TW222033B - - Google Patents

Info

Publication number
TW222033B
TW222033B TW082104097A TW82104097A TW222033B TW 222033 B TW222033 B TW 222033B TW 082104097 A TW082104097 A TW 082104097A TW 82104097 A TW82104097 A TW 82104097A TW 222033 B TW222033 B TW 222033B
Authority
TW
Taiwan
Application number
TW082104097A
Original Assignee
Westech Systems Inc
Rodel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westech Systems Inc, Rodel Inc filed Critical Westech Systems Inc
Application granted granted Critical
Publication of TW222033B publication Critical patent/TW222033B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
TW082104097A 1992-01-31 1993-05-25 TW222033B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/829,736 US5257478A (en) 1990-03-22 1992-01-31 Apparatus for interlayer planarization of semiconductor material

Publications (1)

Publication Number Publication Date
TW222033B true TW222033B (zh) 1994-04-01

Family

ID=25255407

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082104097A TW222033B (zh) 1992-01-31 1993-05-25

Country Status (7)

Country Link
US (1) US5257478A (zh)
EP (1) EP0555660B1 (zh)
JP (1) JP3455556B2 (zh)
KR (1) KR100265660B1 (zh)
CN (1) CN1076152A (zh)
DE (1) DE69308915T2 (zh)
TW (1) TW222033B (zh)

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JP6016301B2 (ja) 2013-02-13 2016-10-26 昭和電工株式会社 単結晶ＳｉＣ基板の表面加工方法、その製造方法及び単結晶ＳｉＣ基板の表面加工用研削プレート
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CN106575613B (zh) 2014-05-07 2019-12-17 嘉柏微电子材料股份公司 用于化学机械抛光的多层抛光垫
TWI727011B (zh) 2016-03-09 2021-05-11 美商應用材料股份有限公司 添加劑製造系統、用於添加劑製造系統之電腦程式產品、以及利用添加劑製造系統來製造物體的方法
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US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
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CN112338820B (zh) * 2020-10-27 2021-10-29 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、应用

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Also Published As

Publication number Publication date
JPH0621028A (ja) 1994-01-28
EP0555660A3 (zh) 1994-03-23
EP0555660A2 (en) 1993-08-18
CN1076152A (zh) 1993-09-15
DE69308915D1 (de) 1997-04-24
JP3455556B2 (ja) 2003-10-14
DE69308915T2 (de) 1997-09-04
US5257478A (en) 1993-11-02
EP0555660B1 (en) 1997-03-19
KR930017105A (ko) 1993-08-30
KR100265660B1 (ko) 2000-11-01

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