DE69229932T2 - Epoxydharzzusammensetzung für elektrische Schichtstoffe - Google Patents

Epoxydharzzusammensetzung für elektrische Schichtstoffe

Info

Publication number
DE69229932T2
DE69229932T2 DE69229932T DE69229932T DE69229932T2 DE 69229932 T2 DE69229932 T2 DE 69229932T2 DE 69229932 T DE69229932 T DE 69229932T DE 69229932 T DE69229932 T DE 69229932T DE 69229932 T2 DE69229932 T2 DE 69229932T2
Authority
DE
Germany
Prior art keywords
resin composition
epoxy resin
electrical laminates
laminates
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69229932T
Other languages
English (en)
Other versions
DE69229932D1 (de
Inventor
Tetsuroh Imura
Masayuki Ohta
Takao Fukuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shell Internationale Research Maatschappij BV
Original Assignee
Shell Internationale Research Maatschappij BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Internationale Research Maatschappij BV filed Critical Shell Internationale Research Maatschappij BV
Application granted granted Critical
Publication of DE69229932D1 publication Critical patent/DE69229932D1/de
Publication of DE69229932T2 publication Critical patent/DE69229932T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
DE69229932T 1991-06-07 1992-06-04 Epoxydharzzusammensetzung für elektrische Schichtstoffe Expired - Fee Related DE69229932T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16232091A JP3231808B2 (ja) 1991-06-07 1991-06-07 電気積層板用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
DE69229932D1 DE69229932D1 (de) 1999-10-14
DE69229932T2 true DE69229932T2 (de) 2000-03-16

Family

ID=15752293

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69229932T Expired - Fee Related DE69229932T2 (de) 1991-06-07 1992-06-04 Epoxydharzzusammensetzung für elektrische Schichtstoffe

Country Status (7)

Country Link
EP (1) EP0517337B1 (de)
JP (1) JP3231808B2 (de)
KR (1) KR100238566B1 (de)
CA (1) CA2070618A1 (de)
DE (1) DE69229932T2 (de)
ES (1) ES2135395T3 (de)
TW (1) TW198052B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
KR100419063B1 (ko) 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1325208A (fr) * 1961-05-03 1963-04-26 Heyden Newport Chemical Corp Perfectionnements apportés aux éthers polyglycidyliques et aux procédés pour leur production
US3378525A (en) * 1964-12-03 1968-04-16 Union Carbide Corp Epoxy resins from polyhydric phenolterpene addition products
DE1595633A1 (de) * 1966-05-27 1970-03-19 Hoechst Ag Verfahren zur Herstellung von Harzen

Also Published As

Publication number Publication date
EP0517337B1 (de) 1999-09-08
JP3231808B2 (ja) 2001-11-26
ES2135395T3 (es) 1999-11-01
EP0517337A2 (de) 1992-12-09
JPH04359920A (ja) 1992-12-14
DE69229932D1 (de) 1999-10-14
KR100238566B1 (ko) 2000-01-15
TW198052B (de) 1993-01-11
EP0517337A3 (de) 1992-12-30
KR930000599A (ko) 1993-01-15
CA2070618A1 (en) 1992-12-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee