AR001463A1 - Soporte de datos en forma de tarjeta y un bastidorde guia para su empleo en un soporte de datos de tal tipo. - Google Patents

Soporte de datos en forma de tarjeta y un bastidorde guia para su empleo en un soporte de datos de tal tipo.

Info

Publication number
AR001463A1
AR001463A1 AR33596196A AR33596196A AR001463A1 AR 001463 A1 AR001463 A1 AR 001463A1 AR 33596196 A AR33596196 A AR 33596196A AR 33596196 A AR33596196 A AR 33596196A AR 001463 A1 AR001463 A1 AR 001463A1
Authority
AR
Argentina
Prior art keywords
card
contacts
data carrier
guide frame
requirement
Prior art date
Application number
AR33596196A
Other languages
English (en)
Inventor
Detlef Dr Houdeau
Josef Kirschbauer
Christoph Filser
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of AR001463A1 publication Critical patent/AR001463A1/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49119—Brush

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Como soportes de datos en forma de tarjeta son conocidas, por ejemplo, la Smart Card o la Memory Card. En su realización como tarjeta chip, la Smart Cardpresenta un módulo chip con sus respectivos contactos deslizantes. En otras tarjetas con alta capacidad de memoria se emplean generalmente contactosgalvánicos alineados en un borde longitudinal para la conexión hacia el exterior. A los fines de mejorar la estabilidad del cuerpo de materialsintético y de los contactos y de simplificar el procedimiento de elaboración de tal tipo de soporte de datos, se sugiere incorporar un bastidor de guíanecesario para el sostén mecánico y la conexión eléctrica, el que está conformado integralmente o en una sola pieza con los contactos galvánicos opartes de ellos. Se dan a conocer ventajosamente materiales de construcción elásticos especiales, que cumplen tanto con la exigencia para los contactoselásticos, como son conocidos en la mecánica de precisión, como las exigenciapara su empleo en conexiones eléctricas y mecánicas en un elementosemiconductor.
AR33596196A 1995-03-31 1996-03-29 Soporte de datos en forma de tarjeta y un bastidorde guia para su empleo en un soporte de datos de tal tipo. AR001463A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19512191A DE19512191C2 (de) 1995-03-31 1995-03-31 Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger

Publications (1)

Publication Number Publication Date
AR001463A1 true AR001463A1 (es) 1997-10-22

Family

ID=7758497

Family Applications (1)

Application Number Title Priority Date Filing Date
AR33596196A AR001463A1 (es) 1995-03-31 1996-03-29 Soporte de datos en forma de tarjeta y un bastidorde guia para su empleo en un soporte de datos de tal tipo.

Country Status (11)

Country Link
US (1) US6209790B1 (es)
EP (1) EP0818024B1 (es)
KR (1) KR100417042B1 (es)
CN (1) CN1097249C (es)
AR (1) AR001463A1 (es)
AT (1) ATE176346T1 (es)
BR (1) BR9607780A (es)
DE (2) DE19512191C2 (es)
ES (1) ES2128162T3 (es)
IN (1) IN187268B (es)
WO (1) WO1996030867A1 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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DE19702532B4 (de) * 1996-09-16 2005-12-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chipkarte und Verfahren zum Erzeugen von Anschlußkontakten auf zwei Hauptoberflächen
DE19708617C2 (de) * 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
US6651891B1 (en) * 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card
FR2803675B1 (fr) * 2000-01-11 2002-03-29 Sagem Carte a puce avec capteur d'empreintes digitales
US7107378B1 (en) * 2000-09-01 2006-09-12 Sandisk Corporation Cooperative interconnection and operation of a non-volatile memory card and an input-output card
DE10153217B4 (de) * 2001-10-31 2007-01-18 Heraeus Sensor Technology Gmbh Manteldraht, insbesondere Anschlussdraht für elektrische Temperatursensoren
EP1540448A2 (en) 2002-04-08 2005-06-15 Socket Communications, Inc. Wireless enabled memory module
US7367503B2 (en) * 2002-11-13 2008-05-06 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
DE10340129B4 (de) * 2003-08-28 2006-07-13 Infineon Technologies Ag Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben
US20060255160A1 (en) * 2005-05-13 2006-11-16 Otto Winkler Memory card, the fabrication thereof and a mobile phone apparatus having a memory card
DE102006039929A1 (de) 2006-08-25 2008-03-06 Printed Systems Gmbh Verfahren und System zur elektrischen Kopplung eines Informationsträgers mit einem Kontaktelement
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
CN115430585A (zh) * 2022-08-23 2022-12-06 西安微电子技术研究所 一种tsop引线自动三防涂覆保护模具装置

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US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3111516A1 (de) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"
US4501960A (en) * 1981-06-22 1985-02-26 Motorola, Inc. Micropackage for identification card
IT1212711B (it) * 1983-03-09 1989-11-30 Ates Componenti Elettron Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
US4578573A (en) * 1983-03-23 1986-03-25 Datakey, Inc. Portable electronic information devices and method of manufacture
US4727246A (en) * 1984-08-31 1988-02-23 Casio Computer Co., Ltd. IC card
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards
JPS62107391A (ja) * 1985-11-06 1987-05-18 Nippon Texas Instr Kk 情報記憶媒体
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
FR2631200B1 (fr) * 1988-05-09 1991-02-08 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
DE3935364C1 (es) * 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De
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DE4105869C2 (de) * 1991-02-25 2000-05-18 Edgar Schneider IC-Karte und Verfahren zu ihrer Herstellung
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Also Published As

Publication number Publication date
KR19980703457A (ko) 1998-11-05
BR9607780A (pt) 1998-07-07
ES2128162T3 (es) 1999-05-01
WO1996030867A1 (de) 1996-10-03
ATE176346T1 (de) 1999-02-15
CN1097249C (zh) 2002-12-25
EP0818024B1 (de) 1999-01-27
CN1185221A (zh) 1998-06-17
US6209790B1 (en) 2001-04-03
DE19512191C1 (de) 1996-08-08
EP0818024A1 (de) 1998-01-14
KR100417042B1 (ko) 2004-03-19
DE59601229D1 (de) 1999-03-11
DE19512191C2 (de) 2000-03-09
IN187268B (es) 2002-03-16

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