JPWO2025047575A5 - - Google Patents

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Publication number
JPWO2025047575A5
JPWO2025047575A5 JP2025517194A JP2025517194A JPWO2025047575A5 JP WO2025047575 A5 JPWO2025047575 A5 JP WO2025047575A5 JP 2025517194 A JP2025517194 A JP 2025517194A JP 2025517194 A JP2025517194 A JP 2025517194A JP WO2025047575 A5 JPWO2025047575 A5 JP WO2025047575A5
Authority
JP
Japan
Prior art keywords
conductive paste
curing agent
paste according
conductive
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025517194A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025047575A1 (https=
JP7702052B1 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/029862 external-priority patent/WO2025047575A1/ja
Publication of JPWO2025047575A1 publication Critical patent/JPWO2025047575A1/ja
Application granted granted Critical
Publication of JP7702052B1 publication Critical patent/JP7702052B1/ja
Publication of JPWO2025047575A5 publication Critical patent/JPWO2025047575A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2025517194A 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Active JP7702052B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023137309 2023-08-25
JP2023137309 2023-08-25
PCT/JP2024/029862 WO2025047575A1 (ja) 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Publications (3)

Publication Number Publication Date
JPWO2025047575A1 JPWO2025047575A1 (https=) 2025-03-06
JP7702052B1 JP7702052B1 (ja) 2025-07-02
JPWO2025047575A5 true JPWO2025047575A5 (https=) 2025-08-06

Family

ID=94819129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025517194A Active JP7702052B1 (ja) 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Country Status (4)

Country Link
JP (1) JP7702052B1 (https=)
CN (1) CN120836064A (https=)
TW (1) TW202513745A (https=)
WO (1) WO2025047575A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060111496A1 (en) 2004-11-24 2006-05-25 Stijn Gillissen Low temperature snap cure material with suitable worklife
WO2009054386A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
JP5824348B2 (ja) * 2010-12-14 2015-11-25 積水化学工業株式会社 異方性導電材料及び接続構造体
JP6231257B2 (ja) 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法
JP6302818B2 (ja) * 2014-10-20 2018-03-28 京セラ株式会社 リペアラブル接着剤組成物および電気・電子部品
KR102055114B1 (ko) * 2015-06-02 2019-12-12 데쿠세리아루즈 가부시키가이샤 접착제 조성물
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP2018060709A (ja) * 2016-10-06 2018-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
CN110300780A (zh) * 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体

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