KR100265660B1 - 반도체재료의중간층평탄화장치에사용되는폴리싱패트 - Google Patents

반도체재료의중간층평탄화장치에사용되는폴리싱패트 Download PDF

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Publication number
KR100265660B1
KR100265660B1 KR1019930001293A KR930001293A KR100265660B1 KR 100265660 B1 KR100265660 B1 KR 100265660B1 KR 1019930001293 A KR1019930001293 A KR 1019930001293A KR 930001293 A KR930001293 A KR 930001293A KR 100265660 B1 KR100265660 B1 KR 100265660B1
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South Korea
Prior art keywords
pad
layer
planarization
volume
wafer
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Expired - Lifetime
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KR1019930001293A
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Korean (ko)
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KR930017105A (ko
Inventor
토마스씨.하이드
존에이취.브이.로버츠
Original Assignee
콘라드 에스. 캐딩
로델, 인코포레이티드
도날드 엠. 잭슨
웨스테크시스템즈인코포레이티드
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Application filed by 콘라드 에스. 캐딩, 로델, 인코포레이티드, 도날드 엠. 잭슨, 웨스테크시스템즈인코포레이티드 filed Critical 콘라드 에스. 캐딩
Publication of KR930017105A publication Critical patent/KR930017105A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1019930001293A 1992-01-31 1993-01-30 반도체재료의중간층평탄화장치에사용되는폴리싱패트 Expired - Lifetime KR100265660B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/829,736 1992-01-31
US07/829,736 US5257478A (en) 1990-03-22 1992-01-31 Apparatus for interlayer planarization of semiconductor material
US07/829/736 1992-01-31

Publications (2)

Publication Number Publication Date
KR930017105A KR930017105A (ko) 1993-08-30
KR100265660B1 true KR100265660B1 (ko) 2000-11-01

Family

ID=25255407

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930001293A Expired - Lifetime KR100265660B1 (ko) 1992-01-31 1993-01-30 반도체재료의중간층평탄화장치에사용되는폴리싱패트

Country Status (7)

Country Link
US (1) US5257478A (https=)
EP (1) EP0555660B1 (https=)
JP (1) JP3455556B2 (https=)
KR (1) KR100265660B1 (https=)
CN (1) CN1076152A (https=)
DE (1) DE69308915T2 (https=)
TW (1) TW222033B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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EP0555660A2 (en) 1993-08-18
US5257478A (en) 1993-11-02
CN1076152A (zh) 1993-09-15
EP0555660B1 (en) 1997-03-19
DE69308915T2 (de) 1997-09-04
DE69308915D1 (de) 1997-04-24
TW222033B (https=) 1994-04-01
EP0555660A3 (https=) 1994-03-23
JPH0621028A (ja) 1994-01-28
KR930017105A (ko) 1993-08-30

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