KR100394123B1 - 열융착성을가진신규공중합체및그분립체및그필름및적층단열재및전자모듈및콘덴서및그제조방법 - Google Patents

열융착성을가진신규공중합체및그분립체및그필름및적층단열재및전자모듈및콘덴서및그제조방법 Download PDF

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KR100394123B1
KR100394123B1 KR1019960704768A KR19960704768A KR100394123B1 KR 100394123 B1 KR100394123 B1 KR 100394123B1 KR 1019960704768 A KR1019960704768 A KR 1019960704768A KR 19960704768 A KR19960704768 A KR 19960704768A KR 100394123 B1 KR100394123 B1 KR 100394123B1
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South Korea
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film
heat
laminated
thermoplastic polyimide
resin
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Expired - Lifetime
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KR1019960704768A
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English (en)
Korean (ko)
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KR970701226A (ko
Inventor
히로유키 후루타니
나오키 하세
준야 이다
요시후미 오카모토
히토시 노지리
신지 이노우에
히로사쿠 나가노
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가네가후치 가가쿠고교 가부시키가이샤
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Priority claimed from JP7116402A external-priority patent/JPH08283692A/ja
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Publication of KR970701226A publication Critical patent/KR970701226A/ko
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    • H—ELECTRICITY
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    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/30—Extrusion nozzles or dies
    • C—CHEMISTRY; METALLURGY
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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    • C08G73/1089—Polyisoimides
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
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    • H01G4/06—Solid dielectrics
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
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    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H10W72/523—Multilayered bond wires, e.g. having a coating concentric around a core characterised by the structures of the outermost layers, e.g. multilayered coatings
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    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/2942—Plural coatings
    • Y10T428/2949—Glass, ceramic or metal oxide in coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1019960704768A 1995-01-11 1996-01-11 열융착성을가진신규공중합체및그분립체및그필름및적층단열재및전자모듈및콘덴서및그제조방법 Expired - Lifetime KR100394123B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP95-19658 1995-01-11
JP1965895 1995-01-11
JP7116402A JPH08283692A (ja) 1995-04-17 1995-04-17 電子モジュール
JP95-116402 1995-04-17

Publications (2)

Publication Number Publication Date
KR970701226A KR970701226A (ko) 1997-03-17
KR100394123B1 true KR100394123B1 (ko) 2003-12-31

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KR1019960704768A Expired - Lifetime KR100394123B1 (ko) 1995-01-11 1996-01-11 열융착성을가진신규공중합체및그분립체및그필름및적층단열재및전자모듈및콘덴서및그제조방법

Country Status (6)

Country Link
US (1) US5932345A (https=)
EP (1) EP0775716B1 (https=)
KR (1) KR100394123B1 (https=)
DE (1) DE69603442T2 (https=)
TW (2) TW384297B (https=)
WO (1) WO1996021693A1 (https=)

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KR100333452B1 (ko) 1994-12-26 2002-04-18 이사오 우치가사키 필름 형상의 유기 다이본딩재 및 이를 이용한 반도체 장치
TW310481B (https=) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6407461B1 (en) * 1997-06-27 2002-06-18 International Business Machines Corporation Injection molded integrated circuit chip assembly
US6166433A (en) * 1998-03-26 2000-12-26 Fujitsu Limited Resin molded semiconductor device and method of manufacturing semiconductor package
JP4743732B2 (ja) * 1999-04-09 2011-08-10 株式会社カネカ 線材被覆用接着性積層フィルム
US6700185B1 (en) * 1999-11-10 2004-03-02 Hitachi Chemical Co., Ltd. Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device
WO2001057112A1 (en) * 2000-02-01 2001-08-09 Nippon Steel Chemical Co., Ltd. Adhesive polyimide resin and adhesive laminate
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TW384297B (en) 2000-03-11
US5932345A (en) 1999-08-03
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