ZA964018B - Method for dry fluxing of metallic surfaces before soldering or tinning using an atmosphere which includes water vapour - Google Patents

Method for dry fluxing of metallic surfaces before soldering or tinning using an atmosphere which includes water vapour

Info

Publication number
ZA964018B
ZA964018B ZA964018A ZA964018A ZA964018B ZA 964018 B ZA964018 B ZA 964018B ZA 964018 A ZA964018 A ZA 964018A ZA 964018 A ZA964018 A ZA 964018A ZA 964018 B ZA964018 B ZA 964018B
Authority
ZA
South Africa
Prior art keywords
tinning
atmosphere
water vapour
includes water
metallic surfaces
Prior art date
Application number
ZA964018A
Inventor
Thierry Sindzingre
Stephane Rabia
Nicolas Potier
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Publication of ZA964018B publication Critical patent/ZA964018B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Arc Welding In General (AREA)
  • Electroplating Methods And Accessories (AREA)
ZA964018A 1995-06-09 1996-05-20 Method for dry fluxing of metallic surfaces before soldering or tinning using an atmosphere which includes water vapour ZA964018B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9506819A FR2735054B1 (en) 1995-06-09 1995-06-09 PROCESS FOR FLUXING BY DRY WAY OF METAL SURFACES BEFORE BRAZING OR TINNING USING AN ATMOSPHERE CONTAINING WATER VAPOR

Publications (1)

Publication Number Publication Date
ZA964018B true ZA964018B (en) 1996-11-27

Family

ID=9479787

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA964018A ZA964018B (en) 1995-06-09 1996-05-20 Method for dry fluxing of metallic surfaces before soldering or tinning using an atmosphere which includes water vapour

Country Status (16)

Country Link
EP (1) EP0747159B1 (en)
JP (1) JP3313973B2 (en)
KR (1) KR100321353B1 (en)
CN (1) CN1066373C (en)
AR (1) AR002313A1 (en)
AU (1) AU697277B2 (en)
BR (1) BR9602661A (en)
CA (1) CA2178574C (en)
DE (1) DE69603666T2 (en)
DK (1) DK0747159T3 (en)
ES (1) ES2137637T3 (en)
FR (1) FR2735054B1 (en)
GR (1) GR3031503T3 (en)
HK (1) HK1013040A1 (en)
TW (1) TW302597B (en)
ZA (1) ZA964018B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2778190B1 (en) * 1998-05-04 2000-06-02 Air Liquide METHOD AND APPARATUS FOR TREATING METAL SURFACES BY DRY WAY
FR2781974B1 (en) * 1998-07-30 2000-08-25 Air Liquide METHOD OF BRAZING BY REFUSION OF ELECTRONIC COMPONENTS USING SOLDER ALLOY PRE-DEPOSITS AND BRAZING DEVICE FOR CARRYING OUT SUCH A METHOD
US6776330B2 (en) * 2001-09-10 2004-08-17 Air Products And Chemicals, Inc. Hydrogen fluxless soldering by electron attachment
CA2465195C (en) * 2003-04-28 2012-06-19 Air Products And Chemicals, Inc. Electrode assembly for the removal of surface oxides by electron attachment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8827933D0 (en) * 1988-11-30 1989-01-05 Plessey Co Plc Improvements relating to soldering processes
DE4032328A1 (en) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl METHOD AND DEVICE FOR PROCESSING JOINT PARTNERS TO BE SOLDERED
US5236512A (en) * 1991-08-14 1993-08-17 Thiokol Corporation Method and apparatus for cleaning surfaces with plasma
DE4206103A1 (en) * 1992-02-27 1993-09-02 Linde Ag METHOD FOR SOLDERING PCBS
GB2274286B (en) * 1993-01-13 1996-11-06 Singapore Asahi Chemical & Solder Ind Pte Ltd Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process
FR2713528B1 (en) * 1993-12-15 1996-01-12 Air Liquide Method and device for dry fluxing of metal surfaces before brazing or tinning.

Also Published As

Publication number Publication date
DE69603666D1 (en) 1999-09-16
ES2137637T3 (en) 1999-12-16
CN1143554A (en) 1997-02-26
DE69603666T2 (en) 2000-04-06
EP0747159A1 (en) 1996-12-11
JPH09122905A (en) 1997-05-13
AU5583296A (en) 1996-12-19
DK0747159T3 (en) 2000-02-07
CN1066373C (en) 2001-05-30
BR9602661A (en) 1998-04-22
HK1013040A1 (en) 1999-08-13
FR2735054B1 (en) 1997-07-25
CA2178574A1 (en) 1996-12-10
AU697277B2 (en) 1998-10-01
GR3031503T3 (en) 2000-01-31
KR970004991A (en) 1997-01-29
JP3313973B2 (en) 2002-08-12
TW302597B (en) 1997-04-11
CA2178574C (en) 2002-08-13
KR100321353B1 (en) 2002-06-28
AR002313A1 (en) 1998-03-11
FR2735054A1 (en) 1996-12-13
EP0747159B1 (en) 1999-08-11

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