KR0166405B1 - 아이씨 콘택터 - Google Patents

아이씨 콘택터 Download PDF

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Publication number
KR0166405B1
KR0166405B1 KR1019940021984A KR19940021984A KR0166405B1 KR 0166405 B1 KR0166405 B1 KR 0166405B1 KR 1019940021984 A KR1019940021984 A KR 1019940021984A KR 19940021984 A KR19940021984 A KR 19940021984A KR 0166405 B1 KR0166405 B1 KR 0166405B1
Authority
KR
South Korea
Prior art keywords
contact
separator
pins
contact pin
comb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940021984A
Other languages
English (en)
Korean (ko)
Other versions
KR950010728A (ko
Inventor
히데키 와카마츠
Original Assignee
사토 후미오
가부시키가이샤 도시바
오카모토 세이시
도시바 마이크로일렉트로닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사토 후미오, 가부시키가이샤 도시바, 오카모토 세이시, 도시바 마이크로일렉트로닉스 가부시키가이샤 filed Critical 사토 후미오
Publication of KR950010728A publication Critical patent/KR950010728A/ko
Application granted granted Critical
Publication of KR0166405B1 publication Critical patent/KR0166405B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
KR1019940021984A 1993-09-01 1994-09-01 아이씨 콘택터 Expired - Fee Related KR0166405B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93-217730 1993-09-01
JP5217730A JP3054003B2 (ja) 1993-09-01 1993-09-01 Ｉｃコンタクタ

Publications (2)

Publication Number Publication Date
KR950010728A KR950010728A (ko) 1995-04-28
KR0166405B1 true KR0166405B1 (ko) 1999-01-15

Family

ID=16708849

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940021984A Expired - Fee Related KR0166405B1 (ko) 1993-09-01 1994-09-01 아이씨 콘택터

Country Status (4)

Country Link
US (1) US5545045A (enExample)
JP (1) JP3054003B2 (enExample)
KR (1) KR0166405B1 (enExample)
TW (1) TW260826B (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100841127B1 (ko) 1998-12-02 2008-06-24 폼팩터, 인크. 리소그래피 접촉 소자
US6491968B1 (en) 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
US6672875B1 (en) 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
JP4579361B2 (ja) * 1999-09-24 2010-11-10 軍生 木本 接触子組立体
JP4199897B2 (ja) * 2000-02-23 2008-12-24 株式会社秩父富士 Ｉｃソケット用コンタクト
US6672912B2 (en) * 2000-03-31 2004-01-06 Intel Corporation Discrete device socket and method of fabrication therefor
US6364669B1 (en) * 2000-07-12 2002-04-02 Advanced Micro Devices, Inc. Spring contact for providing high current power to an integrated circuit
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
WO2002041396A2 (en) * 2000-11-20 2002-05-23 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6501655B1 (en) 2000-11-20 2002-12-31 Intel Corporation High performance fin configuration for air cooled heat sinks
US6388207B1 (en) 2000-12-29 2002-05-14 Intel Corporation Electronic assembly with trench structures and methods of manufacture
JP2002296297A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
DE50304589D1 (de) * 2002-07-01 2006-09-21 Infineon Technologies Ag Testvorrichtung für bauteile integrierter schaltungen
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
KR100573089B1 (ko) * 2003-03-17 2006-04-24 주식회사 파이컴 프로브 및 그 제조방법
DE102004036407A1 (de) * 2003-08-27 2005-06-09 Japan Electronic Materials Corp., Amagasaki Prüfkarte und Verbinder für diese
JP2005106482A (ja) * 2003-09-26 2005-04-21 Japan Electronic Materials Corp 接続ピン
JP2005156365A (ja) * 2003-11-26 2005-06-16 Shinko Electric Ind Co Ltd 電気特性測定用プローブ及びその製造方法
JP4571640B2 (ja) * 2004-07-05 2010-10-27 株式会社日本マイクロニクス 接触子ブロック及び電気的接続装置
US7743204B2 (en) 2007-08-01 2010-06-22 Transcend Information, Inc. Non-volatile memory device and data access circuit and data access method
US9329204B2 (en) 2009-04-21 2016-05-03 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
WO2010123991A2 (en) * 2009-04-21 2010-10-28 Johnstech International Corporation Electrically conductive kelvin contacts for microcircuit tester
TWM391759U (en) * 2010-04-28 2010-11-01 Hon Hai Prec Ind Co Ltd Electrical connector
KR20120060299A (ko) * 2010-12-02 2012-06-12 삼성전자주식회사 테스트 소켓
CN110875538B (zh) * 2018-08-30 2021-11-05 泰连公司 用于电连接器的触头
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS643778A (en) * 1987-06-25 1989-01-09 Matsushita Electric Works Ltd Installation supervisory equipment
US4986760A (en) * 1989-05-19 1991-01-22 Minnesota Mining And Manufacturing Company Socket for tab burn-in and test
JP2602551B2 (ja) * 1989-06-13 1997-04-23 山一電機工業株式会社 バイパス片を有するコンタクト
US5427536A (en) * 1994-03-29 1995-06-27 Minnesota Mining And Manufacturing Company Socket for tab testing
JP3106683U (ja) 2004-07-20 2005-01-20 株式会社ワールド 指圧器

Also Published As

Publication number Publication date
US5545045A (en) 1996-08-13
JP3054003B2 (ja) 2000-06-19
TW260826B (enExample) 1995-10-21
KR950010728A (ko) 1995-04-28
JPH0773941A (ja) 1995-03-17

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