KR100321354B1 - 건식플럭싱작업을수반하는웨이브솔더링방법및장치 - Google Patents

건식플럭싱작업을수반하는웨이브솔더링방법및장치 Download PDF

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Publication number
KR100321354B1
KR100321354B1 KR1019960017398A KR19960017398A KR100321354B1 KR 100321354 B1 KR100321354 B1 KR 100321354B1 KR 1019960017398 A KR1019960017398 A KR 1019960017398A KR 19960017398 A KR19960017398 A KR 19960017398A KR 100321354 B1 KR100321354 B1 KR 100321354B1
Authority
KR
South Korea
Prior art keywords
gas
circuit
gas mixture
devices
initial
Prior art date
Application number
KR1019960017398A
Other languages
English (en)
Korean (ko)
Other versions
KR970003390A (ko
Inventor
쌩드젱그르 띠에리
라비아 스떼팡
뽀띠에 니꼴라
Original Assignee
쉬에르 피에르
레르 리뀌드, 소시에떼 아노님 뿌르 레뛰드 에 렉스쁠로와따시옹 데 프로세데 죠르쥬 끌로드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쉬에르 피에르, 레르 리뀌드, 소시에떼 아노님 뿌르 레뛰드 에 렉스쁠로와따시옹 데 프로세데 죠르쥬 끌로드 filed Critical 쉬에르 피에르
Publication of KR970003390A publication Critical patent/KR970003390A/ko
Application granted granted Critical
Publication of KR100321354B1 publication Critical patent/KR100321354B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Arc Welding In General (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Nonmetallic Welding Materials (AREA)
KR1019960017398A 1995-06-09 1996-05-22 건식플럭싱작업을수반하는웨이브솔더링방법및장치 KR100321354B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9506818A FR2735053B1 (fr) 1995-06-09 1995-06-09 Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche
FR9506818 1995-06-09

Publications (2)

Publication Number Publication Date
KR970003390A KR970003390A (ko) 1997-01-28
KR100321354B1 true KR100321354B1 (ko) 2002-07-06

Family

ID=9479786

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017398A KR100321354B1 (ko) 1995-06-09 1996-05-22 건식플럭싱작업을수반하는웨이브솔더링방법및장치

Country Status (18)

Country Link
US (1) US5722581A (da)
EP (1) EP0747160B1 (da)
JP (1) JP3313972B2 (da)
KR (1) KR100321354B1 (da)
CN (1) CN1095316C (da)
AR (1) AR002312A1 (da)
AU (1) AU712613B2 (da)
BR (1) BR9602725A (da)
CA (1) CA2178465C (da)
DE (1) DE69603418T2 (da)
DK (1) DK0747160T3 (da)
ES (1) ES2136376T3 (da)
FR (1) FR2735053B1 (da)
GR (1) GR3031181T3 (da)
HK (1) HK1013039A1 (da)
MX (1) MX9601752A (da)
TW (1) TW307092B (da)
ZA (1) ZA964623B (da)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190058228A (ko) 2017-11-20 2019-05-29 (주)케이티엔에프 웨이브 솔더링 공정에서 피씨비(pcb)의 과열을 방지할 수 있는 웨이브 지그 및 이를 이용한 웨이브 솔더링 방법

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JP3521587B2 (ja) * 1995-02-07 2004-04-19 セイコーエプソン株式会社 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法
DE19749187A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Lötvorrichtung
DE19749185A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Mit einer Gasversorgung verbindbare Gasverteilung
FR2778190B1 (fr) * 1998-05-04 2000-06-02 Air Liquide Procede et appareil de traitement de surfaces metalliques par voie seche
DE19825423A1 (de) * 1998-06-06 1999-12-09 Alcatel Sa Vorrichtung zur Herstellung eines optischen Kabels
US6315189B1 (en) * 1998-10-13 2001-11-13 Texas Instruments Incorporated Semiconductor package lead plating method and apparatus
US6354481B1 (en) * 1999-02-18 2002-03-12 Speedline Technologies, Inc. Compact reflow and cleaning apparatus
US6468833B2 (en) * 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
JP2002080950A (ja) * 2000-09-07 2002-03-22 Senju Metal Ind Co Ltd ドロスから酸化物を分離する方法および噴流はんだ槽
DE50115393D1 (de) * 2000-10-06 2010-04-29 Pac Tech Gmbh Verfahren zum flussmittelfreien aufbringen eines lötmittels auf ein substrat oder einen chip
US6776330B2 (en) 2001-09-10 2004-08-17 Air Products And Chemicals, Inc. Hydrogen fluxless soldering by electron attachment
JP4409134B2 (ja) * 2001-10-09 2010-02-03 パナソニック株式会社 実装システム
US6936546B2 (en) * 2002-04-26 2005-08-30 Accretech Usa, Inc. Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates
US20080011332A1 (en) * 2002-04-26 2008-01-17 Accretech Usa, Inc. Method and apparatus for cleaning a wafer substrate
US20080190558A1 (en) * 2002-04-26 2008-08-14 Accretech Usa, Inc. Wafer processing apparatus and method
US20080017316A1 (en) * 2002-04-26 2008-01-24 Accretech Usa, Inc. Clean ignition system for wafer substrate processing
US7897029B2 (en) * 2008-03-04 2011-03-01 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US7079370B2 (en) * 2003-04-28 2006-07-18 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
US8361340B2 (en) 2003-04-28 2013-01-29 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US7387738B2 (en) * 2003-04-28 2008-06-17 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment for wafer bumping applications
CA2465195C (en) * 2003-04-28 2012-06-19 Air Products And Chemicals, Inc. Electrode assembly for the removal of surface oxides by electron attachment
US7434719B2 (en) * 2005-12-09 2008-10-14 Air Products And Chemicals, Inc. Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
DE102006024192A1 (de) * 2006-05-23 2007-11-29 Linde Ag Vorrichtung und Verfahren zum Wellenlöten
DE102006027027A1 (de) 2006-06-08 2007-12-13 Centrotherm Thermal Solutions Gmbh + Co.Kg Lötverfahren
US8567658B2 (en) * 2009-07-20 2013-10-29 Ontos Equipment Systems, Inc. Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds
US8454850B2 (en) * 2009-09-02 2013-06-04 Air Products And Chemicals, Inc. Method for the removal of surface oxides by electron attachment
SG192011A1 (en) * 2011-01-17 2013-08-30 Orthodyne Electronics Corp Systems and methods for processing ribbon and wire in ultrasonic bonding systems
US9053894B2 (en) 2011-02-09 2015-06-09 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment
US9006975B2 (en) 2011-02-09 2015-04-14 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment
JP2014157858A (ja) * 2013-02-14 2014-08-28 Fuji Electric Co Ltd 半導体装置の製造方法
KR102124042B1 (ko) * 2013-02-18 2020-06-18 삼성디스플레이 주식회사 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법
CN104425289B (zh) * 2013-09-11 2017-12-15 先进科技新加坡有限公司 利用激发的混合气体的晶粒安装装置和方法
EP3218923A4 (en) 2014-11-12 2018-07-25 Ontos Equipment Systems Simultaneous hydrophilization of photoresist surface and metal surface preparation: methods, systems, and products

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US4273859A (en) * 1979-12-31 1981-06-16 Honeywell Information Systems Inc. Method of forming solder bump terminals on semiconductor elements
US5090609A (en) * 1989-04-28 1992-02-25 Hitachi, Ltd. Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
US5255840A (en) * 1989-12-26 1993-10-26 Praxair Technology, Inc. Fluxless solder coating and joining
FR2683114A1 (fr) * 1991-10-28 1993-04-30 Brizais Jacqueline Installation pour le traitement de cartes de circuit imprime par un flux.
FR2692730B1 (fr) * 1992-06-19 1994-08-19 Air Liquide Dispositif de formation de molécules gazeuses excitées ou instables et utilisations d'un tel dispositif.
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.
US5525204A (en) * 1994-09-29 1996-06-11 Motorola, Inc. Method for fabricating a printed circuit for DCA semiconductor chips

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190058228A (ko) 2017-11-20 2019-05-29 (주)케이티엔에프 웨이브 솔더링 공정에서 피씨비(pcb)의 과열을 방지할 수 있는 웨이브 지그 및 이를 이용한 웨이브 솔더링 방법

Also Published As

Publication number Publication date
FR2735053A1 (fr) 1996-12-13
EP0747160A3 (fr) 1997-02-12
DE69603418T2 (de) 2000-02-03
AR002312A1 (es) 1998-03-11
GR3031181T3 (en) 1999-12-31
ZA964623B (en) 1996-12-12
CN1095316C (zh) 2002-11-27
DK0747160T3 (da) 1999-12-13
KR970003390A (ko) 1997-01-28
DE69603418D1 (de) 1999-09-02
JP3313972B2 (ja) 2002-08-12
CA2178465A1 (fr) 1996-12-10
TW307092B (da) 1997-06-01
AU712613B2 (en) 1999-11-11
CA2178465C (fr) 2002-10-29
MX9601752A (es) 1998-04-30
JPH09122904A (ja) 1997-05-13
EP0747160A2 (fr) 1996-12-11
HK1013039A1 (en) 1999-08-13
EP0747160B1 (fr) 1999-07-28
BR9602725A (pt) 1998-09-08
CN1143892A (zh) 1997-02-26
ES2136376T3 (es) 1999-11-16
AU5583396A (en) 1996-12-19
FR2735053B1 (fr) 1997-07-25
US5722581A (en) 1998-03-03

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