KR0178082B1 - Ic리이드 교정방법 및 교정장치 - Google Patents

Ic리이드 교정방법 및 교정장치 Download PDF

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Publication number
KR0178082B1
KR0178082B1 KR1019950019382A KR19950019382A KR0178082B1 KR 0178082 B1 KR0178082 B1 KR 0178082B1 KR 1019950019382 A KR1019950019382 A KR 1019950019382A KR 19950019382 A KR19950019382 A KR 19950019382A KR 0178082 B1 KR0178082 B1 KR 0178082B1
Authority
KR
South Korea
Prior art keywords
lead
blades
predetermined angle
package
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950019382A
Other languages
English (en)
Korean (ko)
Other versions
KR960026715A (ko
Inventor
도시오 오노
Original Assignee
기따오까 다까시
미쯔비시덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 기따오까 다까시, 미쯔비시덴끼 가부시끼가이샤 filed Critical 기따오까 다까시
Publication of KR960026715A publication Critical patent/KR960026715A/ko
Application granted granted Critical
Publication of KR0178082B1 publication Critical patent/KR0178082B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1019950019382A 1994-12-28 1995-07-04 Ic리이드 교정방법 및 교정장치 Expired - Fee Related KR0178082B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-327513 1994-12-28
JP6327513A JPH08186222A (ja) 1994-12-28 1994-12-28 Ｉｃのリードの矯正方法及び矯正装置

Publications (2)

Publication Number Publication Date
KR960026715A KR960026715A (ko) 1996-07-22
KR0178082B1 true KR0178082B1 (ko) 1999-03-20

Family

ID=18199965

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950019382A Expired - Fee Related KR0178082B1 (ko) 1994-12-28 1995-07-04 Ic리이드 교정방법 및 교정장치

Country Status (4)

Country Link
JP (1) JPH08186222A (enrdf_load_stackoverflow)
KR (1) KR0178082B1 (enrdf_load_stackoverflow)
CN (1) CN1125897A (enrdf_load_stackoverflow)
TW (1) TW281794B (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4734857B2 (ja) * 2004-06-25 2011-07-27 シンフォニアテクノロジー株式会社 Ｉｃチップ実装体の製造装置
CN106879245A (zh) * 2012-02-08 2017-06-20 Juki株式会社 电子部件安装装置、电子部件安装系统以及电子部件安装方法
CN102738011A (zh) * 2012-07-09 2012-10-17 上海华岭集成电路技术股份有限公司 芯片引脚调整装置
CN103182462B (zh) * 2013-02-26 2014-11-19 山东迪一电子科技有限公司 电子元件引线校直机
CN107204305B (zh) * 2017-04-28 2019-07-23 北京时代民芯科技有限公司 一种便携式扁平封装电路引线检查与整形装置
CN108213123B (zh) * 2017-12-29 2023-08-29 上海富驰高科技股份有限公司 一种医用取样钳的整形装置及使用方法
CN108376649B (zh) * 2018-04-12 2023-10-10 盐城芯丰微电子有限公司 用于qfp半导体器件的整形装置
JP7411904B2 (ja) * 2019-04-16 2024-01-12 パナソニックＩｐマネジメント株式会社 部品供給装置および部品実装装置ならびに部品供給方法
CN110586804B (zh) * 2019-09-04 2024-06-21 珠海智新自动化科技有限公司 一种多引脚整形机构
CN115132603B (zh) * 2022-08-31 2022-11-15 徐州领测半导体科技有限公司 一种半导体芯片检测装置
CN120050839B (zh) * 2025-02-25 2025-08-26 李钦荣 一种电力元器件基板封装装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412560A (ja) * 1990-05-01 1992-01-17 Futaba Corp Ｉｃリード端子の矯正方法
JPH06295968A (ja) * 1991-12-02 1994-10-21 Meiritsu Kikai Kogyo:Kk デジタル素子のリード配列修正方法および修正装置
JPH0730031A (ja) * 1993-07-09 1995-01-31 Nec Corp リード成形方法

Also Published As

Publication number Publication date
JPH08186222A (ja) 1996-07-16
CN1125897A (zh) 1996-07-03
TW281794B (enrdf_load_stackoverflow) 1996-07-21
KR960026715A (ko) 1996-07-22

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