KR100238566B1 - 전기용 적층판을 위한 에폭시 수지 조성물 - Google Patents

전기용 적층판을 위한 에폭시 수지 조성물 Download PDF

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Publication number
KR100238566B1
KR100238566B1 KR1019920009705A KR920009705A KR100238566B1 KR 100238566 B1 KR100238566 B1 KR 100238566B1 KR 1019920009705 A KR1019920009705 A KR 1019920009705A KR 920009705 A KR920009705 A KR 920009705A KR 100238566 B1 KR100238566 B1 KR 100238566B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
cyclic terpene
compound
resin composition
terpene skeleton
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920009705A
Other languages
English (en)
Korean (ko)
Other versions
KR930000599A (ko
Inventor
이무라테추로오
마사유키 오오타
푸쿠자와타카오
Original Assignee
오노 알버어스
셀 인터나쵸 나아레 레사아치 마아츠 샤피 비이부 이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오노 알버어스, 셀 인터나쵸 나아레 레사아치 마아츠 샤피 비이부 이 filed Critical 오노 알버어스
Publication of KR930000599A publication Critical patent/KR930000599A/ko
Application granted granted Critical
Publication of KR100238566B1 publication Critical patent/KR100238566B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3218Carbocyclic compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1019920009705A 1991-06-07 1992-06-04 전기용 적층판을 위한 에폭시 수지 조성물 Expired - Fee Related KR100238566B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16232091A JP3231808B2 (ja) 1991-06-07 1991-06-07 電気積層板用エポキシ樹脂組成物
JP91-162320 1991-06-07

Publications (2)

Publication Number Publication Date
KR930000599A KR930000599A (ko) 1993-01-15
KR100238566B1 true KR100238566B1 (ko) 2000-01-15

Family

ID=15752293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920009705A Expired - Fee Related KR100238566B1 (ko) 1991-06-07 1992-06-04 전기용 적층판을 위한 에폭시 수지 조성물

Country Status (7)

Country Link
EP (1) EP0517337B1 (enExample)
JP (1) JP3231808B2 (enExample)
KR (1) KR100238566B1 (enExample)
CA (1) CA2070618A1 (enExample)
DE (1) DE69229932T2 (enExample)
ES (1) ES2135395T3 (enExample)
TW (1) TW198052B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
KR100419063B1 (ko) * 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판
JP2025025222A (ja) * 2023-08-09 2025-02-21 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、硬化物及び炭素繊維強化複合材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1325208A (fr) * 1961-05-03 1963-04-26 Heyden Newport Chemical Corp Perfectionnements apportés aux éthers polyglycidyliques et aux procédés pour leur production
US3378525A (en) 1964-12-03 1968-04-16 Union Carbide Corp Epoxy resins from polyhydric phenolterpene addition products
DE1595633A1 (de) * 1966-05-27 1970-03-19 Hoechst Ag Verfahren zur Herstellung von Harzen

Also Published As

Publication number Publication date
KR930000599A (ko) 1993-01-15
CA2070618A1 (en) 1992-12-08
JPH04359920A (ja) 1992-12-14
JP3231808B2 (ja) 2001-11-26
DE69229932T2 (de) 2000-03-16
EP0517337A3 (en) 1992-12-30
EP0517337A2 (en) 1992-12-09
TW198052B (enExample) 1993-01-11
ES2135395T3 (es) 1999-11-01
EP0517337B1 (en) 1999-09-08
DE69229932D1 (de) 1999-10-14

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