GB2274286B - Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process - Google Patents

Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process

Info

Publication number
GB2274286B
GB2274286B GB9300587A GB9300587A GB2274286B GB 2274286 B GB2274286 B GB 2274286B GB 9300587 A GB9300587 A GB 9300587A GB 9300587 A GB9300587 A GB 9300587A GB 2274286 B GB2274286 B GB 2274286B
Authority
GB
United Kingdom
Prior art keywords
preparing
flow
circuit board
electric circuit
soldering process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9300587A
Other versions
GB2274286A (en
GB9300587D0 (en
Inventor
Yue Sern Kho
Kai Hwa Chew
Lock Kee Yip
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singapore Asahi Chemical and Solder Industries Pte Ltd
Original Assignee
Singapore Asahi Chemical and Solder Industries Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Asahi Chemical and Solder Industries Pte Ltd filed Critical Singapore Asahi Chemical and Solder Industries Pte Ltd
Priority to GB9300587A priority Critical patent/GB2274286B/en
Publication of GB9300587D0 publication Critical patent/GB9300587D0/en
Priority to PCT/GB1994/000037 priority patent/WO1994016545A1/en
Priority to AU58212/94A priority patent/AU5821294A/en
Publication of GB2274286A publication Critical patent/GB2274286A/en
Application granted granted Critical
Publication of GB2274286B publication Critical patent/GB2274286B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning By Liquid Or Steam (AREA)
GB9300587A 1993-01-13 1993-01-13 Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process Expired - Lifetime GB2274286B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9300587A GB2274286B (en) 1993-01-13 1993-01-13 Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process
PCT/GB1994/000037 WO1994016545A1 (en) 1993-01-13 1994-01-10 Method of and apparatus for cleaning metal surfaces
AU58212/94A AU5821294A (en) 1993-01-13 1994-01-10 Method of and apparatus for cleaning metal surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9300587A GB2274286B (en) 1993-01-13 1993-01-13 Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process

Publications (3)

Publication Number Publication Date
GB9300587D0 GB9300587D0 (en) 1993-03-03
GB2274286A GB2274286A (en) 1994-07-20
GB2274286B true GB2274286B (en) 1996-11-06

Family

ID=10728658

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9300587A Expired - Lifetime GB2274286B (en) 1993-01-13 1993-01-13 Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process

Country Status (3)

Country Link
AU (1) AU5821294A (en)
GB (1) GB2274286B (en)
WO (1) WO1994016545A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2735054B1 (en) * 1995-06-09 1997-07-25 Air Liquide PROCESS FOR FLUXING BY DRY WAY OF METAL SURFACES BEFORE BRAZING OR TINNING USING AN ATMOSPHERE CONTAINING WATER VAPOR
US5941448A (en) * 1996-06-07 1999-08-24 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method for dry fluxing of metallic surfaces, before soldering or tinning, using an atmosphere which includes water vapor
FR2778190B1 (en) * 1998-05-04 2000-06-02 Air Liquide METHOD AND APPARATUS FOR TREATING METAL SURFACES BY DRY WAY
WO2002028586A1 (en) * 2000-10-06 2002-04-11 Pac Tech - Packaging Technologies Gmbh Method for applying solder to a substrate or a chip without using flux

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB674960A (en) * 1948-06-10 1952-07-02 Western Electric Co Method of forming on iron or an iron alloy a surface easily wettable by mercury
GB706681A (en) * 1948-04-23 1954-04-07 Sylvania Electric Prod Improvements in or relating to the production of aluminium-iron alloy coated ferroussheet stock
GB774693A (en) * 1954-04-14 1957-05-15 Ass Elect Ind Improvements relating to the lubrication of metallic surfaces
GB1494352A (en) * 1973-12-11 1977-12-07 Philips Electronic Associated Method of preparing ferromagnetic material
GB1592864A (en) * 1976-10-19 1981-07-08 Kernforschungsanlage Juelich Method of and apparatus for cleaning surfaces
EP0069189A2 (en) * 1981-06-30 1983-01-12 International Business Machines Corporation Fluxless soldering process
GB2144669A (en) * 1982-12-07 1985-03-13 Standard Telephones Cables Ltd Cleaning electrical contacts
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
DE8520254U1 (en) * 1985-07-11 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Soldering device for soldering electronic flat assemblies in a soldering chamber filled with inert gas
US4706870A (en) * 1984-12-18 1987-11-17 Motorola Inc. Controlled chemical reduction of surface film
EP0277460A1 (en) * 1986-12-16 1988-08-10 Plasma-Seven S.A. Restoring process of a metallic structure in a metallic object's degraded surface, its use and device for carrying it out
US4840680A (en) * 1984-04-05 1989-06-20 Societe Stein Heurtey, Z.A.I. Method for degreasing a cold rolled metallic band
EP0371693A1 (en) * 1988-11-30 1990-06-06 Gec-Marconi Limited Improvements relating to soldering processes
US5135775A (en) * 1990-11-02 1992-08-04 Thyssen Edelstalhwerke Ag Process for plasma-chemical cleaning prior to pvd or pecvd coating
EP0557756A1 (en) * 1992-02-27 1993-09-01 Linde Aktiengesellschaft Method for soldering printed circuit boards

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3309648A1 (en) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München METHOD FOR SOLDERING PLATE-SHAPED CIRCUIT CARRIERS WITHIN A PROTECTIVE GAS SOLDERING DEVICE
US5076487A (en) * 1989-03-20 1991-12-31 The Boc Group, Inc. Process for reflow soldering
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB706681A (en) * 1948-04-23 1954-04-07 Sylvania Electric Prod Improvements in or relating to the production of aluminium-iron alloy coated ferroussheet stock
GB674960A (en) * 1948-06-10 1952-07-02 Western Electric Co Method of forming on iron or an iron alloy a surface easily wettable by mercury
GB774693A (en) * 1954-04-14 1957-05-15 Ass Elect Ind Improvements relating to the lubrication of metallic surfaces
GB1494352A (en) * 1973-12-11 1977-12-07 Philips Electronic Associated Method of preparing ferromagnetic material
GB1592864A (en) * 1976-10-19 1981-07-08 Kernforschungsanlage Juelich Method of and apparatus for cleaning surfaces
EP0069189A2 (en) * 1981-06-30 1983-01-12 International Business Machines Corporation Fluxless soldering process
GB2144669A (en) * 1982-12-07 1985-03-13 Standard Telephones Cables Ltd Cleaning electrical contacts
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
US4840680A (en) * 1984-04-05 1989-06-20 Societe Stein Heurtey, Z.A.I. Method for degreasing a cold rolled metallic band
US4706870A (en) * 1984-12-18 1987-11-17 Motorola Inc. Controlled chemical reduction of surface film
DE8520254U1 (en) * 1985-07-11 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Soldering device for soldering electronic flat assemblies in a soldering chamber filled with inert gas
EP0277460A1 (en) * 1986-12-16 1988-08-10 Plasma-Seven S.A. Restoring process of a metallic structure in a metallic object's degraded surface, its use and device for carrying it out
EP0371693A1 (en) * 1988-11-30 1990-06-06 Gec-Marconi Limited Improvements relating to soldering processes
US5135775A (en) * 1990-11-02 1992-08-04 Thyssen Edelstalhwerke Ag Process for plasma-chemical cleaning prior to pvd or pecvd coating
EP0557756A1 (en) * 1992-02-27 1993-09-01 Linde Aktiengesellschaft Method for soldering printed circuit boards

Also Published As

Publication number Publication date
GB2274286A (en) 1994-07-20
GB9300587D0 (en) 1993-03-03
WO1994016545A1 (en) 1994-07-21
AU5821294A (en) 1994-08-15

Similar Documents

Publication Publication Date Title
HK1012605A1 (en) Process and apparatus for the wave soldering of circuit boards
EP0427563A3 (en) Apparatus and method for installation of multi-pin components on circuit boards
GB2131331B (en) Method and apparatus for mounting multilead components on a circuit board
ZA95977B (en) A method and apparatus for shielding an electrical circuit that is disposed on a substrate
GB2223429B (en) Apparatus for and method of automatically mounting electronic component on printed circuit board
SG49963A1 (en) Method and apparatus for locating electrical circuit members
HU9503096D0 (en) Method and apparatus for manufactoring ceramic electronic components
AU2819089A (en) A method of producing an electronic circuit part and an apparatus for producing an electronic circuit part
EP0469788A3 (en) Method and apparatus for reflow-soldering of print circuit boards
GB9512101D0 (en) Circuit board test apparatus and method
EP0700008A3 (en) Electronic circuit modeling method and apparatus
SG44314A1 (en) Printed circuit board and method of connecting electronic parts
GB9119960D0 (en) Method of and apparatus for depositing solder on a printed circuit board
EP0488031A3 (en) Method of and apparatus for inspecting a printed circuit board
ZA954134B (en) Wave soldering apparatus and process
ZA943662B (en) Wave soldering method and apparatus
GB2288229B (en) Method and apparatus for perforating printed circuit board
GB2281822B (en) Method and apparatus for connecting an electrical component within a housing
GB2239010B (en) A method of and apparatus for aligning electronic components
EP0776151A4 (en) Method and apparatus for soldering inspection of circuit board
GB9011020D0 (en) An electronic wave heating apparatus
EP0055323A3 (en) Process of soldering printed circuit boards and apparatus employed therefor
GB2274286B (en) Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process
GB2226966B (en) Method and apparatus for forming electrode on electronic component
GB2161136B (en) A method of and apparatus for mounting an electronic part on a circuit board

Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20130112