JP7702052B1 - 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 - Google Patents

導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Download PDF

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JP7702052B1
JP7702052B1 JP2025517194A JP2025517194A JP7702052B1 JP 7702052 B1 JP7702052 B1 JP 7702052B1 JP 2025517194 A JP2025517194 A JP 2025517194A JP 2025517194 A JP2025517194 A JP 2025517194A JP 7702052 B1 JP7702052 B1 JP 7702052B1
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conductive paste
conductive
curing agent
weight
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JP2025517194A
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Japanese (ja)
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JPWO2025047575A1 (https=
JPWO2025047575A5 (https=
Inventor
悠太 大當
雄太 山中
滉生 大倉
康晴 永井
朱莉 石塚
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
JP2025517194A 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Active JP7702052B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023137309 2023-08-25
JP2023137309 2023-08-25
PCT/JP2024/029862 WO2025047575A1 (ja) 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Publications (3)

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JPWO2025047575A1 JPWO2025047575A1 (https=) 2025-03-06
JP7702052B1 true JP7702052B1 (ja) 2025-07-02
JPWO2025047575A5 JPWO2025047575A5 (https=) 2025-08-06

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JP2025517194A Active JP7702052B1 (ja) 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

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JP (1) JP7702052B1 (https=)
CN (1) CN120836064A (https=)
TW (1) TW202513745A (https=)
WO (1) WO2025047575A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009054386A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
WO2016194952A1 (ja) * 2015-06-02 2016-12-08 デクセリアルズ株式会社 接着剤組成物
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP2018060709A (ja) * 2016-10-06 2018-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060111496A1 (en) 2004-11-24 2006-05-25 Stijn Gillissen Low temperature snap cure material with suitable worklife
JP5824348B2 (ja) * 2010-12-14 2015-11-25 積水化学工業株式会社 異方性導電材料及び接続構造体
JP6231257B2 (ja) 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法
JP6302818B2 (ja) * 2014-10-20 2018-03-28 京セラ株式会社 リペアラブル接着剤組成物および電気・電子部品
CN110300780A (zh) * 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009054386A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
WO2016194952A1 (ja) * 2015-06-02 2016-12-08 デクセリアルズ株式会社 接着剤組成物
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP2018060709A (ja) * 2016-10-06 2018-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法

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Publication number Publication date
TW202513745A (zh) 2025-04-01
JPWO2025047575A1 (https=) 2025-03-06
WO2025047575A1 (ja) 2025-03-06
CN120836064A (zh) 2025-10-24

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