KR100241292B1 - 반도체 처리 시스템 및 그 실어옮김기구를 위한 위치맞춤방법 및 장치 - Google Patents

반도체 처리 시스템 및 그 실어옮김기구를 위한 위치맞춤방법 및 장치 Download PDF

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Publication number
KR100241292B1
KR100241292B1 KR1019940019357A KR19940019357A KR100241292B1 KR 100241292 B1 KR100241292 B1 KR 100241292B1 KR 1019940019357 A KR1019940019357 A KR 1019940019357A KR 19940019357 A KR19940019357 A KR 19940019357A KR 100241292 B1 KR100241292 B1 KR 100241292B1
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South Korea
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holder
handler
relative position
marks
imaging
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1019940019357A
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English (en)
Korean (ko)
Other versions
KR950007012A (ko
Inventor
고오키 구로다
Original Assignee
다카시마 히로시
도오교오 에레구토론 큐우슈우 가부시키 가이샤
히가시 데쓰로
동경 엘렉트론주식회사
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Application filed by 다카시마 히로시, 도오교오 에레구토론 큐우슈우 가부시키 가이샤, 히가시 데쓰로, 동경 엘렉트론주식회사 filed Critical 다카시마 히로시
Publication of KR950007012A publication Critical patent/KR950007012A/ko
Application granted granted Critical
Publication of KR100241292B1 publication Critical patent/KR100241292B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10P72/0416—
    • H10P52/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019940019357A 1993-08-05 1994-08-05 반도체 처리 시스템 및 그 실어옮김기구를 위한 위치맞춤방법 및 장치 Expired - Fee Related KR100241292B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21487893 1993-08-05
JP93-214878 1993-08-05

Publications (2)

Publication Number Publication Date
KR950007012A KR950007012A (ko) 1995-03-21
KR100241292B1 true KR100241292B1 (ko) 2000-02-01

Family

ID=16663069

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940019357A Expired - Fee Related KR100241292B1 (ko) 1993-08-05 1994-08-05 반도체 처리 시스템 및 그 실어옮김기구를 위한 위치맞춤방법 및 장치

Country Status (3)

Country Link
US (1) US5566076A (enExample)
KR (1) KR100241292B1 (enExample)
TW (1) TW288189B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19544328B4 (de) * 1994-11-29 2014-03-20 Ebara Corp. Poliervorrichtung
US5740053A (en) * 1995-07-31 1998-04-14 Tokyo Electron Limited Method of controlling monitor used in cleaning machine and object processing machine and monitor apparatus
US5731678A (en) * 1996-07-15 1998-03-24 Semitool, Inc. Processing head for semiconductor processing machines
JPH10112493A (ja) * 1996-08-13 1998-04-28 Sony Corp 表面矯正薄板保持装置、面調整手段及び向き調整手段
US5893795A (en) * 1997-07-11 1999-04-13 Applied Materials, Inc. Apparatus for moving a cassette
US6106736A (en) * 1997-09-04 2000-08-22 International Business Machines Corporation Planarization process and apparatus for the etch definition of magnetic head air bearing surfaces
JP4696373B2 (ja) * 2001-02-20 2011-06-08 東京エレクトロン株式会社 処理システム及び被処理体の搬送方法
DE10122669A1 (de) * 2001-05-10 2002-12-12 Mattson Wet Products Gmbh Vorrichtung zum Nassreinigen von scheibenförmigen Substraten
JP5224744B2 (ja) * 2006-10-04 2013-07-03 株式会社日立国際電気 基板処理装置
KR100783072B1 (ko) * 2006-12-27 2007-12-07 세메스 주식회사 기판 처리 장치
KR101231182B1 (ko) 2007-09-12 2013-02-07 삼성전자주식회사 반도체 세정 설비의 웨이퍼 브로큰 방지용 웨이퍼 가이드
ITUD20070197A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Dispositivo e procedimento di allineamento per allineare piastre per circuiti elettronici
KR101708420B1 (ko) * 2010-09-15 2017-02-21 삼성디스플레이 주식회사 기판 증착 시스템 및 이를 이용한 증착 방법
NL2008007A (en) 2011-01-20 2012-07-23 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
SG11201503659QA (en) * 2012-11-28 2015-06-29 Acm Research Shanghai Inc Method and apparatus for cleaning semiconductor wafer
JP7648306B2 (ja) * 2021-06-04 2025-03-18 東京エレクトロン株式会社 情報処理装置、移載位置補正方法及び基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164905A (en) * 1987-08-12 1992-11-17 Hitachi, Ltd. Production system with order of processing determination
US5220935A (en) * 1990-12-28 1993-06-22 Carolina Equipment & Supply Co., Inc. Apparatus and method for cleaning with a focused fluid stream
US5263504A (en) * 1990-12-28 1993-11-23 Carolina Equipment And Supply Company, Inc. Apparatus and method for cleaning with a focused fluid stream
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus

Also Published As

Publication number Publication date
US5566076A (en) 1996-10-15
TW288189B (enExample) 1996-10-11
KR950007012A (ko) 1995-03-21

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