TW198052B - - Google Patents

Info

Publication number
TW198052B
TW198052B TW081104694A TW81104694A TW198052B TW 198052 B TW198052 B TW 198052B TW 081104694 A TW081104694 A TW 081104694A TW 81104694 A TW81104694 A TW 81104694A TW 198052 B TW198052 B TW 198052B
Authority
TW
Taiwan
Application number
TW081104694A
Original Assignee
Shell Internat Res Schappej B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Internat Res Schappej B V filed Critical Shell Internat Res Schappej B V
Application granted granted Critical
Publication of TW198052B publication Critical patent/TW198052B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW081104694A 1991-06-07 1992-06-16 TW198052B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16232091A JP3231808B2 (ja) 1991-06-07 1991-06-07 電気積層板用エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
TW198052B true TW198052B (zh) 1993-01-11

Family

ID=15752293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081104694A TW198052B (zh) 1991-06-07 1992-06-16

Country Status (7)

Country Link
EP (1) EP0517337B1 (zh)
JP (1) JP3231808B2 (zh)
KR (1) KR100238566B1 (zh)
CA (1) CA2070618A1 (zh)
DE (1) DE69229932T2 (zh)
ES (1) ES2135395T3 (zh)
TW (1) TW198052B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
KR100419063B1 (ko) 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1325208A (fr) * 1961-05-03 1963-04-26 Heyden Newport Chemical Corp Perfectionnements apportés aux éthers polyglycidyliques et aux procédés pour leur production
US3378525A (en) * 1964-12-03 1968-04-16 Union Carbide Corp Epoxy resins from polyhydric phenolterpene addition products
DE1595633A1 (de) * 1966-05-27 1970-03-19 Hoechst Ag Verfahren zur Herstellung von Harzen

Also Published As

Publication number Publication date
DE69229932T2 (de) 2000-03-16
EP0517337A3 (en) 1992-12-30
JPH04359920A (ja) 1992-12-14
KR100238566B1 (ko) 2000-01-15
DE69229932D1 (de) 1999-10-14
CA2070618A1 (en) 1992-12-08
JP3231808B2 (ja) 2001-11-26
KR930000599A (ko) 1993-01-15
EP0517337A2 (en) 1992-12-09
EP0517337B1 (en) 1999-09-08
ES2135395T3 (es) 1999-11-01

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