AR002312A1 - Procedimiento y dispositivo de soldadura por oleadas, integrada con una operación de pre-acondicionamiento superficial por via seca. - Google Patents
Procedimiento y dispositivo de soldadura por oleadas, integrada con una operación de pre-acondicionamiento superficial por via seca.Info
- Publication number
- AR002312A1 AR002312A1 ARP960102917A AR10291796A AR002312A1 AR 002312 A1 AR002312 A1 AR 002312A1 AR P960102917 A ARP960102917 A AR P960102917A AR 10291796 A AR10291796 A AR 10291796A AR 002312 A1 AR002312 A1 AR 002312A1
- Authority
- AR
- Argentina
- Prior art keywords
- gas
- circuit
- procedure
- integrated
- conditioning operation
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Arc Welding In General (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
La invención se refiere a un procedimiento para la soldadura por oleadas, de un circuito mediante una aleción de soldadura, en el transcurso del cual sepone en contacto el circuito con por lo menos una oleada de material líquido de soldadura,obten ida por bombeo de un bano líquido de la aleación de soldadura,contenida en un recipiente, a través de una tobera o boquilla, caracterizado porque previamente cada una de las caras del circuito ha sido traída, bajo unapresión atmosférica,frente a la salida del gas de por lo menos un aparato para la formación de especies gaseosas, excitadas o inestables, en el cual aparatose hace pasar una mezcla gaseosa inicial (7) que comprende un gas inerte y/o un gas reductor y/o un gas oxidante,obtenién ndose a la salida del gas del aparato,una mezcla gaseosa primaria (8) que comprende especies excitadas o inestables y que está sustancialmente desprovista de especies eléctricamente cargadas.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9506818A FR2735053B1 (fr) | 1995-06-09 | 1995-06-09 | Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche |
Publications (1)
Publication Number | Publication Date |
---|---|
AR002312A1 true AR002312A1 (es) | 1998-03-11 |
Family
ID=9479786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ARP960102917A AR002312A1 (es) | 1995-06-09 | 1996-06-05 | Procedimiento y dispositivo de soldadura por oleadas, integrada con una operación de pre-acondicionamiento superficial por via seca. |
Country Status (18)
Country | Link |
---|---|
US (1) | US5722581A (es) |
EP (1) | EP0747160B1 (es) |
JP (1) | JP3313972B2 (es) |
KR (1) | KR100321354B1 (es) |
CN (1) | CN1095316C (es) |
AR (1) | AR002312A1 (es) |
AU (1) | AU712613B2 (es) |
BR (1) | BR9602725A (es) |
CA (1) | CA2178465C (es) |
DE (1) | DE69603418T2 (es) |
DK (1) | DK0747160T3 (es) |
ES (1) | ES2136376T3 (es) |
FR (1) | FR2735053B1 (es) |
GR (1) | GR3031181T3 (es) |
HK (1) | HK1013039A1 (es) |
MX (1) | MX9601752A (es) |
TW (1) | TW307092B (es) |
ZA (1) | ZA964623B (es) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3521587B2 (ja) * | 1995-02-07 | 2004-04-19 | セイコーエプソン株式会社 | 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法 |
DE19749185A1 (de) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Mit einer Gasversorgung verbindbare Gasverteilung |
DE19749187A1 (de) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Lötvorrichtung |
FR2778190B1 (fr) * | 1998-05-04 | 2000-06-02 | Air Liquide | Procede et appareil de traitement de surfaces metalliques par voie seche |
DE19825423A1 (de) * | 1998-06-06 | 1999-12-09 | Alcatel Sa | Vorrichtung zur Herstellung eines optischen Kabels |
US6315189B1 (en) * | 1998-10-13 | 2001-11-13 | Texas Instruments Incorporated | Semiconductor package lead plating method and apparatus |
US6354481B1 (en) * | 1999-02-18 | 2002-03-12 | Speedline Technologies, Inc. | Compact reflow and cleaning apparatus |
US6468833B2 (en) | 2000-03-31 | 2002-10-22 | American Air Liquide, Inc. | Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
JP2002080950A (ja) * | 2000-09-07 | 2002-03-22 | Senju Metal Ind Co Ltd | ドロスから酸化物を分離する方法および噴流はんだ槽 |
WO2002028586A1 (de) * | 2000-10-06 | 2002-04-11 | Pac Tech - Packaging Technologies Gmbh | Verfahren zum flussmittelfreien aufbringen eines lötmittels auf ein substrat oder einen chip |
US6776330B2 (en) | 2001-09-10 | 2004-08-17 | Air Products And Chemicals, Inc. | Hydrogen fluxless soldering by electron attachment |
JP4409134B2 (ja) * | 2001-10-09 | 2010-02-03 | パナソニック株式会社 | 実装システム |
US6936546B2 (en) * | 2002-04-26 | 2005-08-30 | Accretech Usa, Inc. | Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates |
US20080190558A1 (en) * | 2002-04-26 | 2008-08-14 | Accretech Usa, Inc. | Wafer processing apparatus and method |
US20080011332A1 (en) * | 2002-04-26 | 2008-01-17 | Accretech Usa, Inc. | Method and apparatus for cleaning a wafer substrate |
US20080017316A1 (en) * | 2002-04-26 | 2008-01-24 | Accretech Usa, Inc. | Clean ignition system for wafer substrate processing |
CA2465195C (en) * | 2003-04-28 | 2012-06-19 | Air Products And Chemicals, Inc. | Electrode assembly for the removal of surface oxides by electron attachment |
US7387738B2 (en) | 2003-04-28 | 2008-06-17 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment for wafer bumping applications |
US7079370B2 (en) * | 2003-04-28 | 2006-07-18 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation |
US7897029B2 (en) * | 2008-03-04 | 2011-03-01 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
US8361340B2 (en) * | 2003-04-28 | 2013-01-29 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
US7434719B2 (en) * | 2005-12-09 | 2008-10-14 | Air Products And Chemicals, Inc. | Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment |
DE102006024192A1 (de) * | 2006-05-23 | 2007-11-29 | Linde Ag | Vorrichtung und Verfahren zum Wellenlöten |
DE102006027027A1 (de) | 2006-06-08 | 2007-12-13 | Centrotherm Thermal Solutions Gmbh + Co.Kg | Lötverfahren |
US8567658B2 (en) * | 2009-07-20 | 2013-10-29 | Ontos Equipment Systems, Inc. | Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds |
US8454850B2 (en) * | 2009-09-02 | 2013-06-04 | Air Products And Chemicals, Inc. | Method for the removal of surface oxides by electron attachment |
WO2012099771A1 (en) * | 2011-01-17 | 2012-07-26 | Orthodyne Electronics Corporation | Systems and methods for processing ribbon and wire in ultrasonic bonding systems |
US9006975B2 (en) | 2011-02-09 | 2015-04-14 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
US9053894B2 (en) | 2011-02-09 | 2015-06-09 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
JP2014157858A (ja) * | 2013-02-14 | 2014-08-28 | Fuji Electric Co Ltd | 半導体装置の製造方法 |
KR102124042B1 (ko) * | 2013-02-18 | 2020-06-18 | 삼성디스플레이 주식회사 | 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법 |
CN104425289B (zh) * | 2013-09-11 | 2017-12-15 | 先进科技新加坡有限公司 | 利用激发的混合气体的晶粒安装装置和方法 |
CN107429418A (zh) | 2014-11-12 | 2017-12-01 | 安托士设备系统公司 | 同时进行的光刻胶表面的亲水改性和金属表面准备:方法、系统和产品 |
KR20190058228A (ko) | 2017-11-20 | 2019-05-29 | (주)케이티엔에프 | 웨이브 솔더링 공정에서 피씨비(pcb)의 과열을 방지할 수 있는 웨이브 지그 및 이를 이용한 웨이브 솔더링 방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4273859A (en) * | 1979-12-31 | 1981-06-16 | Honeywell Information Systems Inc. | Method of forming solder bump terminals on semiconductor elements |
US5090609A (en) * | 1989-04-28 | 1992-02-25 | Hitachi, Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
DE4032328A1 (de) * | 1989-11-06 | 1991-09-19 | Wls Karl Heinz Grasmann Weichl | Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern |
US5255840A (en) * | 1989-12-26 | 1993-10-26 | Praxair Technology, Inc. | Fluxless solder coating and joining |
FR2683114A1 (fr) * | 1991-10-28 | 1993-04-30 | Brizais Jacqueline | Installation pour le traitement de cartes de circuit imprime par un flux. |
FR2692730B1 (fr) * | 1992-06-19 | 1994-08-19 | Air Liquide | Dispositif de formation de molécules gazeuses excitées ou instables et utilisations d'un tel dispositif. |
FR2713528B1 (fr) * | 1993-12-15 | 1996-01-12 | Air Liquide | Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage. |
US5525204A (en) * | 1994-09-29 | 1996-06-11 | Motorola, Inc. | Method for fabricating a printed circuit for DCA semiconductor chips |
-
1995
- 1995-06-09 FR FR9506818A patent/FR2735053B1/fr not_active Expired - Fee Related
-
1996
- 1996-04-29 TW TW085105072A patent/TW307092B/zh active
- 1996-05-09 MX MX9601752A patent/MX9601752A/es not_active IP Right Cessation
- 1996-05-22 KR KR1019960017398A patent/KR100321354B1/ko not_active IP Right Cessation
- 1996-05-31 ES ES96401173T patent/ES2136376T3/es not_active Expired - Lifetime
- 1996-05-31 EP EP96401173A patent/EP0747160B1/fr not_active Expired - Lifetime
- 1996-05-31 DE DE69603418T patent/DE69603418T2/de not_active Expired - Fee Related
- 1996-05-31 DK DK96401173T patent/DK0747160T3/da active
- 1996-06-04 ZA ZA964623A patent/ZA964623B/xx unknown
- 1996-06-05 AR ARP960102917A patent/AR002312A1/es unknown
- 1996-06-06 CA CA002178465A patent/CA2178465C/fr not_active Expired - Fee Related
- 1996-06-07 CN CN96108133A patent/CN1095316C/zh not_active Expired - Fee Related
- 1996-06-07 AU AU55833/96A patent/AU712613B2/en not_active Ceased
- 1996-06-07 US US08/655,206 patent/US5722581A/en not_active Expired - Fee Related
- 1996-06-07 JP JP14586196A patent/JP3313972B2/ja not_active Expired - Fee Related
- 1996-06-10 BR BR9602725A patent/BR9602725A/pt not_active IP Right Cessation
-
1998
- 1998-12-21 HK HK98114140A patent/HK1013039A1/xx not_active IP Right Cessation
-
1999
- 1999-09-08 GR GR990402275T patent/GR3031181T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
CA2178465A1 (fr) | 1996-12-10 |
CA2178465C (fr) | 2002-10-29 |
ZA964623B (en) | 1996-12-12 |
KR100321354B1 (ko) | 2002-07-06 |
DE69603418T2 (de) | 2000-02-03 |
CN1143892A (zh) | 1997-02-26 |
FR2735053B1 (fr) | 1997-07-25 |
JP3313972B2 (ja) | 2002-08-12 |
MX9601752A (es) | 1998-04-30 |
JPH09122904A (ja) | 1997-05-13 |
US5722581A (en) | 1998-03-03 |
HK1013039A1 (en) | 1999-08-13 |
FR2735053A1 (fr) | 1996-12-13 |
AU5583396A (en) | 1996-12-19 |
TW307092B (es) | 1997-06-01 |
DK0747160T3 (da) | 1999-12-13 |
CN1095316C (zh) | 2002-11-27 |
DE69603418D1 (de) | 1999-09-02 |
GR3031181T3 (en) | 1999-12-31 |
EP0747160A2 (fr) | 1996-12-11 |
EP0747160B1 (fr) | 1999-07-28 |
KR970003390A (ko) | 1997-01-28 |
ES2136376T3 (es) | 1999-11-16 |
EP0747160A3 (fr) | 1997-02-12 |
AU712613B2 (en) | 1999-11-11 |
BR9602725A (pt) | 1998-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AR002312A1 (es) | Procedimiento y dispositivo de soldadura por oleadas, integrada con una operación de pre-acondicionamiento superficial por via seca. | |
ES2117775T3 (es) | Procedimiento y dispositivo de tratamiento con fundente, por via seca, de superficies metalicas antes de la soldadura o estañado. | |
MY108121A (en) | Gas shrouded wave soldering | |
GB9322966D0 (en) | Method for making a semiconductor and apparatus for the same | |
ES8207229A1 (es) | Dispositivo de tratamiento de un bano de metal liquido con- tenido en un recipiente, por inyeccion de gas | |
DE68913013D1 (de) | Lötverfahren. | |
MX172537B (es) | Procedimiento y aparato mejorados para separar selectivamente por lo menos un gas con respecto a por lo menos otro gas en una mezcla gaseosa | |
JPS5329076A (en) | Plasma treating apparatus of semiconductor substrates | |
TW324850B (en) | Manufacturing method of resin-sealed semiconductor apparatus and device thereof | |
NO169532C (no) | Fremgangsmaate til behandling av en vandig vaeske og innretning for gjennomfoering av fremgangsmaaten | |
AR002313A1 (es) | Procedimiento para el pre-acondicionamiento por via seca de superficies metalicas antes de su soldadura o estanado, utilizandose una atmosfera quecomprende vapor de agua. | |
JPS56163833A (en) | Electric discharge machining method | |
ES2045744T3 (es) | Procedimiento de destilacion al vacio. | |
JPS5645802A (en) | Production of hydrogen from hydrogen sulfide | |
DE3260370D1 (en) | Process and apparatus for the degasification of wine | |
JPS5454578A (en) | Gas plasma etching method | |
ATE72585T1 (de) | Durchfuehrungselement zur verwendung in vakuumvorrichtungen; vorrichtung, versehen mit diesem element und in dieser vorrichtung hergestellter draht. | |
AU2001285852A1 (en) | Appliance for improved inertizing during wave soldering | |
ES2139723T3 (es) | Procedimiento y dispositivo de tratamiento de superficies metalicas por via seca. | |
ES2172187T3 (es) | Procedimiento para la reduccion de la formacion de espuma durante el tratamiento de una dispersion o de liquido con vapor de agua. | |
ES2017707B3 (es) | Elemento alimentador para aplicacion en un aparato de vacio y aparato de vacio provisto de uno o mas de estos elementos alimentadores. | |
JPS5611836A (en) | Bending method and apparatus of external lead wire for bulb | |
JPS56114572A (en) | Soldering method and its equipment | |
DE3869019D1 (de) | Verfahren zum einloeten von smd-bauteilen, die zeitweise an einem mittels vakuumleitung evakuierbaren loetkopf gehalten werden. | |
JPS6435833A (en) | Liquid metal ion source |