KR100276858B1 - 향상된패드설계를갖는전자패키지 - Google Patents

향상된패드설계를갖는전자패키지 Download PDF

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Publication number
KR100276858B1
KR100276858B1 KR1019980702478A KR19980702478A KR100276858B1 KR 100276858 B1 KR100276858 B1 KR 100276858B1 KR 1019980702478 A KR1019980702478 A KR 1019980702478A KR 19980702478 A KR19980702478 A KR 19980702478A KR 100276858 B1 KR100276858 B1 KR 100276858B1
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KR
South Korea
Prior art keywords
substrate
portions
conductive pad
electronic package
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019980702478A
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English (en)
Korean (ko)
Other versions
KR19990064001A (ko
Inventor
프란체스코 갈벨리
스테파노 오기오니
Original Assignee
포만 제프리 엘
인터내셔널 비지네스 머신즈 코포레이션
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Publication date
Application filed by 포만 제프리 엘, 인터내셔널 비지네스 머신즈 코포레이션 filed Critical 포만 제프리 엘
Publication of KR19990064001A publication Critical patent/KR19990064001A/ko
Application granted granted Critical
Publication of KR100276858B1 publication Critical patent/KR100276858B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR1019980702478A 1995-10-04 1996-10-03 향상된패드설계를갖는전자패키지 Expired - Fee Related KR100276858B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT9500161 1995-10-04
WOPCT/IT95/00161 1995-10-04
PCT/GB1996/002420 WO1997013275A1 (en) 1995-10-04 1996-10-03 Electronic package with enhanced pad design

Publications (2)

Publication Number Publication Date
KR19990064001A KR19990064001A (ko) 1999-07-26
KR100276858B1 true KR100276858B1 (ko) 2001-01-15

Family

ID=11332480

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980702478A Expired - Fee Related KR100276858B1 (ko) 1995-10-04 1996-10-03 향상된패드설계를갖는전자패키지

Country Status (5)

Country Link
EP (1) EP0853817A1 (cg-RX-API-DMAC7.html)
JP (1) JP3093278B2 (cg-RX-API-DMAC7.html)
KR (1) KR100276858B1 (cg-RX-API-DMAC7.html)
TW (1) TW299564B (cg-RX-API-DMAC7.html)
WO (1) WO1997013275A1 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09175399A (ja) * 1995-12-28 1997-07-08 Motohiro Seisakusho:Kk コンテナなどの運搬車
KR100469911B1 (ko) * 1997-12-31 2005-07-07 주식회사 하이닉스반도체 레저바르커패시터의배열방법
JP2004214657A (ja) 2003-01-07 2004-07-29 Internatl Business Mach Corp <Ibm> プリント回路板製造用水溶性保護ペースト
JP5954013B2 (ja) * 2012-07-18 2016-07-20 日亜化学工業株式会社 半導体素子実装部材及び半導体装置
CN120637354B (zh) * 2025-08-12 2025-12-05 长沙金维集成电路股份有限公司 芯片封装结构及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985001835A1 (en) * 1983-10-21 1985-04-25 American Telephone & Telegraph Company Semiconductor integrated circuit including a lead frame chip support
EP0623956A2 (en) * 1993-05-04 1994-11-09 Motorola, Inc. A semiconductor device having no die supporting surface and method for making the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63245952A (ja) * 1987-04-01 1988-10-13 Hitachi Ltd マルチチップモジュ−ル構造体
DE69018846T2 (de) * 1989-02-10 1995-08-24 Fujitsu Ltd Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben.
JPH0422162A (ja) * 1990-05-17 1992-01-27 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
JPH0494565A (ja) * 1990-08-10 1992-03-26 Toshiba Corp 半導体装置
JPH04139864A (ja) * 1990-10-01 1992-05-13 Seiko Epson Corp 半導体装置
JP2501953B2 (ja) * 1991-01-18 1996-05-29 株式会社東芝 半導体装置
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985001835A1 (en) * 1983-10-21 1985-04-25 American Telephone & Telegraph Company Semiconductor integrated circuit including a lead frame chip support
EP0623956A2 (en) * 1993-05-04 1994-11-09 Motorola, Inc. A semiconductor device having no die supporting surface and method for making the same

Also Published As

Publication number Publication date
JPH11508409A (ja) 1999-07-21
TW299564B (cg-RX-API-DMAC7.html) 1997-03-01
EP0853817A1 (en) 1998-07-22
WO1997013275A1 (en) 1997-04-10
JP3093278B2 (ja) 2000-10-03
KR19990064001A (ko) 1999-07-26

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