JP7493695B1 - プリント配線板 - Google Patents

プリント配線板 Download PDF

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Publication number
JP7493695B1
JP7493695B1 JP2024514459A JP2024514459A JP7493695B1 JP 7493695 B1 JP7493695 B1 JP 7493695B1 JP 2024514459 A JP2024514459 A JP 2024514459A JP 2024514459 A JP2024514459 A JP 2024514459A JP 7493695 B1 JP7493695 B1 JP 7493695B1
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Japan
Prior art keywords
thermal expansion
conductor
printed wiring
wiring board
conductor layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2024514459A
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English (en)
Japanese (ja)
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JPWO2025074578A5 (https=
JPWO2025074578A1 (https=
Inventor
洋平 伊藤
謙二郎 高西
竜也 坂本
等 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
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Publication of JP7493695B1 publication Critical patent/JP7493695B1/ja
Publication of JPWO2025074578A1 publication Critical patent/JPWO2025074578A1/ja
Publication of JPWO2025074578A5 publication Critical patent/JPWO2025074578A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2024514459A 2023-10-05 2023-10-05 プリント配線板 Active JP7493695B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/036389 WO2025074578A1 (ja) 2023-10-05 2023-10-05 プリント配線板

Publications (3)

Publication Number Publication Date
JP7493695B1 true JP7493695B1 (ja) 2024-05-31
JPWO2025074578A1 JPWO2025074578A1 (https=) 2025-04-10
JPWO2025074578A5 JPWO2025074578A5 (https=) 2025-09-10

Family

ID=91227041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024514459A Active JP7493695B1 (ja) 2023-10-05 2023-10-05 プリント配線板

Country Status (2)

Country Link
JP (1) JP7493695B1 (https=)
WO (1) WO2025074578A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653684A (ja) * 1992-07-29 1994-02-25 Hitachi Ltd 薄膜多層配線基板とそれを用いたモジュール
JP2011071454A (ja) * 2009-09-23 2011-04-07 Samsung Electro-Mechanics Co Ltd パッケージ基板
JP2020198432A (ja) * 2019-06-03 2020-12-10 三菱電機株式会社 プリント配線板装置およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750484A (ja) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp 多層プリント配線板
JP2000124612A (ja) * 1998-01-19 2000-04-28 Toshiba Corp 配線基板とその製造方法、その配線基板を具える電気機器
JP2004253738A (ja) 2003-02-21 2004-09-09 Toshiba Corp パッケージ基板及びフリップチップ型半導体装置
JP2008091552A (ja) * 2006-09-29 2008-04-17 Fujitsu Ltd プリント配線板およびプリント基板ユニット並びに電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653684A (ja) * 1992-07-29 1994-02-25 Hitachi Ltd 薄膜多層配線基板とそれを用いたモジュール
JP2011071454A (ja) * 2009-09-23 2011-04-07 Samsung Electro-Mechanics Co Ltd パッケージ基板
JP2020198432A (ja) * 2019-06-03 2020-12-10 三菱電機株式会社 プリント配線板装置およびその製造方法

Also Published As

Publication number Publication date
WO2025074578A1 (ja) 2025-04-10
JPWO2025074578A1 (https=) 2025-04-10

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