KR100238566B1 - 전기용 적층판을 위한 에폭시 수지 조성물 - Google Patents
전기용 적층판을 위한 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR100238566B1 KR100238566B1 KR1019920009705A KR920009705A KR100238566B1 KR 100238566 B1 KR100238566 B1 KR 100238566B1 KR 1019920009705 A KR1019920009705 A KR 1019920009705A KR 920009705 A KR920009705 A KR 920009705A KR 100238566 B1 KR100238566 B1 KR 100238566B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- cyclic terpene
- compound
- resin composition
- terpene skeleton
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16232091A JP3231808B2 (ja) | 1991-06-07 | 1991-06-07 | 電気積層板用エポキシ樹脂組成物 |
| JP91-162320 | 1991-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930000599A KR930000599A (ko) | 1993-01-15 |
| KR100238566B1 true KR100238566B1 (ko) | 2000-01-15 |
Family
ID=15752293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920009705A Expired - Fee Related KR100238566B1 (ko) | 1991-06-07 | 1992-06-04 | 전기용 적층판을 위한 에폭시 수지 조성물 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0517337B1 (enExample) |
| JP (1) | JP3231808B2 (enExample) |
| KR (1) | KR100238566B1 (enExample) |
| CA (1) | CA2070618A1 (enExample) |
| DE (1) | DE69229932T2 (enExample) |
| ES (1) | ES2135395T3 (enExample) |
| TW (1) | TW198052B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW340967B (en) * | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
| KR100419063B1 (ko) * | 2000-06-10 | 2004-02-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 및 이를 이용한 적층판 |
| JP2025025222A (ja) * | 2023-08-09 | 2025-02-21 | 日本化薬株式会社 | エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1325208A (fr) * | 1961-05-03 | 1963-04-26 | Heyden Newport Chemical Corp | Perfectionnements apportés aux éthers polyglycidyliques et aux procédés pour leur production |
| US3378525A (en) | 1964-12-03 | 1968-04-16 | Union Carbide Corp | Epoxy resins from polyhydric phenolterpene addition products |
| DE1595633A1 (de) * | 1966-05-27 | 1970-03-19 | Hoechst Ag | Verfahren zur Herstellung von Harzen |
-
1991
- 1991-06-07 JP JP16232091A patent/JP3231808B2/ja not_active Expired - Fee Related
-
1992
- 1992-06-04 ES ES92201624T patent/ES2135395T3/es not_active Expired - Lifetime
- 1992-06-04 KR KR1019920009705A patent/KR100238566B1/ko not_active Expired - Fee Related
- 1992-06-04 EP EP92201624A patent/EP0517337B1/en not_active Expired - Lifetime
- 1992-06-04 DE DE69229932T patent/DE69229932T2/de not_active Expired - Fee Related
- 1992-06-05 CA CA002070618A patent/CA2070618A1/en not_active Abandoned
- 1992-06-16 TW TW081104694A patent/TW198052B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR930000599A (ko) | 1993-01-15 |
| CA2070618A1 (en) | 1992-12-08 |
| JPH04359920A (ja) | 1992-12-14 |
| JP3231808B2 (ja) | 2001-11-26 |
| DE69229932T2 (de) | 2000-03-16 |
| EP0517337A3 (en) | 1992-12-30 |
| EP0517337A2 (en) | 1992-12-09 |
| TW198052B (enExample) | 1993-01-11 |
| ES2135395T3 (es) | 1999-11-01 |
| EP0517337B1 (en) | 1999-09-08 |
| DE69229932D1 (de) | 1999-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6451878B1 (en) | High molecular weight epoxy resin and resinous composition for printed circuit board | |
| KR20080078848A (ko) | 혼합 촉매 시스템을 함유하는 경화성 에폭시 수지 조성물및 이로부터 제조된 적층물 | |
| US4529790A (en) | Epoxy resin composition | |
| JP2003252951A (ja) | 高分子量エポキシ樹脂とその製造方法、該エポキシ樹脂を用いた電気積層板用樹脂組成物及び電気積層板 | |
| JPH073123A (ja) | エポキシ樹脂組成物 | |
| JP2003342350A (ja) | 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板 | |
| KR100238566B1 (ko) | 전기용 적층판을 위한 에폭시 수지 조성물 | |
| JP3141962B2 (ja) | エポキシ樹脂組成物及びその硬化物 | |
| KR100239886B1 (ko) | 에폭시수지, 에폭시 수지 조성물 및 그를 함유하는 적층판 | |
| JPH08193110A (ja) | ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 | |
| KR100283882B1 (ko) | 에폭시수지조성물 및 구리피복적층판 | |
| US5364925A (en) | Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates | |
| JP3647488B2 (ja) | エポキシ樹脂及びエポキシ樹脂組成物 | |
| JP2997945B2 (ja) | エポキシ樹脂の製造方法 | |
| JPH07330645A (ja) | ポリフェノール類化合物、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 | |
| JP2702226B2 (ja) | 耐熱難燃性エポキシ樹脂組成物 | |
| JP3305031B2 (ja) | エポキシ樹脂及びエポキシ樹脂組成物 | |
| JPH05255476A (ja) | エポキシ樹脂組成物 | |
| JP3963106B2 (ja) | エポキシ樹脂組成物及びその硬化物 | |
| JP2005187607A (ja) | フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 | |
| EP0497284A2 (en) | Epoxy resin compositions for use in electrical laminates | |
| EP0606947A1 (en) | Epoxy resin and epoxy resin compositions for electric laminates | |
| JP3460197B2 (ja) | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 | |
| JPH0641273A (ja) | エポキシ樹脂組成物及びその硬化物 | |
| JPH01182328A (ja) | 難燃性フェノール樹脂積層板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20021015 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20021015 |