JPWO2025009514A5 - - Google Patents

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Publication number
JPWO2025009514A5
JPWO2025009514A5 JP2024569412A JP2024569412A JPWO2025009514A5 JP WO2025009514 A5 JPWO2025009514 A5 JP WO2025009514A5 JP 2024569412 A JP2024569412 A JP 2024569412A JP 2024569412 A JP2024569412 A JP 2024569412A JP WO2025009514 A5 JPWO2025009514 A5 JP WO2025009514A5
Authority
JP
Japan
Prior art keywords
substrate
resin composition
laminate
curable resin
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024569412A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025009514A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/023874 external-priority patent/WO2025009514A1/ja
Publication of JPWO2025009514A1 publication Critical patent/JPWO2025009514A1/ja
Publication of JPWO2025009514A5 publication Critical patent/JPWO2025009514A5/ja
Pending legal-status Critical Current

Links

JP2024569412A 2023-07-03 2024-07-02 Pending JPWO2025009514A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023109512 2023-07-03
PCT/JP2024/023874 WO2025009514A1 (ja) 2023-07-03 2024-07-02 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置及び積層体の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025009514A1 JPWO2025009514A1 (https=) 2025-01-09
JPWO2025009514A5 true JPWO2025009514A5 (https=) 2026-03-27

Family

ID=94171450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024569412A Pending JPWO2025009514A1 (https=) 2023-07-03 2024-07-02

Country Status (3)

Country Link
JP (1) JPWO2025009514A1 (https=)
TW (1) TW202506893A (https=)
WO (1) WO2025009514A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6724091B1 (en) * 2002-10-24 2004-04-20 Intel Corporation Flip-chip system and method of making same
CN102712740B (zh) * 2009-09-14 2015-07-08 纳美仕有限公司 用于高密度互连倒装晶片的底部填充料
EP2781553A4 (en) * 2011-11-15 2015-07-08 Nippon Catalytic Chem Ind SILICONE COMPOSITION, HARDENABLE RESIN COMPOSITION AND SEALING MATERIAL
US9593240B2 (en) * 2012-11-13 2017-03-14 Jnc Corporation Thermosetting resin composition
JP2017119848A (ja) 2015-12-25 2017-07-06 Jnc株式会社 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
WO2018025850A1 (ja) 2016-08-03 2018-02-08 三菱ケミカル株式会社 樹脂組成物
TW202340324A (zh) * 2021-12-23 2023-10-16 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化膜、積層體、攝像裝置、半導體裝置、積層體之製造方法、及具有接合電極之元件之製造方法
JP2023094125A (ja) * 2021-12-23 2023-07-05 積水化学工業株式会社 樹脂硬化物、硬化性樹脂組成物、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法

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