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"
US4501960A (en) * 1981-06-22 1985-02-26 Motorola, Inc. Micropackage for identification card
IT1212711B (it) * 1983-03-09 1989-11-30 Ates Componenti Elettron Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
US4578573A (en) * 1983-03-23 1986-03-25 Datakey, Inc. Portable electronic information devices and method of manufacture
US4727246A (en) * 1984-08-31 1988-02-23 Casio Computer Co., Ltd. IC card
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards
JPS62107391A (ja) * 1985-11-06 1987-05-18 Nippon Texas Instr Kk 情報記憶媒体
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
FR2631200B1 (fr) * 1988-05-09 1991-02-08 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
DE3935364C1 (es) * 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De
US5049728A (en) * 1990-04-04 1991-09-17 Rovin George H IC card system with removable IC modules
JPH04168094A (ja) * 1990-10-31 1992-06-16 Mitsubishi Electric Corp 携帯形半導体記憶装置
DE9100665U1 (de) 1991-01-21 1992-07-16 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Trägerelement für integrierte Halbleiter-Schaltkreise, insbesondere zum Einbau in Chip-Karten
DE4105869C2 (de) * 1991-02-25 2000-05-18 Edgar Schneider IC-Karte und Verfahren zu ihrer Herstellung
US5281176A (en) * 1991-07-22 1994-01-25 Daido Tokushuko Kabushiki Kaisha Contact member with composite sintered metal paste strip having 1-5 wt % carbon diffusion bonded therein
CH686325A5 (de) 1992-11-27 1996-02-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
JPH07117385A (ja) * 1993-09-01 1995-05-09 Toshiba Corp 薄型ｉｃカードおよび薄型ｉｃカードの製造方法
DE4441931C1 (de) * 1994-04-27 1995-07-27 Siemens Ag Chipkarte
US5925928A (en) * 1994-09-30 1999-07-20 Siemens Aktiengesellschaft Data carrier card, assembly of at least two data carrier cards and method of accessing at least one of the data carrier cards

Also Published As

Publication number Publication date
DE19512191C2 (de) 2000-03-09
DE59601229D1 (de) 1999-03-11
IN187268B (es) 2002-03-16
AR001463A1 (es) 1997-10-22
DE19512191C1 (de) 1996-08-08
CN1185221A (zh) 1998-06-17
ATE176346T1 (de) 1999-02-15
EP0818024A1 (de) 1998-01-14
KR19980703457A (ko) 1998-11-05
CN1097249C (zh) 2002-12-25
EP0818024B1 (de) 1999-01-27
BR9607780A (pt) 1998-07-07
WO1996030867A1 (de) 1996-10-03
KR100417042B1 (ko) 2004-03-19
US6209790B1 (en) 2001-04-03

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