JPWO2025009514A1 - - Google Patents
Info
- Publication number
- JPWO2025009514A1 JPWO2025009514A1 JP2024569412A JP2024569412A JPWO2025009514A1 JP WO2025009514 A1 JPWO2025009514 A1 JP WO2025009514A1 JP 2024569412 A JP2024569412 A JP 2024569412A JP 2024569412 A JP2024569412 A JP 2024569412A JP WO2025009514 A1 JPWO2025009514 A1 JP WO2025009514A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023109512 | 2023-07-03 | ||
| PCT/JP2024/023874 WO2025009514A1 (ja) | 2023-07-03 | 2024-07-02 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置及び積層体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025009514A1 true JPWO2025009514A1 (https=) | 2025-01-09 |
| JPWO2025009514A5 JPWO2025009514A5 (https=) | 2026-03-27 |
Family
ID=94171450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024569412A Pending JPWO2025009514A1 (https=) | 2023-07-03 | 2024-07-02 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025009514A1 (https=) |
| TW (1) | TW202506893A (https=) |
| WO (1) | WO2025009514A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6724091B1 (en) * | 2002-10-24 | 2004-04-20 | Intel Corporation | Flip-chip system and method of making same |
| CN102712740B (zh) * | 2009-09-14 | 2015-07-08 | 纳美仕有限公司 | 用于高密度互连倒装晶片的底部填充料 |
| EP2781553A4 (en) * | 2011-11-15 | 2015-07-08 | Nippon Catalytic Chem Ind | SILICONE COMPOSITION, HARDENABLE RESIN COMPOSITION AND SEALING MATERIAL |
| US9593240B2 (en) * | 2012-11-13 | 2017-03-14 | Jnc Corporation | Thermosetting resin composition |
| JP2017119848A (ja) | 2015-12-25 | 2017-07-06 | Jnc株式会社 | 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料 |
| WO2018025850A1 (ja) | 2016-08-03 | 2018-02-08 | 三菱ケミカル株式会社 | 樹脂組成物 |
| TW202340324A (zh) * | 2021-12-23 | 2023-10-16 | 日商積水化學工業股份有限公司 | 硬化性樹脂組成物、硬化膜、積層體、攝像裝置、半導體裝置、積層體之製造方法、及具有接合電極之元件之製造方法 |
| JP2023094125A (ja) * | 2021-12-23 | 2023-07-05 | 積水化学工業株式会社 | 樹脂硬化物、硬化性樹脂組成物、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
-
2024
- 2024-07-02 JP JP2024569412A patent/JPWO2025009514A1/ja active Pending
- 2024-07-02 TW TW113124718A patent/TW202506893A/zh unknown
- 2024-07-02 WO PCT/JP2024/023874 patent/WO2025009514A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| TW202506893A (zh) | 2025-02-16 |
| WO2025009514A1 (ja) | 2025-01-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241122 |