JPWO2024219283A5 - - Google Patents

Info

Publication number
JPWO2024219283A5
JPWO2024219283A5 JP2025515175A JP2025515175A JPWO2024219283A5 JP WO2024219283 A5 JPWO2024219283 A5 JP WO2024219283A5 JP 2025515175 A JP2025515175 A JP 2025515175A JP 2025515175 A JP2025515175 A JP 2025515175A JP WO2024219283 A5 JPWO2024219283 A5 JP WO2024219283A5
Authority
JP
Japan
Prior art keywords
interlayer connection
conductor
layer
circuit board
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025515175A
Other languages
English (en)
Japanese (ja)
Other versions
JP7806969B2 (ja
JPWO2024219283A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/014334 external-priority patent/WO2024219283A1/ja
Publication of JPWO2024219283A1 publication Critical patent/JPWO2024219283A1/ja
Publication of JPWO2024219283A5 publication Critical patent/JPWO2024219283A5/ja
Application granted granted Critical
Publication of JP7806969B2 publication Critical patent/JP7806969B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2025515175A 2023-04-20 2024-04-09 多層回路基板 Active JP7806969B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023069295 2023-04-20
JP2023069295 2023-04-20
PCT/JP2024/014334 WO2024219283A1 (ja) 2023-04-20 2024-04-09 多層回路基板

Publications (3)

Publication Number Publication Date
JPWO2024219283A1 JPWO2024219283A1 (https=) 2024-10-24
JPWO2024219283A5 true JPWO2024219283A5 (https=) 2025-10-29
JP7806969B2 JP7806969B2 (ja) 2026-01-27

Family

ID=93152385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025515175A Active JP7806969B2 (ja) 2023-04-20 2024-04-09 多層回路基板

Country Status (5)

Country Link
US (1) US20260032812A1 (https=)
JP (1) JP7806969B2 (https=)
CN (1) CN121128325A (https=)
DE (1) DE112024001377T5 (https=)
WO (1) WO2024219283A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237233A (ja) * 2005-02-24 2006-09-07 Ngk Spark Plug Co Ltd 複合配線基板構造体及びその製造方法
JP2010123830A (ja) 2008-11-21 2010-06-03 Panasonic Corp プリント配線板とその製造方法
KR102442387B1 (ko) * 2017-10-20 2022-09-14 삼성전기주식회사 인쇄회로기판
WO2020122156A1 (ja) * 2018-12-13 2020-06-18 株式会社村田製作所 樹脂多層基板、および樹脂多層基板の製造方法
WO2022202322A1 (ja) * 2021-03-26 2022-09-29 株式会社村田製作所 配線基板、積層基板及び配線基板の製造方法

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