TW202506893A - 硬化性樹脂組成物、硬化膜、積層體、攝像裝置、半導體裝置及積層體之製造方法 - Google Patents

硬化性樹脂組成物、硬化膜、積層體、攝像裝置、半導體裝置及積層體之製造方法 Download PDF

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Publication number
TW202506893A
TW202506893A TW113124718A TW113124718A TW202506893A TW 202506893 A TW202506893 A TW 202506893A TW 113124718 A TW113124718 A TW 113124718A TW 113124718 A TW113124718 A TW 113124718A TW 202506893 A TW202506893 A TW 202506893A
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TW
Taiwan
Prior art keywords
substrate
resin composition
curable resin
electrode
organic layer
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TW113124718A
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English (en)
Chinese (zh)
Inventor
塩島太郎
國澤主
野元颯
佐藤憲一朗
浅野元彦
七里徳重
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日商積水化學工業股份有限公司
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Publication of TW202506893A publication Critical patent/TW202506893A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

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  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113124718A 2023-07-03 2024-07-02 硬化性樹脂組成物、硬化膜、積層體、攝像裝置、半導體裝置及積層體之製造方法 TW202506893A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-109512 2023-07-03
JP2023109512 2023-07-03

Publications (1)

Publication Number Publication Date
TW202506893A true TW202506893A (zh) 2025-02-16

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TW113124718A TW202506893A (zh) 2023-07-03 2024-07-02 硬化性樹脂組成物、硬化膜、積層體、攝像裝置、半導體裝置及積層體之製造方法

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JP (1) JPWO2025009514A1 (https=)
TW (1) TW202506893A (https=)
WO (1) WO2025009514A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6724091B1 (en) * 2002-10-24 2004-04-20 Intel Corporation Flip-chip system and method of making same
CN102712740B (zh) * 2009-09-14 2015-07-08 纳美仕有限公司 用于高密度互连倒装晶片的底部填充料
EP2781553A4 (en) * 2011-11-15 2015-07-08 Nippon Catalytic Chem Ind SILICONE COMPOSITION, HARDENABLE RESIN COMPOSITION AND SEALING MATERIAL
US9593240B2 (en) * 2012-11-13 2017-03-14 Jnc Corporation Thermosetting resin composition
JP2017119848A (ja) 2015-12-25 2017-07-06 Jnc株式会社 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
WO2018025850A1 (ja) 2016-08-03 2018-02-08 三菱ケミカル株式会社 樹脂組成物
TW202340324A (zh) * 2021-12-23 2023-10-16 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化膜、積層體、攝像裝置、半導體裝置、積層體之製造方法、及具有接合電極之元件之製造方法
JP2023094125A (ja) * 2021-12-23 2023-07-05 積水化学工業株式会社 樹脂硬化物、硬化性樹脂組成物、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法

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WO2025009514A1 (ja) 2025-01-09

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