JPWO2025047765A1 - - Google Patents
Info
- Publication number
- JPWO2025047765A1 JPWO2025047765A1 JP2025543526A JP2025543526A JPWO2025047765A1 JP WO2025047765 A1 JPWO2025047765 A1 JP WO2025047765A1 JP 2025543526 A JP2025543526 A JP 2025543526A JP 2025543526 A JP2025543526 A JP 2025543526A JP WO2025047765 A1 JPWO2025047765 A1 JP WO2025047765A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023139472 | 2023-08-30 | ||
| PCT/JP2024/030576 WO2025047765A1 (ja) | 2023-08-30 | 2024-08-28 | 印刷配線板及びビルドアップ印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025047765A1 true JPWO2025047765A1 (https=) | 2025-03-06 |
| JPWO2025047765A5 JPWO2025047765A5 (https=) | 2026-05-07 |
Family
ID=94819294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025543526A Pending JPWO2025047765A1 (https=) | 2023-08-30 | 2024-08-28 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025047765A1 (https=) |
| WO (1) | WO2025047765A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI310670B (en) * | 2003-08-28 | 2009-06-01 | Ibm | Printed wiring board manufacturing method and printed wiring board |
| JP6251629B2 (ja) * | 2014-04-24 | 2017-12-20 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| JP6819268B2 (ja) * | 2016-12-15 | 2021-01-27 | 凸版印刷株式会社 | 配線基板、多層配線基板、及び配線基板の製造方法 |
| JP2019021876A (ja) * | 2017-07-21 | 2019-02-07 | 日本特殊陶業株式会社 | 配線基板、プレーナトランス、及び配線基板の製造方法 |
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2024
- 2024-08-28 JP JP2025543526A patent/JPWO2025047765A1/ja active Pending
- 2024-08-28 WO PCT/JP2024/030576 patent/WO2025047765A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025047765A1 (ja) | 2025-03-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260202 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260202 |