DE68926073D1 - Harzzusammensetzung für Laminate - Google Patents

Harzzusammensetzung für Laminate

Info

Publication number
DE68926073D1
DE68926073D1 DE68926073T DE68926073T DE68926073D1 DE 68926073 D1 DE68926073 D1 DE 68926073D1 DE 68926073 T DE68926073 T DE 68926073T DE 68926073 T DE68926073 T DE 68926073T DE 68926073 D1 DE68926073 D1 DE 68926073D1
Authority
DE
Germany
Prior art keywords
laminates
resin composition
resin
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68926073T
Other languages
English (en)
Other versions
DE68926073T2 (de
Inventor
Hiroyuki Mitsubishi D Nakajima
Takashi Mitsubishi De Takahama
Fumiyuki Mitsubishi D Miyamoto
Seiji Mitsubishi Denki K K Oka
Toshio Mitsubishi Denki Isooka
Yoshihiro Mitsubishi Maruyama
Yasushi Mitsubishi De Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE68926073D1 publication Critical patent/DE68926073D1/de
Application granted granted Critical
Publication of DE68926073T2 publication Critical patent/DE68926073T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
DE68926073T 1988-07-20 1989-07-12 Harzzusammensetzung für Laminate Expired - Fee Related DE68926073T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63181209A JPH0760918B2 (ja) 1988-07-20 1988-07-20 積層用樹脂組成物

Publications (2)

Publication Number Publication Date
DE68926073D1 true DE68926073D1 (de) 1996-05-02
DE68926073T2 DE68926073T2 (de) 1996-10-31

Family

ID=16096738

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68926073T Expired - Fee Related DE68926073T2 (de) 1988-07-20 1989-07-12 Harzzusammensetzung für Laminate

Country Status (4)

Country Link
US (1) US5091481A (de)
EP (1) EP0352550B1 (de)
JP (1) JPH0760918B2 (de)
DE (1) DE68926073T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0394965A3 (de) * 1989-04-25 1991-12-18 Mitsubishi Denki Kabushiki Kaisha Harzzusammensetzung für Laminate
US5661223A (en) * 1989-04-25 1997-08-26 Mitsubishi Denki Kabushiki Kaisha Composition of phenolic resin-modified epoxy resin and straight chain polymer
EP0436212A3 (en) * 1990-01-02 1992-07-29 General Electric Company Polyphenylene ether-polyepoxide compositions rapidly curable to flame retardant, solderable materials
US6893736B2 (en) 2001-11-19 2005-05-17 Henkel Corporation Thermosetting resin compositions useful as underfill sealants
TWI300083B (en) * 2003-04-25 2008-08-21 Mitsui Chemicals Inc Epoxy resin and its usage
GB2436106B (en) * 2006-01-21 2011-10-19 Advanced Composites Group Ltd Resinous materials, articles made therewith and methods of producing same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141419A (en) * 1981-02-27 1982-09-01 Mitsubishi Petrochem Co Ltd Production of polyepoxide
JPS5825327A (ja) * 1981-08-06 1983-02-15 Ube Ind Ltd エポキシ樹脂用硬化剤
JPS5883032A (ja) * 1981-11-13 1983-05-18 Toho Rayon Co Ltd エポキシ樹脂含浸プリプレグ
US4567216A (en) * 1983-12-22 1986-01-28 Union Carbide Corporation Thermoplastic modified epoxy compositions
US4645803A (en) * 1984-02-29 1987-02-24 American Cyanamid Company Curable epoxy resin compositions
US4593056A (en) * 1985-06-21 1986-06-03 Union Carbide Corporation Epoxy/aromatic amine resin systems containing aromatic trihydroxy compounds as cure accelerators
US4623701A (en) * 1985-07-10 1986-11-18 The Dow Chemical Company Multifunctional epoxy resins
JPS62207322A (ja) * 1986-03-07 1987-09-11 Mitsubishi Electric Corp 熱硬化性樹脂組成物
EP0264705A3 (de) * 1986-10-10 1990-10-31 The Dow Chemical Company Mischungen auf der Basis von Epoxydharzen mit relativ niedrigem Molekulargewicht und Epoxyd- oder Phenoxyharzen mit relativ hohem Molekulargewicht und damit hergestellte gehärtete Gegenstände
US4912179A (en) * 1988-03-30 1990-03-27 Toa Nenryo Kogyo Kabushiki Kaisha Bisphenol A epoxy resin mixtures with aromatic di-secondary amine

Also Published As

Publication number Publication date
DE68926073T2 (de) 1996-10-31
US5091481A (en) 1992-02-25
EP0352550A2 (de) 1990-01-31
JPH0760918B2 (ja) 1995-06-28
EP0352550B1 (de) 1996-03-27
JPH0231491A (ja) 1990-02-01
EP0352550A3 (de) 1991-12-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee