JPWO2025074578A5 - - Google Patents

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Publication number
JPWO2025074578A5
JPWO2025074578A5 JP2024514459A JP2024514459A JPWO2025074578A5 JP WO2025074578 A5 JPWO2025074578 A5 JP WO2025074578A5 JP 2024514459 A JP2024514459 A JP 2024514459A JP 2024514459 A JP2024514459 A JP 2024514459A JP WO2025074578 A5 JPWO2025074578 A5 JP WO2025074578A5
Authority
JP
Japan
Prior art keywords
conductor layers
wiring board
printed wiring
conductor
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024514459A
Other languages
English (en)
Japanese (ja)
Other versions
JP7493695B1 (ja
JPWO2025074578A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/036389 external-priority patent/WO2025074578A1/ja
Application granted granted Critical
Publication of JP7493695B1 publication Critical patent/JP7493695B1/ja
Publication of JPWO2025074578A1 publication Critical patent/JPWO2025074578A1/ja
Publication of JPWO2025074578A5 publication Critical patent/JPWO2025074578A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024514459A 2023-10-05 2023-10-05 プリント配線板 Active JP7493695B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/036389 WO2025074578A1 (ja) 2023-10-05 2023-10-05 プリント配線板

Publications (3)

Publication Number Publication Date
JP7493695B1 JP7493695B1 (ja) 2024-05-31
JPWO2025074578A1 JPWO2025074578A1 (https=) 2025-04-10
JPWO2025074578A5 true JPWO2025074578A5 (https=) 2025-09-10

Family

ID=91227041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024514459A Active JP7493695B1 (ja) 2023-10-05 2023-10-05 プリント配線板

Country Status (2)

Country Link
JP (1) JP7493695B1 (https=)
WO (1) WO2025074578A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653684A (ja) * 1992-07-29 1994-02-25 Hitachi Ltd 薄膜多層配線基板とそれを用いたモジュール
JPH0750484A (ja) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp 多層プリント配線板
JP2000124612A (ja) * 1998-01-19 2000-04-28 Toshiba Corp 配線基板とその製造方法、その配線基板を具える電気機器
JP2004253738A (ja) 2003-02-21 2004-09-09 Toshiba Corp パッケージ基板及びフリップチップ型半導体装置
JP2008091552A (ja) * 2006-09-29 2008-04-17 Fujitsu Ltd プリント配線板およびプリント基板ユニット並びに電子機器
KR101037450B1 (ko) * 2009-09-23 2011-05-26 삼성전기주식회사 패키지 기판
JP7558683B2 (ja) * 2019-06-03 2024-10-01 三菱電機株式会社 プリント配線板装置およびその製造方法

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