KR100287491B1 - 반도체 밀봉용 수지 타블렛 - Google Patents

반도체 밀봉용 수지 타블렛 Download PDF

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Publication number
KR100287491B1
KR100287491B1 KR1019940004978A KR19940004978A KR100287491B1 KR 100287491 B1 KR100287491 B1 KR 100287491B1 KR 1019940004978 A KR1019940004978 A KR 1019940004978A KR 19940004978 A KR19940004978 A KR 19940004978A KR 100287491 B1 KR100287491 B1 KR 100287491B1
Authority
KR
South Korea
Prior art keywords
tablet
resin
less
mold
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940004978A
Other languages
English (en)
Korean (ko)
Other versions
KR950025964A (ko
Inventor
다루노도모히로
도요다요시오
오노히로후미
기무라쇼이찌
아사오히로유끼
가나이신이찌
Original Assignee
히데끼 야마모또
니또 덴꼬 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히데끼 야마모또, 니또 덴꼬 코포레이션 filed Critical 히데끼 야마모또
Publication of KR950025964A publication Critical patent/KR950025964A/ko
Application granted granted Critical
Publication of KR100287491B1 publication Critical patent/KR100287491B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/06—Making preforms by moulding the material
    • B29B11/12—Compression moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00—Conditioning or physical treatment of the material to be shaped
    • B29B13/02—Conditioning or physical treatment of the material to be shaped by heating
    • B29B13/022—Melting the material to be shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/8305—Miscellaneous [e.g., treated surfaces, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR1019940004978A 1994-02-23 1994-03-14 반도체 밀봉용 수지 타블렛 Expired - Fee Related KR100287491B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-051307 1994-02-23
JP5130794A JP3037552B2 (ja) 1994-02-23 1994-02-23 半導体封止用樹脂タブレット及び半導体封止装置とその製造方法

Publications (2)

Publication Number Publication Date
KR950025964A KR950025964A (ko) 1995-09-18
KR100287491B1 true KR100287491B1 (ko) 2001-04-16

Family

ID=12883270

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940004978A Expired - Fee Related KR100287491B1 (ko) 1994-02-23 1994-03-14 반도체 밀봉용 수지 타블렛

Country Status (8)

Country Link
US (1) US5698152A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0669649B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP3037552B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100287491B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN1089490C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69428676T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SG (1) SG47837A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW259798B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017217638A1 (ko) * 2016-06-17 2017-12-21 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001672A (en) 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
US5925384A (en) * 1997-04-25 1999-07-20 Micron Technology, Inc. Manual pellet loader for Boschman automolds
JP4295869B2 (ja) * 1999-09-14 2009-07-15 日東電工株式会社 半導体封止用エポキシ樹脂組成物の製法
US20030141609A1 (en) * 2000-01-13 2003-07-31 Jia Yim Sook Method for momentarily heating the surface of a mold and system thereof
KR100611548B1 (ko) * 2000-03-29 2006-08-10 닛토덴코 가부시키가이샤 반도체 장치, 그 제조 공정 및 에폭시 수지 조성물을포함하는 태블릿
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US20040056375A1 (en) * 2002-07-19 2004-03-25 Gary Bubb Method and apparatus for making miniature tablets
US20040023025A1 (en) * 2002-07-30 2004-02-05 Christophe Magnin Water redispersible adhesives and binders and tablets thereof
JP4569296B2 (ja) * 2004-12-28 2010-10-27 住友ベークライト株式会社 半導体封止用樹脂タブレットの製造方法および樹脂成形体の製造方法
US7536233B1 (en) * 2006-01-30 2009-05-19 Advanced Micro Devices, Inc. Method and apparatus for adjusting processing speeds based on work-in-process levels
JP5086945B2 (ja) * 2008-09-05 2012-11-28 株式会社東芝 半導体装置の製造方法
TWI416674B (zh) * 2008-11-05 2013-11-21 Advanced Semiconductor Eng 封膠模具與封膠方法
JP5586313B2 (ja) * 2010-04-23 2014-09-10 京セラケミカル株式会社 接着剤層の形成方法、及び接着剤組成物
JP6092651B2 (ja) * 2013-02-19 2017-03-08 株式会社日中製作所 カーテンランナーのユニットベース及び先導カーテンランナー
JP2015000490A (ja) * 2013-06-13 2015-01-05 株式会社カネカ 生産性を向上させる半導体パッケージの製造方法
US10344160B1 (en) * 2015-08-10 2019-07-09 The United States Of America As Represented By The Secretary Of The Navy Super-hydrophobic epoxy resin compositions
JP6989044B1 (ja) * 2021-03-31 2022-01-05 住友ベークライト株式会社 封止構造体の製造方法およびタブレット

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4293519A (en) * 1978-03-27 1981-10-06 Motorola Inc. Method for potting and encapsulating electronic circuits
JPS597008A (ja) * 1982-07-03 1984-01-14 Toshiba Corp 高密度タブレツトおよびそれを使用した半導体樹脂封止方法
MY109641A (en) * 1991-03-20 1997-03-31 Nitto Denko Corp Resin tablet for semiconductor sealing,process for producing the same, and process for producing semiconductor devices using the same
JP2592753B2 (ja) * 1992-09-18 1997-03-19 日東電工株式会社 半導体封止用樹脂タブレット

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017217638A1 (ko) * 2016-06-17 2017-12-21 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
US10793711B2 (en) 2016-06-17 2020-10-06 Samsung Sdi Co., Ltd. Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same

Also Published As

Publication number Publication date
CN1107612A (zh) 1995-08-30
EP0669649B1 (en) 2001-10-17
TW259798B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1995-10-11
JP3037552B2 (ja) 2000-04-24
SG47837A1 (en) 1998-04-17
JPH07232323A (ja) 1995-09-05
EP0669649A1 (en) 1995-08-30
US5698152A (en) 1997-12-16
DE69428676D1 (de) 2001-11-22
KR950025964A (ko) 1995-09-18
DE69428676T2 (de) 2002-05-08
CN1089490C (zh) 2002-08-21

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