KR100240373B1 - 인쇄 회로판용 기판 - Google Patents

인쇄 회로판용 기판 Download PDF

Info

Publication number
KR100240373B1
KR100240373B1 KR1019920015605A KR920015605A KR100240373B1 KR 100240373 B1 KR100240373 B1 KR 100240373B1 KR 1019920015605 A KR1019920015605 A KR 1019920015605A KR 920015605 A KR920015605 A KR 920015605A KR 100240373 B1 KR100240373 B1 KR 100240373B1
Authority
KR
South Korea
Prior art keywords
formula
substituted
substrate
alkyl
aryl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920015605A
Other languages
English (en)
Korean (ko)
Other versions
KR930005521A (ko
Inventor
켄지이시이
요시노리콘도
히로유끼마쯔모또
노리오사야마
Original Assignee
오히라 아끼라
미쯔비시 가스 케미칼 컴파니, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오히라 아끼라, 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 filed Critical 오히라 아끼라
Publication of KR930005521A publication Critical patent/KR930005521A/ko
Application granted granted Critical
Publication of KR100240373B1 publication Critical patent/KR100240373B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1019920015605A 1991-08-28 1992-08-28 인쇄 회로판용 기판 Expired - Fee Related KR100240373B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP242781/91 1991-08-28
JP242779/91 1991-08-28
JP242780/91 1991-08-28
JP24278191 1991-08-28
JP24277991 1991-08-28
JP24278091 1991-08-28

Publications (2)

Publication Number Publication Date
KR930005521A KR930005521A (ko) 1993-03-23
KR100240373B1 true KR100240373B1 (ko) 2000-01-15

Family

ID=27333076

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920015605A Expired - Fee Related KR100240373B1 (ko) 1991-08-28 1992-08-28 인쇄 회로판용 기판

Country Status (5)

Country Link
US (1) US5314740A (enExample)
EP (1) EP0530036B1 (enExample)
KR (1) KR100240373B1 (enExample)
DE (1) DE69214581T2 (enExample)
TW (1) TW203675B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW350194B (en) * 1994-11-30 1999-01-11 Mitsubishi Gas Chemical Co Metal-foil-clad composite ceramic board and process for the production thereof the invention relates to the metal-foil-clad composite ceramic board and process for the production
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
US5837356A (en) * 1995-09-22 1998-11-17 Kyocera Corporation Wiring board and method for manufacturing the same
EP0989172A1 (en) * 1998-09-24 2000-03-29 Hitachi Chemical Co., Ltd. Adhesive composition for metal foil, adhesive-coated metal foil, metal clad laminate and related materials using the same
KR100353397B1 (ko) * 2000-02-01 2002-09-18 박용선 음이온 접착제 및 그의 제조방법
US20060019102A1 (en) * 2004-07-26 2006-01-26 Kuppsuamy Kanakarajan Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto
KR100594299B1 (ko) * 2004-10-29 2006-06-30 삼성전자주식회사 유연성 인쇄 회로 및 이것이 구비된 하드 디스크 드라이브
KR20060045208A (ko) * 2004-11-12 2006-05-17 삼성테크윈 주식회사 반도체 팩키지용 회로기판 및 이의 제조방법
FR2927077B1 (fr) * 2008-01-31 2012-05-25 Commissariat Energie Atomique Derives du 1,8-naphtalimide en tant qu'agents de scintillation notamment pour la discrimination entre les neutrons rapides et les rayons gamma
US9201015B2 (en) 2011-07-14 2015-12-01 International Business Machines Corporation Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4965208A (en) * 1983-07-29 1990-10-23 At&T Bell Laboratories Inspection of multipattern circuit boards
US4774188A (en) * 1983-07-29 1988-09-27 American Telephone And Telegraph Company, At&T Bell Laboratories Control of circuit board quality
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US5160787A (en) * 1989-01-12 1992-11-03 Mitsubishi Gas Chemical Company, Inc. Electrical laminate having ability to absorb ultraviolet rays

Also Published As

Publication number Publication date
US5314740A (en) 1994-05-24
EP0530036B1 (en) 1996-10-16
DE69214581D1 (de) 1996-11-21
DE69214581T2 (de) 1997-02-27
KR930005521A (ko) 1993-03-23
EP0530036A1 (en) 1993-03-03
TW203675B (enExample) 1993-04-11

Similar Documents

Publication Publication Date Title
KR100240373B1 (ko) 인쇄 회로판용 기판
KR100225272B1 (ko) 인쇄 회로판용 기판
US4774188A (en) Control of circuit board quality
US4965208A (en) Inspection of multipattern circuit boards
JPH05191000A (ja) プリント配線用基板
JPH02227442A (ja) 紫外線吸収能を有する電気用積層板
JP3121096B2 (ja) 紫外線遮蔽性銅張積層板
KR0182828B1 (ko) 형광검출방식 자동외관검사용 난연성 동박적층판용 수지조성물
KR0126634B1 (ko) 형광방식 자동외관검사를 위한 동박 적층판용 에폭시 수지조성물
KR100218705B1 (ko) 형광검출방식 자동 외관검사용 난연성 동박적층판용 수지조성물
JPH0576796B2 (enExample)
JPH032258A (ja) 樹脂組成物、プリプレグおよび積層板
JPH0682899B2 (ja) 紫外線遮蔽回路基板の製造方法
JPH05186762A (ja) 紫外線吸収剤、樹脂組成物、プリプレグおよび積層板
KR0124396B1 (ko) 동박 적층판용 에폭시 수지조성물
JPH032547A (ja) 回路パターンの検査法
JPH11228718A (ja) プリプレグ、積層板及びプリント配線板
JPH03262185A (ja) 紫外線遮蔽回路用基板の製造方法
JPH0919976A (ja) コンポジット積層板
JPH06112607A (ja) 蛍光方式光学検査機対応回路基板
JPH0253834A (ja) 印刷回路用積層板の製造方法
JPH032549A (ja) 回路パターンの検査法
JPH032548A (ja) 回路パターンの検査法
JPS635930A (ja) 金属箔張積層板の製造方法
JPH04216694A (ja) 紫外線遮蔽回路基板の製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20021028

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20021028