JPWO2024237037A5 - - Google Patents

Info

Publication number
JPWO2024237037A5
JPWO2024237037A5 JP2025520479A JP2025520479A JPWO2024237037A5 JP WO2024237037 A5 JPWO2024237037 A5 JP WO2024237037A5 JP 2025520479 A JP2025520479 A JP 2025520479A JP 2025520479 A JP2025520479 A JP 2025520479A JP WO2024237037 A5 JPWO2024237037 A5 JP WO2024237037A5
Authority
JP
Japan
Prior art keywords
conductor layer
layer
multilayer substrate
conductor
forming resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025520479A
Other languages
English (en)
Japanese (ja)
Other versions
JP7823794B2 (ja
JPWO2024237037A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/015875 external-priority patent/WO2024237037A1/ja
Publication of JPWO2024237037A1 publication Critical patent/JPWO2024237037A1/ja
Publication of JPWO2024237037A5 publication Critical patent/JPWO2024237037A5/ja
Priority to JP2026021570A priority Critical patent/JP2026066370A/ja
Application granted granted Critical
Publication of JP7823794B2 publication Critical patent/JP7823794B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2025520479A 2023-05-17 2024-04-23 多層基板及び電子機器 Active JP7823794B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2026021570A JP2026066370A (ja) 2023-05-17 2026-02-13 多層基板及び電子機器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023081874 2023-05-17
JP2023081874 2023-05-17
PCT/JP2024/015875 WO2024237037A1 (ja) 2023-05-17 2024-04-23 多層基板及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2026021570A Division JP2026066370A (ja) 2023-05-17 2026-02-13 多層基板及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2024237037A1 JPWO2024237037A1 (https=) 2024-11-21
JPWO2024237037A5 true JPWO2024237037A5 (https=) 2025-12-15
JP7823794B2 JP7823794B2 (ja) 2026-03-04

Family

ID=93519008

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2025520479A Active JP7823794B2 (ja) 2023-05-17 2024-04-23 多層基板及び電子機器
JP2026021570A Pending JP2026066370A (ja) 2023-05-17 2026-02-13 多層基板及び電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2026021570A Pending JP2026066370A (ja) 2023-05-17 2026-02-13 多層基板及び電子機器

Country Status (5)

Country Link
US (1) US20260059648A1 (https=)
JP (2) JP7823794B2 (https=)
CN (1) CN121128319A (https=)
DE (1) DE112024002130T5 (https=)
WO (1) WO2024237037A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048711A1 (ja) * 2024-08-29 2026-03-05 株式会社村田製作所 グラウンデッドコプレーナ導波路及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118361A (ja) 2000-10-10 2002-04-19 Hitachi Cable Ltd 高速伝送用積層基板及びその製造方法
JP2003133660A (ja) 2001-10-19 2003-05-09 G Tekku:Kk 電源用と信号用回路が複合されたフレキシブルプリント配線板
KR102552614B1 (ko) 2016-02-26 2023-07-06 주식회사 기가레인 연성회로기판
CN220021573U (zh) 2020-11-30 2023-11-14 株式会社村田制作所 传输线路以及电子设备
CN219626872U (zh) 2020-12-24 2023-09-01 株式会社村田制作所 多层基板

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