JPWO2024219284A5 - - Google Patents
Info
- Publication number
- JPWO2024219284A5 JPWO2024219284A5 JP2025515176A JP2025515176A JPWO2024219284A5 JP WO2024219284 A5 JPWO2024219284 A5 JP WO2024219284A5 JP 2025515176 A JP2025515176 A JP 2025515176A JP 2025515176 A JP2025515176 A JP 2025515176A JP WO2024219284 A5 JPWO2024219284 A5 JP WO2024219284A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- interlayer connection
- circuit board
- layer
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023069296 | 2023-04-20 | ||
| JP2023069296 | 2023-04-20 | ||
| PCT/JP2024/014336 WO2024219284A1 (ja) | 2023-04-20 | 2024-04-09 | 多層回路基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024219284A1 JPWO2024219284A1 (https=) | 2024-10-24 |
| JPWO2024219284A5 true JPWO2024219284A5 (https=) | 2025-10-01 |
| JP7790633B2 JP7790633B2 (ja) | 2025-12-23 |
Family
ID=93152459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025515176A Active JP7790633B2 (ja) | 2023-04-20 | 2024-04-09 | 多層回路基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20260032809A1 (https=) |
| JP (1) | JP7790633B2 (https=) |
| CN (1) | CN121128324A (https=) |
| DE (1) | DE112024001395T5 (https=) |
| WO (1) | WO2024219284A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010123830A (ja) | 2008-11-21 | 2010-06-03 | Panasonic Corp | プリント配線板とその製造方法 |
| CN212463677U (zh) | 2017-05-26 | 2021-02-02 | 株式会社村田制作所 | 多层布线基板以及电子设备 |
| KR102442387B1 (ko) * | 2017-10-20 | 2022-09-14 | 삼성전기주식회사 | 인쇄회로기판 |
| WO2022202322A1 (ja) * | 2021-03-26 | 2022-09-29 | 株式会社村田製作所 | 配線基板、積層基板及び配線基板の製造方法 |
-
2024
- 2024-04-09 CN CN202480026875.0A patent/CN121128324A/zh active Pending
- 2024-04-09 WO PCT/JP2024/014336 patent/WO2024219284A1/ja not_active Ceased
- 2024-04-09 DE DE112024001395.3T patent/DE112024001395T5/de active Pending
- 2024-04-09 JP JP2025515176A patent/JP7790633B2/ja active Active
-
2025
- 2025-09-29 US US19/343,250 patent/US20260032809A1/en active Pending
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