KR100400488B1 - 냉벽화학기상증착용방법및장치 - Google Patents

냉벽화학기상증착용방법및장치 Download PDF

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Publication number
KR100400488B1
KR100400488B1 KR10-1998-0701159A KR19980701159A KR100400488B1 KR 100400488 B1 KR100400488 B1 KR 100400488B1 KR 19980701159 A KR19980701159 A KR 19980701159A KR 100400488 B1 KR100400488 B1 KR 100400488B1
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KR
South Korea
Prior art keywords
gas
heat
plate
wafer
window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-1998-0701159A
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English (en)
Korean (ko)
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KR19990037680A (ko
Inventor
다니엘 엘. 브럴스
로버트 씨. 쿡
Original Assignee
토렉스 이퀴프먼트 코포레이션
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Publication of KR19990037680A publication Critical patent/KR19990037680A/ko
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Publication of KR100400488B1 publication Critical patent/KR100400488B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45587—Mechanical means for changing the gas flow
    • C23C16/45589—Movable means, e.g. fans
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)
KR10-1998-0701159A 1995-08-18 1996-08-14 냉벽화학기상증착용방법및장치 Expired - Fee Related KR100400488B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8/517,045 1995-08-18
US08/517,045 US5551985A (en) 1995-08-18 1995-08-18 Method and apparatus for cold wall chemical vapor deposition
US08/517,045 1995-08-18

Publications (2)

Publication Number Publication Date
KR19990037680A KR19990037680A (ko) 1999-05-25
KR100400488B1 true KR100400488B1 (ko) 2003-12-18

Family

ID=24058153

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1998-0701159A Expired - Fee Related KR100400488B1 (ko) 1995-08-18 1996-08-14 냉벽화학기상증착용방법및장치

Country Status (7)

Country Link
US (2) US5551985A (https=)
EP (1) EP0850323B1 (https=)
JP (1) JP4108748B2 (https=)
KR (1) KR100400488B1 (https=)
AU (1) AU6843096A (https=)
DE (1) DE69634539T2 (https=)
WO (1) WO1997007259A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150074165A (ko) * 2012-10-26 2015-07-01 어플라이드 머티어리얼스, 인코포레이티드 커스터마이즈 가능한 유동 주입을 구비하는 에피택셜 챔버
WO2026049312A1 (ko) * 2024-08-30 2026-03-05 피에스케이홀딩스 (주) 기판 처리 장치

Families Citing this family (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6086680A (en) * 1995-08-22 2000-07-11 Asm America, Inc. Low-mass susceptor
US6113702A (en) 1995-09-01 2000-09-05 Asm America, Inc. Wafer support system
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
TW356554B (en) * 1995-10-23 1999-04-21 Watkins Johnson Co Gas injection system for semiconductor processing
TW315493B (en) * 1996-02-28 1997-09-11 Tokyo Electron Co Ltd Heating apparatus and heat treatment apparatus
US6072160A (en) * 1996-06-03 2000-06-06 Applied Materials, Inc. Method and apparatus for enhancing the efficiency of radiant energy sources used in rapid thermal processing of substrates by energy reflection
US6183565B1 (en) 1997-07-08 2001-02-06 Asm International N.V Method and apparatus for supporting a semiconductor wafer during processing
US6108490A (en) * 1996-07-11 2000-08-22 Cvc, Inc. Multizone illuminator for rapid thermal processing with improved spatial resolution
US5937142A (en) * 1996-07-11 1999-08-10 Cvc Products, Inc. Multi-zone illuminator for rapid thermal processing
US5951896A (en) * 1996-12-04 1999-09-14 Micro C Technologies, Inc. Rapid thermal processing heater technology and method of use
US5831249A (en) * 1997-01-29 1998-11-03 Advanced Micro Devices, Inc. Secondary measurement of rapid thermal annealer temperature
DE19711702C1 (de) * 1997-03-20 1998-06-25 Siemens Ag Anordnung zur Bearbeitung einer Substratscheibe und Verfahren zu deren Betrieb
US5960158A (en) 1997-07-11 1999-09-28 Ag Associates Apparatus and method for filtering light in a thermal processing chamber
US5944422A (en) * 1997-07-11 1999-08-31 A. G. Associates (Israel) Ltd. Apparatus for measuring the processing temperature of workpieces particularly semiconductor wafers
US5870526A (en) * 1997-07-17 1999-02-09 Steag-Ast Inflatable elastomeric element for rapid thermal processing (RTP) system
US6235652B1 (en) * 1997-08-11 2001-05-22 Torrex Equipment Corporation High rate silicon dioxide deposition at low pressures
US6352593B1 (en) 1997-08-11 2002-03-05 Torrex Equipment Corp. Mini-batch process chamber
US6352594B2 (en) 1997-08-11 2002-03-05 Torrex Method and apparatus for improved chemical vapor deposition processes using tunable temperature controlled gas injectors
US7393561B2 (en) * 1997-08-11 2008-07-01 Applied Materials, Inc. Method and apparatus for layer by layer deposition of thin films
US20030049372A1 (en) * 1997-08-11 2003-03-13 Cook Robert C. High rate deposition at low pressures in a small batch reactor
US6167837B1 (en) * 1998-01-15 2001-01-02 Torrex Equipment Corp. Apparatus and method for plasma enhanced chemical vapor deposition (PECVD) in a single wafer reactor
US6287635B1 (en) * 1997-08-11 2001-09-11 Torrex Equipment Corp. High rate silicon deposition method at low pressures
US6780464B2 (en) 1997-08-11 2004-08-24 Torrex Equipment Thermal gradient enhanced CVD deposition at low pressure
US6165273A (en) * 1997-10-21 2000-12-26 Fsi International Inc. Equipment for UV wafer heating and photochemistry
US5965047A (en) * 1997-10-24 1999-10-12 Steag Ast Rapid thermal processing (RTP) system with rotating substrate
DE69813014T2 (de) * 1997-11-03 2004-02-12 Asm America Inc., Phoenix Verbesserte kleinmassige waferhaleeinrichtung
EP1036407A1 (en) * 1997-11-03 2000-09-20 ASM America, Inc. Method of processing wafers with low mass support
US6833280B1 (en) 1998-03-13 2004-12-21 Micron Technology, Inc. Process for fabricating films of uniform properties on semiconductor devices
US6596086B1 (en) 1998-04-28 2003-07-22 Shin-Etsu Handotai Co., Ltd. Apparatus for thin film growth
US5970214A (en) 1998-05-14 1999-10-19 Ag Associates Heating device for semiconductor wafers
US5930456A (en) 1998-05-14 1999-07-27 Ag Associates Heating device for semiconductor wafers
US6210484B1 (en) 1998-09-09 2001-04-03 Steag Rtp Systems, Inc. Heating device containing a multi-lamp cone for heating semiconductor wafers
PE20001145A1 (es) * 1998-09-10 2000-10-25 American Cyanamid Co Mezclas fungicidas
ATE368756T1 (de) * 1998-09-16 2007-08-15 Applied Materials Inc Verfahren zum aufbringen von silizium mit hoher rate bei niedrigen druck
JP2000138168A (ja) * 1998-10-29 2000-05-16 Shin Etsu Handotai Co Ltd 半導体ウェーハ及び気相成長装置
US6319569B1 (en) 1998-11-30 2001-11-20 Howmet Research Corporation Method of controlling vapor deposition substrate temperature
US6771895B2 (en) 1999-01-06 2004-08-03 Mattson Technology, Inc. Heating device for heating semiconductor wafers in thermal processing chambers
US6281141B1 (en) 1999-02-08 2001-08-28 Steag Rtp Systems, Inc. Process for forming thin dielectric layers in semiconductor devices
KR100328820B1 (ko) * 1999-02-25 2002-03-14 박종섭 화학기상증착 장비의 가스분사장치
EP1226286A4 (en) * 1999-06-24 2007-08-15 Prasad Narhar Gadgil CHEMICAL DEPOSITION DEVICE IN VAPOR PHASE ATOMIC LAYERS
US6812157B1 (en) * 1999-06-24 2004-11-02 Prasad Narhar Gadgil Apparatus for atomic layer chemical vapor deposition
US6359263B2 (en) * 1999-09-03 2002-03-19 Steag Rtp Systems, Inc. System for controlling the temperature of a reflective substrate during rapid heating
US6259072B1 (en) * 1999-11-09 2001-07-10 Axcelis Technologies, Inc. Zone controlled radiant heating system utilizing focused reflector
TW469491B (en) 1999-11-18 2001-12-21 Tokyo Electron Ltd Silylation treatment unit and method
US6472643B1 (en) * 2000-03-07 2002-10-29 Silicon Valley Group, Inc. Substrate thermal management system
US6414276B1 (en) 2000-03-07 2002-07-02 Silicon Valley Group, Inc. Method for substrate thermal management
US6310323B1 (en) 2000-03-24 2001-10-30 Micro C Technologies, Inc. Water cooled support for lamps and rapid thermal processing chamber
US6455821B1 (en) * 2000-08-17 2002-09-24 Nikon Corporation System and method to control temperature of an article
EP1317766A1 (en) * 2001-02-12 2003-06-11 Hitachi Kokusai Electric Inc. Ultra fast rapid thermal processing chamber and method of use
US6902622B2 (en) * 2001-04-12 2005-06-07 Mattson Technology, Inc. Systems and methods for epitaxially depositing films on a semiconductor substrate
JP2002353184A (ja) * 2001-05-28 2002-12-06 Tokyo Electron Ltd 基板処理方法及び基板処理装置
US20030121898A1 (en) * 2001-11-26 2003-07-03 Tom Kane Heated vacuum support apparatus
US6776849B2 (en) * 2002-03-15 2004-08-17 Asm America, Inc. Wafer holder with peripheral lift ring
US20030173346A1 (en) * 2002-03-18 2003-09-18 Renken Wayne Glenn System and method for heating and cooling wafer at accelerated rates
US6861321B2 (en) 2002-04-05 2005-03-01 Asm America, Inc. Method of loading a wafer onto a wafer holder to reduce thermal shock
US20040129212A1 (en) * 2002-05-20 2004-07-08 Gadgil Pradad N. Apparatus and method for delivery of reactive chemical precursors to the surface to be treated
US20050170314A1 (en) * 2002-11-27 2005-08-04 Richard Golden Dental pliers design with offsetting jaw and pad elements for assisting in removing upper and lower teeth and method for removing teeth utilizing the dental plier design
US6709267B1 (en) 2002-12-27 2004-03-23 Asm America, Inc. Substrate holder with deep annular groove to prevent edge heat loss
US7611587B2 (en) * 2003-05-16 2009-11-03 Chow Peter P Thin-film deposition evaporator
US20040255442A1 (en) * 2003-06-19 2004-12-23 Mcdiarmid James Methods and apparatus for processing workpieces
US20060060920A1 (en) * 2004-09-17 2006-03-23 Applied Materials, Inc. Poly-silicon-germanium gate stack and method for forming the same
US20060084283A1 (en) * 2004-10-20 2006-04-20 Paranjpe Ajit P Low temperature sin deposition methods
US7972441B2 (en) * 2005-04-05 2011-07-05 Applied Materials, Inc. Thermal oxidation of silicon using ozone
JP4973150B2 (ja) * 2006-11-27 2012-07-11 東京エレクトロン株式会社 ガス導入機構及び被処理体の処理装置
JP4788610B2 (ja) * 2007-01-17 2011-10-05 東京エレクトロン株式会社 加熱装置、塗布、現像装置、加熱方法及び記憶媒体
US20080296258A1 (en) * 2007-02-08 2008-12-04 Elliott David J Plenum reactor system
US20090194024A1 (en) * 2008-01-31 2009-08-06 Applied Materials, Inc. Cvd apparatus
US8801857B2 (en) 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
US20120073503A1 (en) * 2010-09-24 2012-03-29 Juno Yu-Ting Huang Processing systems and apparatuses having a shaft cover
US20120097222A1 (en) * 2010-10-26 2012-04-26 Alliance For Sustainable Energy, Llc Transparent conducting oxide films with improved properties
CN102485935B (zh) * 2010-12-06 2013-11-13 北京北方微电子基地设备工艺研究中心有限责任公司 均热板及应用该均热板的基片处理设备
US9960059B2 (en) * 2012-03-30 2018-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. Honeycomb heaters for integrated circuit manufacturing
US9239192B2 (en) * 2013-02-20 2016-01-19 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate rapid thermal heating system and methods
KR102063607B1 (ko) * 2013-03-12 2020-02-11 삼성전자주식회사 웨이퍼 처리 장치
US20150083046A1 (en) * 2013-09-26 2015-03-26 Applied Materials, Inc. Carbon fiber ring susceptor
US11414759B2 (en) 2013-11-29 2022-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for supplying process gas into wafer process apparatus
WO2016200568A1 (en) * 2015-06-12 2016-12-15 Applied Materials, Inc. An injector for semiconductor epitaxy growth
KR102350588B1 (ko) * 2015-07-07 2022-01-14 삼성전자 주식회사 인젝터를 갖는 박막 형성 장치
DE102015220127A1 (de) * 2015-10-15 2017-04-20 Wacker Chemie Ag Vorrichtung zur Isolierung und Abdichtung von Elektrodenhalterungen in CVD Reaktoren
EP3184666B1 (en) * 2015-12-23 2018-06-13 Singulus Technologies AG System and method for gas phase deposition
US20190177851A1 (en) 2016-08-09 2019-06-13 Singulus Technologies Ag System and method for gas phase deposition
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
USD914620S1 (en) 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
CN111446185A (zh) 2019-01-17 2020-07-24 Asm Ip 控股有限公司 通风基座
TWI845682B (zh) 2019-05-22 2024-06-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 工件基座主體
FI129577B (en) * 2019-06-28 2022-05-13 Beneq Oy Atomic layer growth equipment
US11764101B2 (en) 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
TWI888578B (zh) 2020-06-23 2025-07-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基座及反應腔室
USD1031676S1 (en) 2020-12-04 2024-06-18 Asm Ip Holding B.V. Combined susceptor, support, and lift system
US12456614B2 (en) 2022-05-27 2025-10-28 Applied Materials, Inc. Process kits and related methods for processing chambers to facilitate deposition process adjustability
US12221696B2 (en) 2022-05-27 2025-02-11 Applied Materials, Inc. Process kits and related methods for processing chambers to facilitate deposition process adjustability

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3830194A (en) * 1972-09-28 1974-08-20 Applied Materials Tech Susceptor support structure and docking assembly
GB1523991A (en) * 1976-04-13 1978-09-06 Bfg Glassgroup Coating of glass
JPS59928A (ja) * 1982-06-25 1984-01-06 Ushio Inc 光加熱装置
JPS5959876A (ja) * 1982-09-30 1984-04-05 Ushio Inc 光照射炉の運転方法
JPS59222922A (ja) * 1983-06-01 1984-12-14 Nippon Telegr & Teleph Corp <Ntt> 気相成長装置
JPH0830273B2 (ja) * 1986-07-10 1996-03-27 株式会社東芝 薄膜形成方法及び装置
US5000113A (en) * 1986-12-19 1991-03-19 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
US5198034A (en) * 1987-03-31 1993-03-30 Epsilon Technology, Inc. Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
US4836138A (en) * 1987-06-18 1989-06-06 Epsilon Technology, Inc. Heating system for reaction chamber of chemical vapor deposition equipment
US4828224A (en) * 1987-10-15 1989-05-09 Epsilon Technology, Inc. Chemical vapor deposition system
US4854263B1 (en) * 1987-08-14 1997-06-17 Applied Materials Inc Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films
KR0155545B1 (ko) * 1988-06-27 1998-12-01 고다까 토시오 기판의 열처리 장치
US4920918A (en) * 1989-04-18 1990-05-01 Applied Materials, Inc. Pressure-resistant thermal reactor system for semiconductor processing
US5156820A (en) * 1989-05-15 1992-10-20 Rapro Technology, Inc. Reaction chamber with controlled radiant energy heating and distributed reactant flow
US4993358A (en) * 1989-07-28 1991-02-19 Watkins-Johnson Company Chemical vapor deposition reactor and method of operation
US5155336A (en) * 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
KR940011708B1 (ko) * 1990-04-09 1994-12-23 니찌덴 아네루바 가부시끼가이샤 기판온도제어기구
US5179677A (en) * 1990-08-16 1993-01-12 Applied Materials, Inc. Apparatus and method for substrate heating utilizing various infrared means to achieve uniform intensity
US5269847A (en) * 1990-08-23 1993-12-14 Applied Materials, Inc. Variable rate distribution gas flow reaction chamber
US5085887A (en) * 1990-09-07 1992-02-04 Applied Materials, Inc. Wafer reactor vessel window with pressure-thermal compensation
US5148714A (en) * 1990-10-24 1992-09-22 Ag Processing Technology, Inc. Rotary/linear actuator for closed chamber, and reaction chamber utilizing same
JPH04243122A (ja) * 1991-01-18 1992-08-31 Fujitsu Ltd 化学気相成長装置
US5446825A (en) * 1991-04-24 1995-08-29 Texas Instruments Incorporated High performance multi-zone illuminator module for semiconductor wafer processing
JPH0513355A (ja) * 1991-07-05 1993-01-22 Hitachi Ltd ランプアニール装置
US5215588A (en) * 1992-01-17 1993-06-01 Amtech Systems, Inc. Photo-CVD system
KR100241290B1 (ko) * 1992-07-09 2000-03-02 야마시타 히데나리 반도체 처리장치
DE4306398A1 (de) * 1993-03-02 1994-09-08 Leybold Ag Vorrichtung zum Erwärmen eines Substrates
US5305417A (en) * 1993-03-26 1994-04-19 Texas Instruments Incorporated Apparatus and method for determining wafer temperature using pyrometry
JP3380988B2 (ja) * 1993-04-21 2003-02-24 東京エレクトロン株式会社 熱処理装置
US5444815A (en) * 1993-12-16 1995-08-22 Texas Instruments Incorporated Multi-zone lamp interference correction system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150074165A (ko) * 2012-10-26 2015-07-01 어플라이드 머티어리얼스, 인코포레이티드 커스터마이즈 가능한 유동 주입을 구비하는 에피택셜 챔버
KR102135229B1 (ko) * 2012-10-26 2020-07-17 어플라이드 머티어리얼스, 인코포레이티드 커스터마이즈 가능한 유동 주입을 구비하는 에피택셜 챔버
WO2026049312A1 (ko) * 2024-08-30 2026-03-05 피에스케이홀딩스 (주) 기판 처리 장치

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KR19990037680A (ko) 1999-05-25
WO1997007259A1 (en) 1997-02-27
EP0850323B1 (en) 2005-03-30
USRE36957E (en) 2000-11-21
EP0850323A4 (en) 2000-10-18
JP4108748B2 (ja) 2008-06-25
DE69634539D1 (de) 2005-05-04
EP0850323A1 (en) 1998-07-01
US5551985A (en) 1996-09-03
AU6843096A (en) 1997-03-12
DE69634539T2 (de) 2006-03-30

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