JPWO2025074578A1 - - Google Patents
Info
- Publication number
- JPWO2025074578A1 JPWO2025074578A1 JP2024514459A JP2024514459A JPWO2025074578A1 JP WO2025074578 A1 JPWO2025074578 A1 JP WO2025074578A1 JP 2024514459 A JP2024514459 A JP 2024514459A JP 2024514459 A JP2024514459 A JP 2024514459A JP WO2025074578 A1 JPWO2025074578 A1 JP WO2025074578A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/036389 WO2025074578A1 (ja) | 2023-10-05 | 2023-10-05 | プリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7493695B1 JP7493695B1 (ja) | 2024-05-31 |
| JPWO2025074578A1 true JPWO2025074578A1 (https=) | 2025-04-10 |
| JPWO2025074578A5 JPWO2025074578A5 (https=) | 2025-09-10 |
Family
ID=91227041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024514459A Active JP7493695B1 (ja) | 2023-10-05 | 2023-10-05 | プリント配線板 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7493695B1 (https=) |
| WO (1) | WO2025074578A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0653684A (ja) * | 1992-07-29 | 1994-02-25 | Hitachi Ltd | 薄膜多層配線基板とそれを用いたモジュール |
| JPH0750484A (ja) * | 1993-08-06 | 1995-02-21 | Mitsubishi Electric Corp | 多層プリント配線板 |
| JP2000124612A (ja) * | 1998-01-19 | 2000-04-28 | Toshiba Corp | 配線基板とその製造方法、その配線基板を具える電気機器 |
| JP2004253738A (ja) | 2003-02-21 | 2004-09-09 | Toshiba Corp | パッケージ基板及びフリップチップ型半導体装置 |
| JP2008091552A (ja) * | 2006-09-29 | 2008-04-17 | Fujitsu Ltd | プリント配線板およびプリント基板ユニット並びに電子機器 |
| KR101037450B1 (ko) * | 2009-09-23 | 2011-05-26 | 삼성전기주식회사 | 패키지 기판 |
| JP7558683B2 (ja) * | 2019-06-03 | 2024-10-01 | 三菱電機株式会社 | プリント配線板装置およびその製造方法 |
-
2023
- 2023-10-05 WO PCT/JP2023/036389 patent/WO2025074578A1/ja active Pending
- 2023-10-05 JP JP2024514459A patent/JP7493695B1/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7493695B1 (ja) | 2024-05-31 |
| WO2025074578A1 (ja) | 2025-04-10 |
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