ES427131A1 - Procedimiento para preparar un polimero epoxido curado, conpropiedades adhesivas mejoradas. - Google Patents

Procedimiento para preparar un polimero epoxido curado, conpropiedades adhesivas mejoradas.

Info

Publication number
ES427131A1
ES427131A1 ES427131A ES427131A ES427131A1 ES 427131 A1 ES427131 A1 ES 427131A1 ES 427131 A ES427131 A ES 427131A ES 427131 A ES427131 A ES 427131A ES 427131 A1 ES427131 A1 ES 427131A1
Authority
ES
Spain
Prior art keywords
weight
parts
resin component
diglycidyl ether
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES427131A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of ES427131A1 publication Critical patent/ES427131A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
ES427131A 1973-06-11 1974-06-10 Procedimiento para preparar un polimero epoxido curado, conpropiedades adhesivas mejoradas. Expired ES427131A1 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (es) 1974-02-19 1974-05-01

Publications (1)

Publication Number Publication Date
ES427131A1 true ES427131A1 (es) 1976-09-01

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
ES427131A Expired ES427131A1 (es) 1973-06-11 1974-06-10 Procedimiento para preparar un polimero epoxido curado, conpropiedades adhesivas mejoradas.

Country Status (15)

Country Link
JP (1) JPS544398B2 (es)
BR (1) BR7404745A (es)
CA (1) CA1060136A (es)
CH (1) CH603725A5 (es)
DE (1) DE2427030C3 (es)
ES (1) ES427131A1 (es)
FR (1) FR2232614B1 (es)
GB (1) GB1448415A (es)
HK (1) HK45977A (es)
IE (1) IE39796B1 (es)
IL (1) IL44997A (es)
IT (1) IT1011946B (es)
MY (1) MY7700290A (es)
NL (1) NL162118C (es)
SE (1) SE413774B (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
US4602053A (en) * 1984-05-24 1986-07-22 E. I. Du Pont De Nemours And Company Chip-resistant paint containing epoxyester linear block oligomer
DE69229262T2 (de) * 1992-03-16 2000-01-20 Raytheon Co Wärmetransferklebstoff
JP4336955B2 (ja) * 2003-08-07 2009-09-30 三菱瓦斯化学株式会社 シクロヘキサントリカルボン酸モノエステルおよびその用途
JP2005054145A (ja) 2003-08-07 2005-03-03 Mitsubishi Gas Chem Co Inc ガスバリア性（メタ）アクリレート樹脂硬化物および塗料、接着剤、フィルム
JP5670048B2 (ja) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル 接着組成物および硬化性接着シートの製造方法
JP2012256872A (ja) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc 誘電体への金属の接着促進

Also Published As

Publication number Publication date
FR2232614A1 (es) 1975-01-03
DE2427030C3 (de) 1980-08-28
IL44997A0 (en) 1974-09-10
IE39796B1 (en) 1979-01-03
JPS544398B2 (es) 1979-03-06
JPS5034094A (es) 1975-04-02
MY7700290A (en) 1977-12-31
BR7404745A (pt) 1976-02-17
HK45977A (en) 1977-09-16
GB1448415A (en) 1976-09-08
DE2427030A1 (de) 1975-01-02
IE39796L (en) 1974-12-11
DE2427030B2 (de) 1979-12-20
NL162118C (nl) 1980-04-15
SE413774B (sv) 1980-06-23
NL7407729A (es) 1974-12-13
CH603725A5 (es) 1978-08-31
FR2232614B1 (es) 1977-09-30
SE7407533L (es) 1974-12-12
IT1011946B (it) 1977-02-10
NL162118B (nl) 1979-11-15
IL44997A (en) 1977-05-31
CA1060136A (en) 1979-08-07

Similar Documents

Publication Publication Date Title
US3956241A (en) Latent catalysts for epoxy resins
US3694407A (en) Epoxy-containing condensates,their preparation and use
ES427131A1 (es) Procedimiento para preparar un polimero epoxido curado, conpropiedades adhesivas mejoradas.
US3978026A (en) Catalysts of the oxirane-anhydride reaction
GB1381123A (en) Process for curing epoxy resins
US3977996A (en) Catalysts for the oxirane-anhydride reaction
EP0381625A2 (de) Zähe Epoxidharze
US2928809A (en) Epoxide resin-quaternary ammonium salt compositions
US3386953A (en) Latent curing of epoxy resins
JPH0422929B2 (es)
EP0257435A2 (en) Novel boron trifluoride-poly(alkylene oxide) amine catalysts for curing epoxy resins
GB1255504A (en) New long-chain polyglycidyl esters containing aromatic acid residues, processes for their manufacture and their use
US4894431A (en) Accelerated curing systems for epoxy resins
KR910015613A (ko) 예비촉매화된 촉매 조성물, 에폭시 수지의 제조방법, 경화성 조성물 및 이를 경화시켜 제조한 제품
US2947712A (en) Epoxide resin compositions
JPS5850252B2 (ja) エポキシド樹脂をベ−スとする組成物の製造法
US2908664A (en) Modified epoxide resins
JPS63186726A (ja) 常温速硬化型エポキシ樹脂組成物
US3945971A (en) Phenyl urea epoxy resin accelerator
US3635845A (en) Curable compositions of matter containing a polyepoxide and a hydrantoin compound
JPH02252724A (ja) 新規エポキシ樹脂組成物
ATE63754T1 (de) Durch protonieren mit saeure wasserverduennbares bindemittel, dessen herstellung und verwendung.
US3988257A (en) Epoxy resin accelerator
JPH01275621A (ja) エポキシ樹脂組成物
US4169177A (en) Polyether diureide epoxy additives