AR002313A1 - Procedimiento para el pre-acondicionamiento por via seca de superficies metalicas antes de su soldadura o estanado, utilizandose una atmosfera quecomprende vapor de agua. - Google Patents

Procedimiento para el pre-acondicionamiento por via seca de superficies metalicas antes de su soldadura o estanado, utilizandose una atmosfera quecomprende vapor de agua.

Info

Publication number
AR002313A1
AR002313A1 ARP960102918A AR10291896A AR002313A1 AR 002313 A1 AR002313 A1 AR 002313A1 AR P960102918 A ARP960102918 A AR P960102918A AR 10291896 A AR10291896 A AR 10291896A AR 002313 A1 AR002313 A1 AR 002313A1
Authority
AR
Argentina
Prior art keywords
gaseous
conditioning
mixture
procedure
atmosphere
Prior art date
Application number
ARP960102918A
Other languages
English (en)
Inventor
Thierry Sindzingre
Stephane Rabia
Nicolas Potier
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Publication of AR002313A1 publication Critical patent/AR002313A1/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Arc Welding In General (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

La invención se refiere a un procedimiento para el pre-acondicionamiento o pre-tratamiento por vía seca de una superficie metálica antes de su soldadurao estanado mediante una aleación,donde la superficie a ser pre-acondiconada es tratada bajopres ión próxima a la presión atmosférica, en atmósfera gaseosa quecomprende especies excitadas o inestables y que está sustancialmente desprovista de especies eléctricamente cargadas, obtenida a partir de unamezcla gaseosa primaria (8) yde se r necesario también a partir de una mezcla gaseosa adyacente (9, 10), obteniéndose la mezcla gaseosa primaria en por lomenos un aparato (11, 4, 12) formador de especies gaseosas excitadas o inestables en donde se transforma unamezcla gase osa inicial (7) que comprendeun gas inerte y/o un gas reductor, y que comprende una mezcla gaseosa oxidante que incluye vapor de agua, y en dicho procedimiento la mezcla gaseosa adyacenteno ha transitado por el aparato.
ARP960102918A 1995-06-09 1996-06-05 Procedimiento para el pre-acondicionamiento por via seca de superficies metalicas antes de su soldadura o estanado, utilizandose una atmosfera quecomprende vapor de agua. AR002313A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9506819A FR2735054B1 (fr) 1995-06-09 1995-06-09 Procede de fluxage par voie seche de surfaces metalliques avant brasage ou etamage utilisant une atmosphere comportant de la vapeur d'eau

Publications (1)

Publication Number Publication Date
AR002313A1 true AR002313A1 (es) 1998-03-11

Family

ID=9479787

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP960102918A AR002313A1 (es) 1995-06-09 1996-06-05 Procedimiento para el pre-acondicionamiento por via seca de superficies metalicas antes de su soldadura o estanado, utilizandose una atmosfera quecomprende vapor de agua.

Country Status (16)

Country Link
EP (1) EP0747159B1 (es)
JP (1) JP3313973B2 (es)
KR (1) KR100321353B1 (es)
CN (1) CN1066373C (es)
AR (1) AR002313A1 (es)
AU (1) AU697277B2 (es)
BR (1) BR9602661A (es)
CA (1) CA2178574C (es)
DE (1) DE69603666T2 (es)
DK (1) DK0747159T3 (es)
ES (1) ES2137637T3 (es)
FR (1) FR2735054B1 (es)
GR (1) GR3031503T3 (es)
HK (1) HK1013040A1 (es)
TW (1) TW302597B (es)
ZA (1) ZA964018B (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2778190B1 (fr) * 1998-05-04 2000-06-02 Air Liquide Procede et appareil de traitement de surfaces metalliques par voie seche
FR2781974B1 (fr) * 1998-07-30 2000-08-25 Air Liquide Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede
US6776330B2 (en) * 2001-09-10 2004-08-17 Air Products And Chemicals, Inc. Hydrogen fluxless soldering by electron attachment
CA2465195C (en) * 2003-04-28 2012-06-19 Air Products And Chemicals, Inc. Electrode assembly for the removal of surface oxides by electron attachment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8827933D0 (en) * 1988-11-30 1989-01-05 Plessey Co Plc Improvements relating to soldering processes
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
US5236512A (en) * 1991-08-14 1993-08-17 Thiokol Corporation Method and apparatus for cleaning surfaces with plasma
DE4206103A1 (de) * 1992-02-27 1993-09-02 Linde Ag Verfahren zum verloeten von leiterplatten
GB2274286B (en) * 1993-01-13 1996-11-06 Singapore Asahi Chemical & Solder Ind Pte Ltd Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.

Also Published As

Publication number Publication date
EP0747159B1 (fr) 1999-08-11
KR100321353B1 (ko) 2002-06-28
JP3313973B2 (ja) 2002-08-12
JPH09122905A (ja) 1997-05-13
AU697277B2 (en) 1998-10-01
HK1013040A1 (en) 1999-08-13
EP0747159A1 (fr) 1996-12-11
CA2178574A1 (fr) 1996-12-10
CA2178574C (fr) 2002-08-13
CN1143554A (zh) 1997-02-26
KR970004991A (ko) 1997-01-29
DE69603666T2 (de) 2000-04-06
DK0747159T3 (da) 2000-02-07
CN1066373C (zh) 2001-05-30
GR3031503T3 (en) 2000-01-31
BR9602661A (pt) 1998-04-22
DE69603666D1 (de) 1999-09-16
FR2735054B1 (fr) 1997-07-25
ES2137637T3 (es) 1999-12-16
ZA964018B (en) 1996-11-27
TW302597B (es) 1997-04-11
AU5583296A (en) 1996-12-19
FR2735054A1 (fr) 1996-12-13

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