KR900009906A - 금속 클래드 적층용 접착 조성물 - Google Patents

금속 클래드 적층용 접착 조성물

Info

Publication number
KR900009906A
KR900009906A KR1019890017999A KR890017999A KR900009906A KR 900009906 A KR900009906 A KR 900009906A KR 1019890017999 A KR1019890017999 A KR 1019890017999A KR 890017999 A KR890017999 A KR 890017999A KR 900009906 A KR900009906 A KR 900009906A
Authority
KR
South Korea
Prior art keywords
adhesive composition
metal clad
clad lamination
lamination
metal
Prior art date
Application number
KR1019890017999A
Other languages
English (en)
Other versions
KR930003242B1 (ko
Inventor
도시히사 구마꾸라
껜 나나우미
료오이찌 이께자와
히데끼 에리구찌
Original Assignee
히다찌가세이고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다찌가세이고오교 가부시끼가이샤 filed Critical 히다찌가세이고오교 가부시끼가이샤
Publication of KR900009906A publication Critical patent/KR900009906A/ko
Application granted granted Critical
Publication of KR930003242B1 publication Critical patent/KR930003242B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J115/00—Adhesives based on rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
KR1019890017999A 1988-12-05 1989-12-05 금속 클래드 적층용 접착 조성물 KR930003242B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30761788 1988-12-05
JP307617/88 1988-12-05

Publications (2)

Publication Number Publication Date
KR900009906A true KR900009906A (ko) 1990-07-05
KR930003242B1 KR930003242B1 (ko) 1993-04-24

Family

ID=17971187

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890017999A KR930003242B1 (ko) 1988-12-05 1989-12-05 금속 클래드 적층용 접착 조성물

Country Status (3)

Country Link
US (1) US5066691A (ko)
KR (1) KR930003242B1 (ko)
DE (1) DE3940236A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0989172A1 (en) * 1998-09-24 2000-03-29 Hitachi Chemical Co., Ltd. Adhesive composition for metal foil, adhesive-coated metal foil, metal clad laminate and related materials using the same
JP2003342505A (ja) * 2002-05-28 2003-12-03 Konica Minolta Holdings Inc 画像形成方法、印刷物及び記録装置
US20170055576A1 (en) * 2015-08-31 2017-03-02 R. J. Reynolds Tobacco Company Smoking article
CN111040709B (zh) * 2019-12-28 2022-03-22 广东生益科技股份有限公司 一种树脂组合物及使用其的挠性覆铜板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1035889A (en) * 1973-10-13 1978-08-01 Tsutomu Watanabe Flexible adhesive composition and method for utilizing same
JPS58204072A (ja) * 1982-05-21 1983-11-28 Toshiba Chem Corp 銅張積層板用接着性樹脂組成物
JPS6041100B2 (ja) * 1982-10-27 1985-09-13 横浜ゴム株式会社 熱硬化性接着組成物
JPS6143550A (ja) * 1984-08-06 1986-03-03 松下電工株式会社 金属張積層板用接着剤
JPS61143480A (ja) * 1984-12-17 1986-07-01 Yokohama Rubber Co Ltd:The 熱硬化性接着組成物
JPS61213247A (ja) * 1985-03-20 1986-09-22 Dainichi Nippon Cables Ltd 難燃性樹脂組成物
JPS6230173A (ja) * 1985-07-31 1987-02-09 Hitachi Chem Co Ltd 銅張り積層板用接着剤
JPS6254780A (ja) * 1985-09-04 1987-03-10 Toshiba Chem Corp フレキシブル印刷配線板用接着剤組成物

Also Published As

Publication number Publication date
US5066691A (en) 1991-11-19
DE3940236A1 (de) 1990-06-13
DE3940236C2 (ko) 1992-06-04
KR930003242B1 (ko) 1993-04-24

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