JPWO2025047575A1 - - Google Patents
Info
- Publication number
- JPWO2025047575A1 JPWO2025047575A1 JP2025517194A JP2025517194A JPWO2025047575A1 JP WO2025047575 A1 JPWO2025047575 A1 JP WO2025047575A1 JP 2025517194 A JP2025517194 A JP 2025517194A JP 2025517194 A JP2025517194 A JP 2025517194A JP WO2025047575 A1 JPWO2025047575 A1 JP WO2025047575A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023137309 | 2023-08-25 | ||
| JP2023137309 | 2023-08-25 | ||
| PCT/JP2024/029862 WO2025047575A1 (ja) | 2023-08-25 | 2024-08-22 | 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025047575A1 true JPWO2025047575A1 (https=) | 2025-03-06 |
| JP7702052B1 JP7702052B1 (ja) | 2025-07-02 |
| JPWO2025047575A5 JPWO2025047575A5 (https=) | 2025-08-06 |
Family
ID=94819129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025517194A Active JP7702052B1 (ja) | 2023-08-25 | 2024-08-22 | 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7702052B1 (https=) |
| CN (1) | CN120836064A (https=) |
| TW (1) | TW202513745A (https=) |
| WO (1) | WO2025047575A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060111496A1 (en) | 2004-11-24 | 2006-05-25 | Stijn Gillissen | Low temperature snap cure material with suitable worklife |
| WO2009054386A1 (ja) * | 2007-10-22 | 2009-04-30 | Nippon Chemical Industrial Co., Ltd. | 被覆導電性粉体およびそれを用いた導電性接着剤 |
| JP5824348B2 (ja) * | 2010-12-14 | 2015-11-25 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
| JP6231257B2 (ja) | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 導電性接着剤、及び電子部品の接続方法 |
| JP6302818B2 (ja) * | 2014-10-20 | 2018-03-28 | 京セラ株式会社 | リペアラブル接着剤組成物および電気・電子部品 |
| KR102055114B1 (ko) * | 2015-06-02 | 2019-12-12 | 데쿠세리아루즈 가부시키가이샤 | 접착제 조성물 |
| WO2017033934A1 (ja) * | 2015-08-24 | 2017-03-02 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
| JP2018060709A (ja) * | 2016-10-06 | 2018-04-12 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
| CN110300780A (zh) * | 2017-03-06 | 2019-10-01 | 迪睿合株式会社 | 树脂组合物、树脂组合物的制备方法和结构体 |
-
2024
- 2024-08-22 WO PCT/JP2024/029862 patent/WO2025047575A1/ja active Pending
- 2024-08-22 CN CN202480020367.1A patent/CN120836064A/zh active Pending
- 2024-08-22 JP JP2025517194A patent/JP7702052B1/ja active Active
- 2024-08-23 TW TW113131783A patent/TW202513745A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202513745A (zh) | 2025-04-01 |
| WO2025047575A1 (ja) | 2025-03-06 |
| JP7702052B1 (ja) | 2025-07-02 |
| CN120836064A (zh) | 2025-10-24 |
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