TW202513745A - 導電糊、rfid嵌體及rfid嵌體之製造方法 - Google Patents

導電糊、rfid嵌體及rfid嵌體之製造方法 Download PDF

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Publication number
TW202513745A
TW202513745A TW113131783A TW113131783A TW202513745A TW 202513745 A TW202513745 A TW 202513745A TW 113131783 A TW113131783 A TW 113131783A TW 113131783 A TW113131783 A TW 113131783A TW 202513745 A TW202513745 A TW 202513745A
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TW
Taiwan
Prior art keywords
conductive paste
conductive
hardener
less
substrate
Prior art date
Application number
TW113131783A
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English (en)
Chinese (zh)
Inventor
大當悠太
山中雄太
大倉滉生
永井康晴
石塚朱莉
Original Assignee
日商積水化學工業股份有限公司
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Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202513745A publication Critical patent/TW202513745A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
TW113131783A 2023-08-25 2024-08-23 導電糊、rfid嵌體及rfid嵌體之製造方法 TW202513745A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023137309 2023-08-25
JP2023-137309 2023-08-25

Publications (1)

Publication Number Publication Date
TW202513745A true TW202513745A (zh) 2025-04-01

Family

ID=94819129

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113131783A TW202513745A (zh) 2023-08-25 2024-08-23 導電糊、rfid嵌體及rfid嵌體之製造方法

Country Status (4)

Country Link
JP (1) JP7702052B1 (https=)
CN (1) CN120836064A (https=)
TW (1) TW202513745A (https=)
WO (1) WO2025047575A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060111496A1 (en) 2004-11-24 2006-05-25 Stijn Gillissen Low temperature snap cure material with suitable worklife
WO2009054386A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
JP5824348B2 (ja) * 2010-12-14 2015-11-25 積水化学工業株式会社 異方性導電材料及び接続構造体
JP6231257B2 (ja) 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法
JP6302818B2 (ja) * 2014-10-20 2018-03-28 京セラ株式会社 リペアラブル接着剤組成物および電気・電子部品
KR102055114B1 (ko) * 2015-06-02 2019-12-12 데쿠세리아루즈 가부시키가이샤 접착제 조성물
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP2018060709A (ja) * 2016-10-06 2018-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
CN110300780A (zh) * 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体

Also Published As

Publication number Publication date
JPWO2025047575A1 (https=) 2025-03-06
WO2025047575A1 (ja) 2025-03-06
JP7702052B1 (ja) 2025-07-02
CN120836064A (zh) 2025-10-24

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