JPH08186222A - Ｉｃのリードの矯正方法及び矯正装置 - Google Patents

Ｉｃのリードの矯正方法及び矯正装置

Info

Publication number
JPH08186222A
JPH08186222A JP6327513A JP32751394A JPH08186222A JP H08186222 A JPH08186222 A JP H08186222A JP 6327513 A JP6327513 A JP 6327513A JP 32751394 A JP32751394 A JP 32751394A JP H08186222 A JPH08186222 A JP H08186222A
Authority
JP
Japan
Prior art keywords
lead
leads
predetermined angle
package
blades
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6327513A
Other languages
English (en)
Japanese (ja)
Inventor
Toshio Ono
利雄 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6327513A priority Critical patent/JPH08186222A/ja
Priority to TW084103697A priority patent/TW281794B/zh
Priority to KR1019950019382A priority patent/KR0178082B1/ko
Priority to CN95109918A priority patent/CN1125897A/zh
Publication of JPH08186222A publication Critical patent/JPH08186222A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP6327513A 1994-12-28 1994-12-28 Ｉｃのリードの矯正方法及び矯正装置 Pending JPH08186222A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP6327513A JPH08186222A (ja) 1994-12-28 1994-12-28 Ｉｃのリードの矯正方法及び矯正装置
TW084103697A TW281794B (enrdf_load_stackoverflow) 1994-12-28 1995-04-15
KR1019950019382A KR0178082B1 (ko) 1994-12-28 1995-07-04 Ic리이드 교정방법 및 교정장치
CN95109918A CN1125897A (zh) 1994-12-28 1995-07-10 Ic引线矫正方法和矫正装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6327513A JPH08186222A (ja) 1994-12-28 1994-12-28 Ｉｃのリードの矯正方法及び矯正装置

Publications (1)

Publication Number Publication Date
JPH08186222A true JPH08186222A (ja) 1996-07-16

Family

ID=18199965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6327513A Pending JPH08186222A (ja) 1994-12-28 1994-12-28 Ｉｃのリードの矯正方法及び矯正装置

Country Status (4)

Country Link
JP (1) JPH08186222A (enrdf_load_stackoverflow)
KR (1) KR0178082B1 (enrdf_load_stackoverflow)
CN (1) CN1125897A (enrdf_load_stackoverflow)
TW (1) TW281794B (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108376649A (zh) * 2018-04-12 2018-08-07 盐城芯丰微电子有限公司 用于qfp半导体器件的整形装置
CN120050839A (zh) * 2025-02-25 2025-05-27 厦门创世嘉音科技有限公司 一种电力元器件基板封装装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4734857B2 (ja) * 2004-06-25 2011-07-27 シンフォニアテクノロジー株式会社 Ｉｃチップ実装体の製造装置
CN106879245A (zh) * 2012-02-08 2017-06-20 Juki株式会社 电子部件安装装置、电子部件安装系统以及电子部件安装方法
CN102738011A (zh) * 2012-07-09 2012-10-17 上海华岭集成电路技术股份有限公司 芯片引脚调整装置
CN103182462B (zh) * 2013-02-26 2014-11-19 山东迪一电子科技有限公司 电子元件引线校直机
CN107204305B (zh) * 2017-04-28 2019-07-23 北京时代民芯科技有限公司 一种便携式扁平封装电路引线检查与整形装置
CN108213123B (zh) * 2017-12-29 2023-08-29 上海富驰高科技股份有限公司 一种医用取样钳的整形装置及使用方法
JP7411904B2 (ja) * 2019-04-16 2024-01-12 パナソニックＩｐマネジメント株式会社 部品供給装置および部品実装装置ならびに部品供給方法
CN110586804B (zh) * 2019-09-04 2024-06-21 珠海智新自动化科技有限公司 一种多引脚整形机构
CN115132603B (zh) * 2022-08-31 2022-11-15 徐州领测半导体科技有限公司 一种半导体芯片检测装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412560A (ja) * 1990-05-01 1992-01-17 Futaba Corp Ｉｃリード端子の矯正方法
JPH06295968A (ja) * 1991-12-02 1994-10-21 Meiritsu Kikai Kogyo:Kk デジタル素子のリード配列修正方法および修正装置
JPH0730031A (ja) * 1993-07-09 1995-01-31 Nec Corp リード成形方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412560A (ja) * 1990-05-01 1992-01-17 Futaba Corp Ｉｃリード端子の矯正方法
JPH06295968A (ja) * 1991-12-02 1994-10-21 Meiritsu Kikai Kogyo:Kk デジタル素子のリード配列修正方法および修正装置
JPH0730031A (ja) * 1993-07-09 1995-01-31 Nec Corp リード成形方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108376649A (zh) * 2018-04-12 2018-08-07 盐城芯丰微电子有限公司 用于qfp半导体器件的整形装置
CN108376649B (zh) * 2018-04-12 2023-10-10 盐城芯丰微电子有限公司 用于qfp半导体器件的整形装置
CN120050839A (zh) * 2025-02-25 2025-05-27 厦门创世嘉音科技有限公司 一种电力元器件基板封装装置

Also Published As

Publication number Publication date
CN1125897A (zh) 1996-07-03
KR0178082B1 (ko) 1999-03-20
TW281794B (enrdf_load_stackoverflow) 1996-07-21
KR960026715A (ko) 1996-07-22

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