KR0158475B1 - Magnetic vias within multi-layer/3-dimensional structure - Google Patents

Magnetic vias within multi-layer/3-dimensional structure Download PDF

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Publication number
KR0158475B1
KR0158475B1 KR1019940701759A KR19940701759A KR0158475B1 KR 0158475 B1 KR0158475 B1 KR 0158475B1 KR 1019940701759 A KR1019940701759 A KR 1019940701759A KR 19940701759 A KR19940701759 A KR 19940701759A KR 0158475 B1 KR0158475 B1 KR 0158475B1
Authority
KR
South Korea
Prior art keywords
layer
dimensional structure
magnetic vias
vias
magnetic
Prior art date
Application number
KR1019940701759A
Other languages
English (en)
Inventor
Robert F Mcclanhan
Robert D Washburn
Andrew Shapiro
Hal D Smith
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of KR0158475B1 publication Critical patent/KR0158475B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/645Inductive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6605High-frequency electrical connections
    • H01L2223/6616Vertical connections, e.g. vias
    • H01L2223/6622Coaxial feed-throughs in active or passive substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6605High-frequency electrical connections
    • H01L2223/6627Waveguides, e.g. microstrip line, strip line, coplanar line
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1903Structure including wave guides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0187Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • H05K2201/086Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/096Vertically aligned vias, holes or stacked vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Thin Magnetic Films (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Magnetic Heads (AREA)
KR1019940701759A 1992-09-24 1994-05-24 Magnetic vias within multi-layer/3-dimensional structure KR0158475B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95107292A 1992-09-24 1992-09-24

Publications (1)

Publication Number Publication Date
KR0158475B1 true KR0158475B1 (en) 1998-12-15

Family

ID=25491223

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940701759A KR0158475B1 (en) 1992-09-24 1994-05-24 Magnetic vias within multi-layer/3-dimensional structure

Country Status (11)

Country Link
US (1) US5438167A (ko)
EP (1) EP0613610B1 (ko)
JP (1) JP2509807B2 (ko)
KR (1) KR0158475B1 (ko)
CA (1) CA2124196C (ko)
DE (1) DE69312466T2 (ko)
DK (1) DK0613610T3 (ko)
ES (1) ES2105326T3 (ko)
GR (1) GR3024693T3 (ko)
MX (1) MX9305885A (ko)
WO (1) WO1994007349A1 (ko)

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US6184736B1 (en) * 1992-04-03 2001-02-06 Compaq Computer Corporation Sinusoidal radio-frequency clock distribution system for synchronization of a computer system
DE59702929D1 (de) * 1996-07-31 2001-02-22 Dyconex Patente Zug Verfahren zur herstellung von verbindungsleitern
JP4234205B2 (ja) * 1996-11-08 2009-03-04 ダブリュ.エル.ゴア アンド アソシエイツ,インコーポレイティド 電子アセンブリおよび電子物品内でのヴァイアのインダクタンスを低減する方法
US5828271A (en) * 1997-03-06 1998-10-27 Northrop Grumman Corporation Planar ferrite toroid microwave phase shifter
JP3366552B2 (ja) * 1997-04-22 2003-01-14 京セラ株式会社 誘電体導波管線路およびそれを具備する多層配線基板
US6169801B1 (en) 1998-03-16 2001-01-02 Midcom, Inc. Digital isolation apparatus and method
JP3784244B2 (ja) * 2000-06-30 2006-06-07 京セラ株式会社 多層配線基板
US6975189B1 (en) * 2000-11-02 2005-12-13 Telasic Communications, Inc. On-chip multilayer metal shielded transmission line
IL141118A0 (en) * 2001-01-25 2002-02-10 Cerel Ceramics Technologies Lt A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
EP2315510A3 (en) 2001-06-05 2012-05-02 Dai Nippon Printing Co., Ltd. Wiring board provided with passive element
US6778043B2 (en) * 2001-12-19 2004-08-17 Maxxan Systems, Inc. Method and apparatus for adding inductance to printed circuits
US6867664B2 (en) * 2003-05-05 2005-03-15 Joey Bray Ferrite-filled, antisymmetrically-biased rectangular waveguide phase shifter
US7829135B2 (en) * 2005-06-22 2010-11-09 Canon Kabushiki Kaisha Method and apparatus for forming multi-layered circuit pattern
US7947908B2 (en) * 2007-10-19 2011-05-24 Advantest Corporation Electronic device
US8440917B2 (en) * 2007-11-19 2013-05-14 International Business Machines Corporation Method and apparatus to reduce impedance discontinuity in packages
US20090153281A1 (en) * 2007-12-13 2009-06-18 Ahmadreza Rofougaran Method and system for an integrated circuit package with ferri/ferromagnetic layers
US20100307798A1 (en) * 2009-06-03 2010-12-09 Izadian Jamal S Unified scalable high speed interconnects technologies
KR101692434B1 (ko) * 2010-06-28 2017-01-18 삼성전자주식회사 반도체 소자 및 그 제조 방법
US9362606B2 (en) * 2013-08-23 2016-06-07 International Business Machines Corporation On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
WO2019147189A1 (en) 2018-01-29 2019-08-01 Agency For Science, Technology And Research Semiconductor package and method of forming the same
JP2020010148A (ja) * 2018-07-06 2020-01-16 株式会社フジクラ 高周波受動部品およびその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3456215A (en) * 1964-09-02 1969-07-15 Peter A Denes High frequency low pass filter
JPS5524446A (en) * 1978-08-09 1980-02-21 Ngk Insulators Ltd Ceramic circuit board
JPS6048291B2 (ja) * 1979-10-11 1985-10-26 ファナック株式会社 ワイヤカット放電加工装置
JPS5854661A (ja) * 1981-09-29 1983-03-31 Fujitsu Ltd 多層セラミツク半導体パツケ−ジ
US4647878A (en) * 1984-11-14 1987-03-03 Itt Corporation Coaxial shielded directional microwave coupler
JPS61265890A (ja) * 1985-05-20 1986-11-25 日本シイエムケイ株式会社 プリント配線板とシ−ルド用トナ−
JPS62219691A (ja) * 1986-03-20 1987-09-26 富士通株式会社 厚膜混成集積回路
JPH0728133B2 (ja) * 1986-05-02 1995-03-29 株式会社東芝 回路基板
JPH0724334B2 (ja) * 1987-01-19 1995-03-15 株式会社日立製作所 回路板
US4894114A (en) * 1987-02-11 1990-01-16 Westinghouse Electric Corp. Process for producing vias in semiconductor
JPH0196991A (ja) * 1987-10-09 1989-04-14 Tdk Corp 厚膜複合部品の製造方法
US5312674A (en) * 1992-07-31 1994-05-17 Hughes Aircraft Company Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer

Also Published As

Publication number Publication date
DE69312466T2 (de) 1998-02-26
DK0613610T3 (da) 1997-08-25
JP2509807B2 (ja) 1996-06-26
ES2105326T3 (es) 1997-10-16
MX9305885A (es) 1994-07-29
US5438167A (en) 1995-08-01
DE69312466D1 (de) 1997-09-04
EP0613610B1 (en) 1997-07-23
CA2124196C (en) 1997-04-29
GR3024693T3 (en) 1997-12-31
JPH07501910A (ja) 1995-02-23
WO1994007349A1 (en) 1994-03-31
EP0613610A1 (en) 1994-09-07

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E701 Decision to grant or registration of patent right
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Payment date: 20130723

Year of fee payment: 16

EXPY Expiration of term