JPWO2025047765A5 - - Google Patents

Info

Publication number
JPWO2025047765A5
JPWO2025047765A5 JP2025543526A JP2025543526A JPWO2025047765A5 JP WO2025047765 A5 JPWO2025047765 A5 JP WO2025047765A5 JP 2025543526 A JP2025543526 A JP 2025543526A JP 2025543526 A JP2025543526 A JP 2025543526A JP WO2025047765 A5 JPWO2025047765 A5 JP WO2025047765A5
Authority
JP
Japan
Prior art keywords
diameter
resin
insulating plate
thickness direction
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025543526A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025047765A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/030576 external-priority patent/WO2025047765A1/ja
Publication of JPWO2025047765A1 publication Critical patent/JPWO2025047765A1/ja
Publication of JPWO2025047765A5 publication Critical patent/JPWO2025047765A5/ja
Pending legal-status Critical Current

Links

JP2025543526A 2023-08-30 2024-08-28 Pending JPWO2025047765A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023139472 2023-08-30
PCT/JP2024/030576 WO2025047765A1 (ja) 2023-08-30 2024-08-28 印刷配線板及びビルドアップ印刷配線板

Publications (2)

Publication Number Publication Date
JPWO2025047765A1 JPWO2025047765A1 (https=) 2025-03-06
JPWO2025047765A5 true JPWO2025047765A5 (https=) 2026-05-07

Family

ID=94819294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025543526A Pending JPWO2025047765A1 (https=) 2023-08-30 2024-08-28

Country Status (2)

Country Link
JP (1) JPWO2025047765A1 (https=)
WO (1) WO2025047765A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI310670B (en) * 2003-08-28 2009-06-01 Ibm Printed wiring board manufacturing method and printed wiring board
JP6251629B2 (ja) * 2014-04-24 2017-12-20 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP6819268B2 (ja) * 2016-12-15 2021-01-27 凸版印刷株式会社 配線基板、多層配線基板、及び配線基板の製造方法
JP2019021876A (ja) * 2017-07-21 2019-02-07 日本特殊陶業株式会社 配線基板、プレーナトランス、及び配線基板の製造方法

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