WO2025047575A1 - 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 - Google Patents

導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Download PDF

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Publication number
WO2025047575A1
WO2025047575A1 PCT/JP2024/029862 JP2024029862W WO2025047575A1 WO 2025047575 A1 WO2025047575 A1 WO 2025047575A1 JP 2024029862 W JP2024029862 W JP 2024029862W WO 2025047575 A1 WO2025047575 A1 WO 2025047575A1
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Prior art keywords
conductive paste
conductive
curing agent
weight
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PCT/JP2024/029862
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English (en)
French (fr)
Japanese (ja)
Inventor
悠太 大當
雄太 山中
滉生 大倉
康晴 永井
朱莉 石塚
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2025517194A priority Critical patent/JP7702052B1/ja
Priority to CN202480020367.1A priority patent/CN120836064A/zh
Publication of WO2025047575A1 publication Critical patent/WO2025047575A1/ja
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Definitions

  • the present invention relates to a conductive paste containing a conductive filler.
  • the present invention also relates to an RFID inlay using the conductive paste and a method for manufacturing an RFID inlay.
  • UHF Ultra High Frequency
  • RFID inlays which allow contactless data transmission and reception, are widely used in contactless RFID tags and contactless RFID cards.
  • UHF Ultra High Frequency
  • RFID inlays have attracted attention due to their long communication distances, and UHF band RFID inlays are used for a variety of items and purposes, such as commuter passes, inventory management, distribution management, and history management.
  • a conductive paste containing a conductive filler and binder resin may be used to bond and connect a chip with electrodes on its surface to a substrate with wiring (antenna pattern) on its surface.
  • Patent Document 1 discloses an adhesive that can be used for electronic components.
  • the adhesive is an acrylic adhesive composition that contains a radical initiator with a 10-hour half-life temperature of 80°C or less, a vinylene-containing oligomer, and at least one diluent.
  • the adhesive can snap cure at low temperatures, and the pot life of the adhesive at room temperature is 24 hours or more.
  • Patent Document 2 discloses a conductive adhesive that contains a polymerizable acrylic compound, an organic peroxide, and solder particles, and in which the one-minute half-life temperature of the organic peroxide is lower than the solidus temperature of the solder particles.
  • the object of the present invention is to provide a conductive paste that 1) has high storage stability, and that can 2) improve curing properties even when mounted in a relatively short time, 3) improve adhesion properties, 4) improve the tackiness of the cured product, and 5) improve electrical conductivity reliability.
  • Another object of the present invention is to provide an RFID inlay using the conductive paste, and a method for manufacturing an RFID inlay.
  • This specification discloses the following conductive paste, RFID inlay, and method for manufacturing an RFID inlay.
  • Item 1 A conductive paste containing a curable compound, a curing agent, and a conductive filler, the heat generation starting temperature being 50°C or higher and 80°C or lower when the conductive paste is heated from 30°C to 200°C at a heating rate of 10°C/min and differential scanning calorimetry is performed.
  • a conductive paste containing a curable compound, a curing agent, and a conductive filler the curing agent containing a secondary thiol curing agent or a primary thiol curing agent having no ester skeleton, and the conductive filler being conductive particles having resin particles and a conductive layer disposed on the surfaces of the resin particles, or metal particles having a melting point exceeding 450°C.
  • Item 3 The conductive paste according to item 1 or 2, wherein the curable compound includes a glycidylamine type epoxy compound.
  • Item 4 The conductive paste according to any one of items 1 to 3, wherein the curing agent includes a thiol curing agent having two or more thiol groups.
  • Item 5 The conductive paste according to any one of items 1 to 4, wherein the curing agent includes a thiol curing agent having a structure represented by the following formula (1):
  • R1, R2, R3, and R4 each represent an alkylene group having 1 to 5 carbon atoms.
  • Item 6 The conductive paste according to any one of items 1 to 5, wherein the curing agent includes a secondary thiol curing agent or a primary thiol curing agent that does not have an ester skeleton, and the total content of the secondary thiol curing agent and the primary thiol curing agent that does not have an ester skeleton is 5% by weight or more and 50% by weight or less in 100% by weight of the conductive paste.
  • Item 7 The conductive paste according to any one of items 1 to 6, wherein the curing agent includes a secondary thiol curing agent.
  • Item 8 The conductive paste according to any one of items 1 to 7, in which the heat generation end temperature is 85°C or higher and 180°C or lower when the conductive paste is heated from 30°C to 200°C at a heating rate of 10°C/min and differential scanning calorimetry is performed.
  • Item 9 A conductive paste according to any one of items 1 to 8, in which when the conductive paste is heated from 30°C to 200°C at a heating rate of 10°C/min and differential scanning calorimetry is performed, the absolute value of the difference between the heat generation start temperature and the heat generation end temperature is 5°C or more and 100°C or less.
  • Item 10 The conductive paste according to any one of items 1 to 9, wherein the curing agent includes a microcapsule type curing agent.
  • Item 11 The conductive paste according to Item 10, wherein the content of the microcapsule-type hardener is 5% by weight or more and 40% by weight or less in 100% by weight of the conductive paste.
  • Item 12 The conductive paste according to any one of items 1 to 11, wherein the particle diameter of the conductive filler is 10 ⁇ m or less.
  • Item 13 The conductive paste according to any one of items 1 to 12, wherein the content of the conductive filler is 0.1% by weight or more and 50% by weight or less in 100% by weight of the conductive paste.
  • Item 14 The conductive paste according to any one of items 1 to 13, wherein the curing agent includes an amine curing agent that is solid at 25°C.
  • Item 15 The conductive paste according to any one of items 1 to 14, further comprising a chelating agent.
  • Item 16 The conductive paste according to item 15, wherein the chelating agent includes a boric acid ester.
  • Item 17 The conductive paste according to any one of items 1 to 16, further comprising a non-conductive filler.
  • Item 18 The conductive paste according to item 17, wherein the ratio of the particle size of the non-conductive filler to the particle size of the conductive filler is 0.5 or less.
  • Item 19 A conductive paste according to any one of items 1 to 18, used to obtain an RFID inlay.
  • Item 20 An RFID inlay comprising a substrate having wiring on its surface, a chip having electrodes on its surface, and an adhesive portion bonding the substrate and the chip, the adhesive portion being made of the conductive paste described in any one of items 1 to 19, and the wiring and the electrodes being electrically connected by the conductive filler in the adhesive portion.
  • a method for manufacturing an RFID inlay comprising: a first arrangement step of arranging the conductive paste according to any one of items 1 to 19 on a surface of a substrate having wiring on its surface; a second arrangement step of arranging a chip having an electrode on its surface on the surface of the conductive paste opposite the substrate; and a bonding step of forming an adhesive part that bonds the substrate and the chip with the conductive paste by heating and pressurizing the conductive paste, and electrically connecting the wiring and the electrode with the conductive filler in the adhesive part.
  • Item 22 The method for manufacturing an RFID inlay according to Item 21, in which the substrate is long and the RFID inlay is manufactured by transporting the long substrate in the first placement process, the second placement process, and the bonding process using a roll-to-roll method.
  • the conductive paste according to the present invention is a conductive paste containing a curable compound, a curing agent, and a conductive filler, and when the conductive paste is heated from 30°C to 200°C at a temperature increase rate of 10°C/min and differential scanning calorimetry is performed, the heat generation start temperature is 50°C or higher and 80°C or lower. Since the conductive paste according to the present invention has the above configuration, 1) storage stability is improved, and even when mounted in a relatively short time, 2) curability can be improved, 3) adhesion can be improved, 4) tackiness of the cured product can be improved, and 5) electrical conductivity reliability can be improved.
  • Another conductive paste according to the present invention is a conductive paste containing a curable compound, a curing agent, and a conductive filler, in which the curing agent contains a secondary thiol curing agent or a primary thiol curing agent that does not have an ester skeleton, and the conductive filler is a conductive particle having a resin particle and a conductive layer disposed on the surface of the resin particle, or a metal particle having a melting point exceeding 450°C.
  • the conductive paste according to the present invention has the above configuration, 1) storage stability is improved, and even when mounted in a relatively short time, 2) curability can be improved, 3) adhesion can be improved, 4) tackiness of the cured product can be improved, and 5) conductivity reliability can be improved.
  • FIG. 1 is a cross-sectional view showing a schematic diagram of an RFID inlay using a conductive paste according to a first embodiment of the present invention.
  • the conductive paste (first conductive paste) according to the present invention is a conductive paste containing a curable compound, a curing agent, and a conductive filler.
  • the heat generation starting temperature is 50° C. or higher and 80° C. or lower.
  • the conductive paste (second conductive paste) according to the present invention is a conductive paste containing a curable compound, a curing agent, and a conductive filler.
  • the curing agent contains a secondary thiol curing agent, or a primary thiol curing agent that does not have an ester skeleton.
  • the conductive filler is a conductive particle having a resin particle and a conductive layer disposed on the surface of the resin particle, or a metal particle having a melting point exceeding 450°C.
  • the inventors have found that the above problems can be solved by controlling the heat generation initiation temperature within a specific range when differential scanning calorimetry is performed on the conductive paste.
  • the inventors have also found that the above problems can be solved by using a conductive paste with a specific composition.
  • the conductive paste according to the present invention since the conductive paste according to the present invention has the above-mentioned configuration, it is possible to extend the pot life (useable time) (improve storage stability). Furthermore, since the conductive paste according to the present invention has the above-mentioned configuration, it is possible to enhance the curing property and sufficiently cure even when mounted (heated) in a relatively short time (e.g., within 15 seconds). In particular, since the second conductive paste has the above-mentioned configuration, it is possible to enhance the curing property and sufficiently cure even when mounted (heated) at a relatively low temperature (e.g., 160°C to 200°C) and in a relatively short time (e.g., within 15 seconds). Furthermore, since the conductive paste according to the present invention has the above-mentioned configuration, it is possible to enhance the adhesion, improve the tackiness of the cured product, and improve the reliability of conductivity even when mounted in a relatively short time.
  • a relatively low temperature e.g.,
  • the conductive paste is heated from 30°C to 200°C at a heating rate of 10°C/min, and differential scanning calorimetry (DSC) is performed.
  • the conductive paste according to the present invention (first conductive paste) has a heat generation start temperature of 50°C or higher and 80°C or lower.
  • the second conductive paste has a heat generation start temperature of 50°C or higher and 80°C or lower.
  • the heat generation start temperature refers to the temperature at which the amount of heat generated starts to increase from the baseline.
  • the heat generation end temperature refers to the temperature at which the amount of heat generated, after reaching the heat generation peak top, falls to 1% of the amount of heat generated at the heat generation peak top.
  • the above differential scanning calorimetry can be performed in the following manner.
  • a differential scanning calorimetry device is prepared. 5 mg of the above conductive paste is placed in a special aluminum pan and the lid is placed using a special tool. This special aluminum pan and an empty aluminum pan (reference) are placed in a heating unit and heated in air from 30°C to 200°C at a heating rate of 10°C/min, and reverse heat flow and non-reverse heat flow are observed. The heat generation peak observed in the non-reverse heat flow is regarded as the heat generation peak of the conductive paste.
  • An example of the above differential scanning calorimetry device is the "TA7000" manufactured by Hitachi High-Tech Science Corporation.
  • the heat generation onset temperature can be measured.
  • the heat generation onset temperature is preferably 50°C or higher, more preferably 55°C or higher, and even more preferably 60°C or higher, and is preferably 80°C or lower, more preferably 75°C or lower, and even more preferably 70°C or lower.
  • the heat generation peak top temperature can be measured. From the viewpoint of further improving the electrical conductivity reliability even when mounted in a relatively short time, the heat generation peak top temperature is preferably 80°C or higher, more preferably 90°C or higher, and even more preferably 100°C or higher, and is preferably 145°C or lower, more preferably 140°C or lower, and even more preferably 130°C or lower.
  • the heat generation end temperature can be measured.
  • the heat generation end temperature is preferably 85°C or higher, more preferably 90°C or higher, even more preferably 95°C or higher, and particularly preferably 100°C or higher, and is preferably 180°C or lower, more preferably 175°C or lower, and even more preferably 170°C or lower.
  • methods for adjusting the heat generation start temperature, heat generation peak top temperature, and heat generation end temperature to the above preferred ranges include a method of increasing the content of the curing agent relative to the content of the curable compound, and a method of adjusting the type and combination of the curing agent.
  • the absolute value of the difference between the heat generation start temperature and the heat generation end temperature is preferably 5°C or more, more preferably 10°C or more, even more preferably 15°C or more, particularly preferably 20°C or more, and is preferably 100°C or less, more preferably 95°C or less, even more preferably 90°C or less, particularly preferably 85°C or less, and most preferably 80°C or less. If the absolute value of the difference between the heat generation start temperature and the heat generation end temperature is equal to or more than the above lower limit and equal to or less than the above upper limit, the storage stability of the conductive paste can be improved, and the conductivity reliability can be further improved even when mounted in a relatively short time.
  • the conductive paste according to the present invention is in a paste form at 25°C.
  • the conductive paste is used by discharging it at, for example, 20°C to 50°C. It is preferable that the conductive paste according to the present invention is used by discharging it using a jet dispenser.
  • the viscosity ( ⁇ 25) of the conductive paste at 25°C is preferably 15 Pa ⁇ s or more, more preferably 25 Pa ⁇ s or more, even more preferably 40 Pa ⁇ s or more, and is preferably 200 Pa ⁇ s or less, more preferably 150 Pa ⁇ s or less, even more preferably 100 Pa ⁇ s or less. If the viscosity ( ⁇ 25) is equal to or greater than the lower limit, the conductive paste can be prevented from flowing out from the wiring. If the viscosity ( ⁇ 25) is equal to or less than the upper limit, the conductive paste can be placed with high precision on the fine wiring.
  • the viscosity ( ⁇ 25) can be measured, for example, using an E-type viscometer at 25°C and 5 rpm for the conductive paste immediately after preparation.
  • E-type viscometer examples include the TV35 viscometer manufactured by Toki Sangyo Co., Ltd.
  • the storage stability can be further improved and the conductive paste can be prevented from flowing out of the wiring.
  • the ratio (viscosity after storage ( ⁇ )/viscosity immediately after preparation ( ⁇ 25)) is equal to or less than the upper limit or less than the upper limit, the conductive paste can be arranged on the fine wiring with high precision.
  • the viscosity after storage ( ⁇ ) can be measured, for example, by storing the conductive paste in a thermo-hygrostat at 25°C and 50% RH for 24 hours and then using an E-type viscometer at 25°C and 5 rpm.
  • E-type viscometer examples include the TV35 viscometer manufactured by Toki Sangyo Co., Ltd.
  • the conductive paste is preferably an anisotropic conductive paste.
  • the conductive paste is preferably used for electrically connecting electrodes.
  • the conductive paste is preferably used for obtaining a connection structure.
  • the conductive paste is preferably used for obtaining electronic components.
  • the conductive paste is particularly preferably used for obtaining an RFID inlay (use of the conductive paste for obtaining an RFID inlay).
  • the conductive paste is preferably used for bonding and connecting a chip having an electrode on its surface to a substrate having wiring (antenna pattern) on its surface (use of the conductive paste for bonding and connecting a chip having an electrode on its surface to a substrate having wiring (antenna pattern) on its surface).
  • (meth)acrylate refers to acrylate and methacrylate.
  • (meth)acrylic refers to acrylic and methacrylic.
  • the curable compound includes a thermosetting compound and a photocurable compound.
  • the curable compound is preferably a thermosetting compound.
  • the thermosetting compound is a compound that can be cured by heating.
  • the thermosetting compound includes a (meth)acrylic compound, an oxetane compound, an epoxy compound, an episulfide compound, a phenol compound, an amino compound, an unsaturated polyester compound, a polyurethane compound, a silicone compound, and a polyimide compound.
  • the curable compound may be used alone or in combination of two or more kinds.
  • the curable compound contains an epoxy compound.
  • the above epoxy compounds include glycidylamine type epoxy compounds, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton.
  • the curable compound contains a bisphenol A type epoxy compound or a bisphenol F type epoxy compound.
  • the curable compound needs to contain at least one of a bisphenol A type epoxy compound and a bisphenol F type epoxy compound, and may contain both.
  • the curing agent includes a secondary thiol curing agent or a primary thiol curing agent that does not have an ester skeleton.
  • the curing agent needs to include at least one of a secondary thiol curing agent and a primary thiol curing agent that does not have an ester skeleton, and may include both.
  • the above secondary thiol compounds include pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(2-(3-sulfanylbutanoyloxy)ethyl)-1,3,5-triazinane-2,4,6-trione, and trimethylolpropane tris(3-mercaptobutyrate).
  • the thiol compound (thiol hardener) is a secondary thiol compound (secondary thiol hardener).
  • the hardener contains a secondary thiol compound (secondary thiol hardener).
  • R1, R2, R3 and R4 may be the same or different.
  • the microcapsule type hardener may be a commercially available product.
  • Examples of commercially available microcapsule type hardeners include Novacure HX3088, Novacure HX3941, Novacure HXA4922HP, Novacure HX3742, Novacure HX3722, and Novacure HXA9042HP (all manufactured by Asahi Kasei E-Materials Corporation).
  • the curing agent contains a secondary thiol curing agent or a primary thiol curing agent that does not have an ester skeleton, and the microcapsule-type curing agent.
  • the content of the hardener in the conductive paste (100% by weight) is preferably 5% by weight or more, more preferably 10% by weight or more, and even more preferably 15% by weight or more, and is preferably 50% by weight or less, more preferably 45% by weight or less, and even more preferably 40% by weight or less. If the content of the hardener is equal to or greater than the lower limit and equal to or less than the upper limit, the hardening property can be further improved, the adhesion property can be further improved, the tackiness of the hardened product can be further improved, and the electrical reliability can be further improved, even when mounting is performed in a relatively short time. In addition, when the hardener contains two or more types of hardeners, the content of the hardener indicates the total content of the two or more types of hardeners. (The same applies below)
  • the content of the curing agent is preferably 40 parts by weight or more, more preferably 50 parts by weight or more, preferably 90 parts by weight or less, more preferably 80 parts by weight or less, relative to 100 parts by weight of the curable compound.
  • the content of the curing agent is equal to or more than the lower limit and equal to or less than the upper limit, even when mounting is performed in a relatively short time, the curability can be further improved, the adhesiveness can be further improved, the tackiness of the cured product can be further improved, and the electrical conductivity reliability can be further improved.
  • the content of the secondary thiol hardener in the conductive paste (100% by weight) is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, and is preferably 50% by weight or less, more preferably 45% by weight or less, and even more preferably 40% by weight or less.
  • the content of the secondary thiol hardener is equal to or more than the lower limit and equal to or less than the upper limit, even when mounting is performed in a relatively short time, the hardening property can be further improved, the adhesion property can be further improved, the tackiness of the hardened product can be further improved, and the electrical conductivity reliability can be further improved.
  • the total content of the secondary thiol curing agent and the amine curing agent that is solid at 25°C is preferably 7% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, and preferably 50% by weight or less, more preferably 45% by weight or less, and even more preferably 40% by weight or less.
  • the total content of the secondary thiol curing agent and the amine curing agent that is solid at 25°C is preferably 40 parts by weight or more, more preferably 50 parts by weight or more, preferably 90 parts by weight or less, and more preferably 80 parts by weight or less.
  • the total content of the secondary thiol curing agent and the amine curing agent that is solid at 25°C is equal to or more than the lower limit and equal to or less than the upper limit, even when mounted in a relatively short time, the curability can be further improved, the adhesion can be further improved, the tackiness of the cured product can be further improved, and the electrical conductivity reliability can be further improved.
  • the total content of the secondary thiol curing agent and the primary thiol curing agent not having an ester skeleton is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, and preferably 50% by weight or less, more preferably 45% by weight or less, and even more preferably 40% by weight or less.
  • the total content of the secondary thiol curing agent and the primary thiol curing agent not having an ester skeleton is equal to or more than the above lower limit and equal to or less than the above upper limit, the curing property can be further improved even when mounted (heated) at a relatively low temperature and in a relatively short time.
  • the adhesiveness can be further improved, the tackiness of the cured product can be further improved, and the conductive reliability can be further improved.
  • the curing agent contains only one of the secondary thiol curing agent and the primary thiol curing agent not having an ester skeleton, the total content of the secondary thiol curing agent and the primary thiol curing agent not having an ester skeleton indicates the content of one of the curing agents.
  • the total content of the secondary thiol curing agent and the primary thiol curing agent not having an ester skeleton indicates the total content of both curing agents.
  • the conductive filler is not particularly limited, and may be conductive particles or carbon fibers.
  • the conductive filler is a conductive particle having a resin particle and a conductive layer arranged on the surface of the resin particle, or a metal particle having a melting point exceeding 450°C.
  • the conductive filler is a conductive particle having a resin particle and a conductive layer arranged on the surface of the resin particle, or a metal particle having a melting point exceeding 450°C.
  • the conductive filler may be a conductive particle having a resin particle and a conductive layer arranged on the surface of the resin particle, or may be a metal particle having a melting point exceeding 450°C.
  • the resin particle is a base particle.
  • the conductive filler is a metal particle having a melting point exceeding 450°C.
  • the conductive filler is metal particles having a melting point exceeding 450°C.
  • the conductive filler in the second conductive paste is different from solder particles. Since the second conductive paste has the above configuration, it is possible to improve the ejection stability of the conductive paste. When only metal particles (e.g., solder particles) having a melting point of 450°C or less are used as the conductive filler, it is difficult to sufficiently improve the ejection stability of the conductive paste compared to when metal particles having a melting point exceeding 450°C are used.
  • metal particles e.g., solder particles having a melting point of 450°C or less
  • the shape of the conductive filler is not particularly limited.
  • the shape of the conductive filler may be spherical, may be a shape other than spherical, or may be flat, etc.
  • the particle diameter of the above conductive particle is preferably 0.1 ⁇ m or more, more preferably 1 ⁇ m or more, even more preferably 2 ⁇ m or more, and preferably 100 ⁇ m or less, more preferably 30 ⁇ m or less, even more preferably 10 ⁇ m or less. If the particle diameter of the above conductive particle is equal to or more than the above lower limit and equal to or less than the above upper limit, the conductivity reliability can be further improved even when mounting is performed in a relatively short time.
  • the particle diameter of the conductive filler is preferably 0.1 ⁇ m or more, more preferably 1 ⁇ m or more, even more preferably 2 ⁇ m or more, and is preferably 100 ⁇ m or less, more preferably 30 ⁇ m or less, even more preferably 10 ⁇ m or less. If the particle diameter of the conductive particles is equal to or greater than the lower limit and equal to or less than the upper limit, the reliability of conductivity can be further improved even when mounting is performed in a relatively short time.
  • the particle diameter of the conductive particles and conductive filler is preferably an average particle diameter, and more preferably a number average particle diameter.
  • the average particle diameter of the conductive particles and conductive filler can be determined, for example, by observing 50 arbitrary conductive particles and conductive fillers with an electron microscope or optical microscope and calculating the average particle diameter of each conductive particle and conductive filler, or by performing laser diffraction particle size distribution measurement.
  • the particle diameter of the conductive particles is measured by observing 50 arbitrary conductive particles with an electron microscope or optical microscope, it can be measured, for example, as follows.
  • the conductive particles are added to "Technovit 4000" manufactured by Kulzer so that the content of the conductive particles is 30% by weight, and dispersed to prepare an embedding resin body for conductive particle inspection.
  • a cross section of the conductive particle is cut out using an ion milling device ("IM4000" manufactured by Hitachi High-Technologies Corporation) so as to pass through the vicinity of the center of the conductive particles dispersed in the embedding resin body for conductive particle inspection.
  • the image magnification is set to 25,000 times, 50 conductive particles are randomly selected, and each conductive particle is observed.
  • the circle equivalent diameter of each conductive particle is measured, and the arithmetic mean of the measured diameters is determined as the particle diameter of the conductive particle.
  • FE-SEM field emission scanning electron microscope
  • the coefficient of variation (CV value) of the particle diameter of the conductive particles is preferably 10% or less, more preferably 5% or less.
  • the coefficient of variation of the particle diameter of the conductive particles is equal to or less than the upper limit, the reliability of electrical conductivity can be further improved.
  • the coefficient of variation (CV value) of the particle diameter of the conductive particles may be 0% or more, or 1% or more.
  • CV value The above coefficient of variation (CV value) can be measured as follows.
  • CV value (%) ( ⁇ /Dn) ⁇ 100 ⁇ : Standard deviation of the particle diameter of the conductive particles Dn: Average particle diameter of the conductive particles
  • the conductive paste contains 100% by weight of the conductive filler, and the content of the conductive filler is preferably 0.1% by weight or more, more preferably 1% by weight or more, and even more preferably 5% by weight or more, and is preferably 80% by weight or less, more preferably 60% by weight or less, and even more preferably 50% by weight or less. If the content of the conductive filler is equal to or more than the lower limit and equal to or less than the upper limit, the reliability of conductivity can be further improved even when mounting is performed in a relatively short time.
  • the content of the conductive filler is preferably 2 parts by weight or more, more preferably 3 parts by weight or more, even more preferably 5 parts by weight or more, and particularly preferably 7 parts by weight or more, relative to 100 parts by weight of the curable compound.
  • the content of the conductive filler is preferably 35 parts by weight or less, more preferably 30 parts by weight or less, even more preferably 25 parts by weight or less, and particularly preferably 20 parts by weight or less, relative to 100 parts by weight of the curable compound.
  • the conductive filler preferably contains a metal.
  • the metal include gold, silver, copper, platinum, palladium, zinc, lead, aluminum, cobalt, indium, ruthenium, nickel, chromium, titanium, antimony, bismuth, germanium, and cadmium, as well as alloys thereof.
  • Tin-doped indium oxide (ITO) may also be used as the metal. Only one of the above metals may be used, or two or more of them may be used in combination.
  • the conductive filler preferably contains a tin-containing alloy, nickel, palladium, ruthenium, silver, copper or gold, and more preferably contains nickel or palladium. From the viewpoint of increasing the corrosion resistance of the conductive filler and maintaining high electrical conductivity reliability, the conductive filler preferably contains nickel or gold, and more preferably contains nickel. From the viewpoint of increasing the corrosion resistance of the conductive filler and maintaining high electrical conductivity reliability, it is particularly preferable that the conductive filler contains nickel on the outer surface.
  • the conductive particles are metal particles
  • examples of the metal particles include silver, copper, nickel, silicon, gold, titanium, and alloys such as solder. From the viewpoint of more effectively increasing the reliability of electrical conduction, it is preferable that the material of the metal particles contains nickel or a nickel alloy, and it is more preferable that the material of the metal particles is nickel or a nickel alloy. From the viewpoint of more effectively increasing the reliability of electrical conduction, it is preferable that the outer surface portion of the metal particles contains nickel or a nickel alloy.
  • the conductive particle which includes a base particle and a conductive portion disposed on the surface of the base particle.
  • the base particles include resin particles, inorganic particles other than metal particles, organic-inorganic hybrid particles, and metal particles.
  • the base particles are preferably base particles other than metal particles, and more preferably resin particles, inorganic particles other than metal particles, or organic-inorganic hybrid particles.
  • the base particles may be core-shell particles having a core and a shell disposed on the surface of the core.
  • the core may be an organic core, and the shell may be an inorganic shell.
  • the above-mentioned base particles are more preferably resin particles or organic-inorganic hybrid particles, and may be resin particles or organic-inorganic hybrid particles. By using these preferred base particles, the effects of the present invention are more effectively exhibited.
  • the material for the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; acrylic resins such as polymethyl methacrylate and polymethyl acrylate; polyalkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polysulfone, polyphenylene oxide, polyacetal, polyimide, polyamideimide, polyether ether ketone, polyether sulfone, divinylbenzene polymer, and polymers obtained by polymerizing one or more of various polymeriz
  • the divinylbenzene polymer may be a divinylbenzene copolymer.
  • examples of the divinylbenzene copolymer include divinylbenzene-styrene copolymer and divinylbenzene-(meth)acrylic acid ester copolymer.
  • the material of the resin particles is a polymer obtained by polymerizing one or more polymerizable monomers having multiple ethylenically unsaturated groups.
  • examples of the polymerizable monomer having an ethylenically unsaturated group include non-crosslinkable monomers and crosslinkable monomers.
  • non-crosslinkable monomers include styrene-based monomers such as styrene and ⁇ -methylstyrene; carboxyl group-containing monomers such as (meth)acrylic acid, maleic acid, and maleic anhydride; alkyl (meth)acrylate compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate; 2-hydroxyethyl Examples of such monomers include oxygen-containing (meth)acrylate compounds such as (meth)acrylate, glycerol (meth)acrylate, polyoxyethylene (meth)acrylate, and
  • crosslinkable monomers include tetramethylolmethane tetra(meth)acrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, glycerol tri(meth)acrylate, glycerol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propane tri ...
  • Examples include polyfunctional (meth)acrylate compounds such as propylene glycol di(meth)acrylate, (poly)tetramethylene glycol di(meth)acrylate, and 1,4-butanediol di(meth)acrylate; and silane-containing monomers such as triallyl (iso)cyanurate, triallyl trimellitate, divinylbenzene, diallyl phthalate, diallyl acrylamide, diallyl ether, ⁇ -(meth)acryloxypropyltrimethoxysilane, trimethoxysilylstyrene, and vinyltrimethoxysilane.
  • silane-containing monomers such as triallyl (iso)cyanurate, triallyl trimellitate, divinylbenzene, diallyl phthalate, diallyl acrylamide, diallyl ether, ⁇ -(meth)acryloxypropyltrimethoxysilane, trimethoxysilylstyrene, and vinyltrimeth
  • the resin particles can be obtained by polymerizing the polymerizable monomer having the ethylenically unsaturated group by a known method. Examples of such methods include a method of suspension polymerization in the presence of a radical polymerization initiator, and a method of using non-crosslinked seed particles to swell and polymerize the monomer together with a radical polymerization initiator.
  • the base particles are inorganic particles other than metal particles or organic-inorganic hybrid particles
  • examples of the inorganic material of the base particles include silica, alumina, barium titanate, zirconia, and carbon black. It is preferable that the inorganic material is not a metal.
  • the particles formed from silica are not particularly limited, but examples include particles obtained by hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups to form crosslinked polymer particles, and then baking the particles as necessary.
  • the organic-inorganic hybrid particles include organic-inorganic hybrid particles formed from a crosslinked alkoxysilyl polymer and an acrylic resin.
  • the organic-inorganic hybrid particles are preferably core-shell type organic-inorganic hybrid particles having a core and a shell disposed on the surface of the core.
  • the core is preferably an organic core.
  • the shell is preferably an inorganic shell.
  • the base particle is preferably an organic-inorganic hybrid particle having an organic core and an inorganic shell disposed on the surface of the organic core.
  • Examples of the organic core material include the resin particle materials mentioned above.
  • the material of the inorganic shell may be any of the inorganic substances listed as the material of the base particle described above.
  • the material of the inorganic shell is preferably silica.
  • the inorganic shell is preferably formed by forming a shell-like material from a metal alkoxide on the surface of the core by a sol-gel method, and then firing the shell-like material.
  • the metal alkoxide is preferably a silane alkoxide.
  • the inorganic shell is preferably formed from a silane alkoxide.
  • the base particles are metal particles
  • examples of the metal particles include silver, copper, nickel, silicon, gold, titanium, and alloys such as solder.
  • the melting point of the metal particles is preferably greater than 450°C, more preferably 500°C or higher, even more preferably 600°C or higher, even more preferably 700°C or higher, even more preferably 800°C or higher, and particularly preferably 900°C or higher. If the melting point of the metal particles is equal to or higher than the lower limit, the discharge stability of the conductive paste can be further improved.
  • the melting point of the metal particles may be equal to or lower than 3000°C, or may be equal to or lower than 2500°C.
  • the range of the melting point of the metal particles can be set by appropriately selecting the lower limit and the upper limit.
  • the particle diameter of the base particles is preferably 0.01 ⁇ m or more, more preferably 0.05 ⁇ m or more, even more preferably 0.5 ⁇ m or more, even more preferably 1 ⁇ m or more, and particularly preferably 3 ⁇ m or more, and is preferably 50 ⁇ m or less, more preferably 30 ⁇ m or less, even more preferably 20 ⁇ m or less, and particularly preferably 10 ⁇ m or less.
  • the particle diameter of the base particles is equal to or greater than the lower limit, the electrical conductivity reliability is further increased.
  • aggregation is less likely to occur, and aggregated conductive particles are less likely to be formed.
  • the conductive particles are easily compressed sufficiently, and the connection resistance between the electrodes connected via the conductive particles can be further effectively reduced.

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PCT/JP2024/029862 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Pending WO2025047575A1 (ja)

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Citations (9)

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Publication number Priority date Publication date Assignee Title
JP2006144018A (ja) 2004-11-24 2006-06-08 Natl Starch & Chem Investment Holding Corp 適切な可使時間を有する低温スナップ硬化型材料
WO2009054386A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
JP2012142271A (ja) * 2010-12-14 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2013124330A (ja) 2011-12-15 2013-06-24 Dexerials Corp 導電性接着剤、及び電子部品の接続方法
JP2016079313A (ja) * 2014-10-20 2016-05-16 京セラケミカル株式会社 リペアラブル接着剤組成物および電気・電子部品
WO2016194952A1 (ja) * 2015-06-02 2016-12-08 デクセリアルズ株式会社 接着剤組成物
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP2018060709A (ja) * 2016-10-06 2018-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2018145418A (ja) * 2017-03-06 2018-09-20 デクセリアルズ株式会社 樹脂組成物、樹脂組成物の製造方法、及び構造体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006144018A (ja) 2004-11-24 2006-06-08 Natl Starch & Chem Investment Holding Corp 適切な可使時間を有する低温スナップ硬化型材料
WO2009054386A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
JP2012142271A (ja) * 2010-12-14 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2013124330A (ja) 2011-12-15 2013-06-24 Dexerials Corp 導電性接着剤、及び電子部品の接続方法
JP2016079313A (ja) * 2014-10-20 2016-05-16 京セラケミカル株式会社 リペアラブル接着剤組成物および電気・電子部品
WO2016194952A1 (ja) * 2015-06-02 2016-12-08 デクセリアルズ株式会社 接着剤組成物
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP2018060709A (ja) * 2016-10-06 2018-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2018145418A (ja) * 2017-03-06 2018-09-20 デクセリアルズ株式会社 樹脂組成物、樹脂組成物の製造方法、及び構造体

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