KR100280337B1 - 절연 세라믹 조성물 및 이를 이용한 세라믹 인덕터 - Google Patents
절연 세라믹 조성물 및 이를 이용한 세라믹 인덕터 Download PDFInfo
- Publication number
- KR100280337B1 KR100280337B1 KR1019980006594A KR19980006594A KR100280337B1 KR 100280337 B1 KR100280337 B1 KR 100280337B1 KR 1019980006594 A KR1019980006594 A KR 1019980006594A KR 19980006594 A KR19980006594 A KR 19980006594A KR 100280337 B1 KR100280337 B1 KR 100280337B1
- Authority
- KR
- South Korea
- Prior art keywords
- terms
- weight
- oxide
- ceramic
- inductor
- Prior art date
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- 239000000919 ceramic Substances 0.000 title claims abstract description 53
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims abstract description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052810 boron oxide Inorganic materials 0.000 claims abstract description 6
- 239000011651 chromium Substances 0.000 claims abstract description 6
- 229910000423 chromium oxide Inorganic materials 0.000 claims abstract description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910001950 potassium oxide Inorganic materials 0.000 claims abstract description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 6
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract description 5
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000292 calcium oxide Substances 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 18
- 238000010304 firing Methods 0.000 description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- 238000009413 insulation Methods 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910001252 Pd alloy Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- -1 for example Chemical compound 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
- C04B35/18—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in aluminium oxide
- C04B35/195—Alkaline earth aluminosilicates, e.g. cordierite or anorthite
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Inorganic Insulating Materials (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (2)
- SiO2로 환산하여 산화규소 62~75중량%;BaCO3로 환산하여 산화바륨 4~22중량%;Al2O3로 환산하여 산화 알루미늄 0.5~2.5중량%;Cr2O3로 환산하여 산화크롬 0~0.8중량%;CaCO3로 환산하여 산화칼슘 0.2~0.8중량%;B2O3로 환산하여 산화붕소 8~18중량%; 및K2O로 환산하여 산화칼륨 0~2.5중량%를 포함하는 것을 특징으로 하는 절연 세라믹 조성물.
- 세라믹 소결체; 상기 세라믹 소결체에 인덕터로서 형성된 내부도체; 및 상기한 세라믹 소결체의 외표면에 형성되며, 상기한 내부도체에 전기적으로 접속된 외부전극들을 구비한 유형의 세라믹 인덕터로서, 상기한 세라믹 소결체는SiO2로 환산하여 산화규소 62~75중량%;BaCO3로 환산하여 산화바륨 4~22중량%;Al2O3로 환산하여 산화 알루미늄 0.5~2.5중량%;Cr2O3로 환산하여 산화크롬 0~0.8중량%;CaCO3로 환산하여 산화칼슘 0.2~0.8중량%;B2O3로 환산하여 산화붕소 8~18중량%; 및K2O로 환산하여 산화칼륨 0~2.5중량%를 포함하는 것을 특징으로 하는 세라믹 인덕터.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04588597A JP3161355B2 (ja) | 1997-02-28 | 1997-02-28 | 絶縁セラミック組成物およびそれを用いたセラミックインダクタ |
JP9-045885 | 1997-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19980071853A KR19980071853A (ko) | 1998-10-26 |
KR100280337B1 true KR100280337B1 (ko) | 2001-03-02 |
Family
ID=12731703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980006594A KR100280337B1 (ko) | 1997-02-28 | 1998-02-28 | 절연 세라믹 조성물 및 이를 이용한 세라믹 인덕터 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6080693A (ko) |
EP (1) | EP0861816B1 (ko) |
JP (1) | JP3161355B2 (ko) |
KR (1) | KR100280337B1 (ko) |
CN (1) | CN1084716C (ko) |
DE (1) | DE69800309T2 (ko) |
NO (1) | NO317328B1 (ko) |
TW (1) | TW466220B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3452028B2 (ja) * | 2000-05-09 | 2003-09-29 | 株式会社村田製作所 | チップインダクタ及びその製造方法 |
US6844278B2 (en) * | 2001-09-18 | 2005-01-18 | Aem, Inc. | Dense lead-free glass ceramic for electronic devices |
JP3888446B2 (ja) * | 2002-03-25 | 2007-03-07 | 株式会社村田製作所 | セラミック電子部品、及びセラミック電子部品の製造方法 |
KR100621195B1 (ko) * | 2004-02-06 | 2006-09-13 | 주식회사 아이엠텍 | 엘티씨씨용 세라믹 분말 조성물 및 그 제조방법 |
JP4853048B2 (ja) * | 2006-03-02 | 2012-01-11 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
JP5559590B2 (ja) | 2009-11-18 | 2014-07-23 | 日本碍子株式会社 | セラミックス焼結体、その製造方法及びセラミックス構造体 |
CN102898027B (zh) * | 2012-10-17 | 2015-01-07 | 电子科技大学 | 电子元器件封装材料用陶瓷粉及其生产方法 |
KR101548808B1 (ko) * | 2013-10-24 | 2015-08-31 | 삼성전기주식회사 | 복합 전자부품 및 그 실장 기판 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4927222B1 (ko) * | 1966-04-13 | 1974-07-16 | ||
NL7406083A (nl) * | 1974-05-07 | 1975-11-11 | Philips Nv | Werkwijze voor het samenstellen van een gemeng voor loodglas. |
US3957499A (en) * | 1974-11-11 | 1976-05-18 | Corning Glass Works | Fast-fading index-corrected photochromic glass compositions |
SU574776A1 (ru) * | 1976-06-10 | 1977-09-30 | Предприятие П/Я Х-5476 | Диэлектрический состав дл межслойной изол ции |
GB2115403B (en) * | 1982-02-20 | 1985-11-27 | Zeiss Stiftung | Optical and opthalmic glass |
EP0288212A1 (en) * | 1987-04-15 | 1988-10-26 | Tam Ceramics Inc. | Dielectric ceramic compositions having high dielectric constants |
US5077240A (en) * | 1990-01-11 | 1991-12-31 | Schott Glass Technologies, Inc. | Strengthenable, high neodymium-containing glasses |
JPH0798679B2 (ja) * | 1990-05-07 | 1995-10-25 | 株式会社村田製作所 | 低温焼結磁器組成物 |
CN2082011U (zh) * | 1990-11-29 | 1991-07-31 | 陈树田 | 陶瓷绝缘子无电源电容分压式传感器 |
US5622903A (en) * | 1995-05-04 | 1997-04-22 | Owens-Corning Fiberglas Technology, Inc. | Irregularly shaped glass fibers and insulation therefrom |
-
1997
- 1997-02-28 JP JP04588597A patent/JP3161355B2/ja not_active Expired - Lifetime
-
1998
- 1998-02-23 TW TW087102515A patent/TW466220B/zh not_active IP Right Cessation
- 1998-02-24 US US09/030,050 patent/US6080693A/en not_active Expired - Lifetime
- 1998-02-26 CN CN98105375A patent/CN1084716C/zh not_active Expired - Lifetime
- 1998-02-27 NO NO19980854A patent/NO317328B1/no not_active IP Right Cessation
- 1998-02-27 DE DE69800309T patent/DE69800309T2/de not_active Expired - Lifetime
- 1998-02-27 EP EP98103500A patent/EP0861816B1/en not_active Expired - Lifetime
- 1998-02-28 KR KR1019980006594A patent/KR100280337B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6080693A (en) | 2000-06-27 |
DE69800309T2 (de) | 2001-03-15 |
KR19980071853A (ko) | 1998-10-26 |
NO980854D0 (no) | 1998-02-27 |
JPH10236868A (ja) | 1998-09-08 |
EP0861816A3 (en) | 1998-11-11 |
TW466220B (en) | 2001-12-01 |
DE69800309D1 (de) | 2000-10-26 |
EP0861816A2 (en) | 1998-09-02 |
NO317328B1 (no) | 2004-10-11 |
JP3161355B2 (ja) | 2001-04-25 |
CN1194253A (zh) | 1998-09-30 |
CN1084716C (zh) | 2002-05-15 |
EP0861816B1 (en) | 2000-09-20 |
NO980854L (no) | 1998-08-31 |
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