KR930000599A - 전기용 적층판을 위한 에폭시 수지 조성물 - Google Patents

전기용 적층판을 위한 에폭시 수지 조성물 Download PDF

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Publication number
KR930000599A
KR930000599A KR1019920009705A KR920009705A KR930000599A KR 930000599 A KR930000599 A KR 930000599A KR 1019920009705 A KR1019920009705 A KR 1019920009705A KR 920009705 A KR920009705 A KR 920009705A KR 930000599 A KR930000599 A KR 930000599A
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KR
South Korea
Prior art keywords
epoxy resin
cyclic terpene
compound
resin composition
polyhydric phenol
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Application number
KR1019920009705A
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English (en)
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KR100238566B1 (ko
Inventor
테추로오 이무라
마사유키 오오타
타카오 푸쿠자와
Original Assignee
알베르투스 빌헬무스 요 아네스 째스트 라텐
셀 인터나쵸 나아레 레사아치 마아츠샤피 비이부이
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Application filed by 알베르투스 빌헬무스 요 아네스 째스트 라텐, 셀 인터나쵸 나아레 레사아치 마아츠샤피 비이부이 filed Critical 알베르투스 빌헬무스 요 아네스 째스트 라텐
Publication of KR930000599A publication Critical patent/KR930000599A/ko
Application granted granted Critical
Publication of KR100238566B1 publication Critical patent/KR100238566B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

전기용 적층판을 위한 에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 에폭시 수지, 경화제, 및 용매로 구성되며, 상기 에폭시 수지는(1) 페놀 화합물을 시클릭 테르펜 화합물과 반응시켜 시클릭 테르펜 골격-함유 다가 페놀 화합물을 제공하고, 연속적으로 에피할로 히드린과 반응하여 생성되는 시클릭 테르펜 골격-함유 에폭시 수지, (2)상기 시클릭 테르펜 골격-함유 에폭시 수지(1) 및 다가 페놀화합물의 반응 생성물인 에폭시 수지, 및 (3)상기 시클릭 테르펜 골격-함유 에폭시 수지(1), 다른 에폭시 수지, 및 다가 페놀 화합물의 반응 생성물인 에폭시 수지로 구성된 군으로부터 선택되는 적어도 한 종류의 시클릭 테르펜 골격-함유 에폭시 수지임을 특징으로 하는 전기용 적층판에 사용하기 위한 에폭시 수지 조성물.
  2. 제1항에 있어서, (1)의 제조에 사용되는 시클릭 테르펜 화합물은 리모넨, 디펜텐, 테르피놀렌, 피넨, 테르피넨 및 멘타디엔으로 구성된 군으로부터 선택되는 에폭시 수지 조성물.
  3. 제2항에 있어서, 시클릭 테르펜 화합물은 리모넨인 에폭시 수지 조성물.
  4. 제1 내지 제3항의 어느 한 항에 있어서, (1)의 제조에 사용되는 페놀 화합물은 페놀, 크레졸, 크실레놀, 프로필레놀, 노닐페놀, 히드로퀴논, 레졸시놀, 메톡시페놀, 브로모페놀, 비스페놀 A 및 비스페놀 F로 구성된 군으로부터 선택되는 에폭시 수지 조성물.
  5. 제4항에 있어서, 페놀 화합물은 페놀인 에폭시 수지 조성물.
  6. 제1 내지 5항의 어느 한 항에 있어서, (1)의 제조에 사용되는 시클릭 테르펜 골격-함유 다가 페놀 화합물은 시클릭 테르펜 화합물 몰당 페놀 화합물 2 내지 8몰을 반응시킴으로 제조된 에폭시 수지 조성물.
  7. 제1 내지 6항의 어느 한 항에 있어서, (2) 또는 (3)의 제조에 사용되는 다가 페놀 화합물은 테트라브로모비스페놀 A인 에폭시 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920009705A 1991-06-07 1992-06-04 전기용 적층판을 위한 에폭시 수지 조성물 KR100238566B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-162320 1991-06-07
JP16232091A JP3231808B2 (ja) 1991-06-07 1991-06-07 電気積層板用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
KR930000599A true KR930000599A (ko) 1993-01-15
KR100238566B1 KR100238566B1 (ko) 2000-01-15

Family

ID=15752293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920009705A KR100238566B1 (ko) 1991-06-07 1992-06-04 전기용 적층판을 위한 에폭시 수지 조성물

Country Status (7)

Country Link
EP (1) EP0517337B1 (ko)
JP (1) JP3231808B2 (ko)
KR (1) KR100238566B1 (ko)
CA (1) CA2070618A1 (ko)
DE (1) DE69229932T2 (ko)
ES (1) ES2135395T3 (ko)
TW (1) TW198052B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
KR100419063B1 (ko) * 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1325208A (fr) * 1961-05-03 1963-04-26 Heyden Newport Chemical Corp Perfectionnements apportés aux éthers polyglycidyliques et aux procédés pour leur production
US3378525A (en) * 1964-12-03 1968-04-16 Union Carbide Corp Epoxy resins from polyhydric phenolterpene addition products
DE1595633A1 (de) * 1966-05-27 1970-03-19 Hoechst Ag Verfahren zur Herstellung von Harzen

Also Published As

Publication number Publication date
EP0517337A3 (en) 1992-12-30
KR100238566B1 (ko) 2000-01-15
EP0517337A2 (en) 1992-12-09
EP0517337B1 (en) 1999-09-08
JP3231808B2 (ja) 2001-11-26
ES2135395T3 (es) 1999-11-01
CA2070618A1 (en) 1992-12-08
TW198052B (ko) 1993-01-11
DE69229932T2 (de) 2000-03-16
JPH04359920A (ja) 1992-12-14
DE69229932D1 (de) 1999-10-14

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