JPWO2023120625A5 - - Google Patents
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- Publication number
- JPWO2023120625A5 JPWO2023120625A5 JP2023503033A JP2023503033A JPWO2023120625A5 JP WO2023120625 A5 JPWO2023120625 A5 JP WO2023120625A5 JP 2023503033 A JP2023503033 A JP 2023503033A JP 2023503033 A JP2023503033 A JP 2023503033A JP WO2023120625 A5 JPWO2023120625 A5 JP WO2023120625A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- curable resin
- electrode
- solvent
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 16
- 239000002904 solvent Substances 0.000 claims 11
- 238000001035 drying Methods 0.000 claims 5
- 125000001931 aliphatic group Chemical group 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 150000003961 organosilicon compounds Chemical class 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- 125000004122 cyclic group Chemical group 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 238000003384 imaging method Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000012299 nitrogen atmosphere Substances 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 125000001424 substituent group Chemical group 0.000 claims 2
- 230000004580 weight loss Effects 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 230000004888 barrier function Effects 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023211415A JP2024042696A (ja) | 2021-12-23 | 2023-12-14 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021209413 | 2021-12-23 | ||
| JP2021209413 | 2021-12-23 | ||
| JP2021209414 | 2021-12-23 | ||
| JP2021209414 | 2021-12-23 | ||
| PCT/JP2022/047302 WO2023120625A1 (ja) | 2021-12-23 | 2022-12-22 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023211415A Division JP2024042696A (ja) | 2021-12-23 | 2023-12-14 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120625A1 JPWO2023120625A1 (https=) | 2023-06-29 |
| JPWO2023120625A5 true JPWO2023120625A5 (https=) | 2023-11-24 |
| JP7522910B2 JP7522910B2 (ja) | 2024-07-25 |
Family
ID=86902713
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023503033A Active JP7522910B2 (ja) | 2021-12-23 | 2022-12-22 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
| JP2023503049A Active JP7425257B2 (ja) | 2021-12-23 | 2022-12-22 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
| JP2023211415A Pending JP2024042696A (ja) | 2021-12-23 | 2023-12-14 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
| JP2024005955A Withdrawn JP2024052692A (ja) | 2021-12-23 | 2024-01-18 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023503049A Active JP7425257B2 (ja) | 2021-12-23 | 2022-12-22 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
| JP2023211415A Pending JP2024042696A (ja) | 2021-12-23 | 2023-12-14 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
| JP2024005955A Withdrawn JP2024052692A (ja) | 2021-12-23 | 2024-01-18 | 硬化性樹脂組成物、硬化膜、積層体、撮像装置、半導体装置、積層体の製造方法及び接合電極を有する素子の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20250054895A1 (https=) |
| EP (2) | EP4455224A4 (https=) |
| JP (4) | JP7522910B2 (https=) |
| KR (2) | KR20240121703A (https=) |
| TW (2) | TW202340324A (https=) |
| WO (2) | WO2023120627A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120380085A (zh) * | 2023-01-23 | 2025-07-25 | 积水化学工业株式会社 | 树脂组合物、固化膜、层叠体、拍摄装置、半导体装置、层叠体的制造方法和具有接合电极的元件的制造方法 |
| JPWO2025009514A1 (https=) * | 2023-07-03 | 2025-01-09 | ||
| CN116693850A (zh) * | 2023-07-14 | 2023-09-05 | 韩山师范学院 | 一种高频低介损热固性聚酰亚胺薄膜的制备方法 |
| WO2025063069A1 (ja) * | 2023-09-21 | 2025-03-27 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化膜、積層体及び半導体装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3954330B2 (ja) * | 2001-06-18 | 2007-08-08 | 信越化学工業株式会社 | 液状樹脂組成物及びこれを硬化してなる半導体装置保護用材料 |
| JP4281444B2 (ja) * | 2003-08-12 | 2009-06-17 | チッソ株式会社 | 液晶配向膜形成用ワニス、液晶配向膜および液晶表示素子 |
| JP2005105011A (ja) * | 2003-09-26 | 2005-04-21 | Asahi Kasei Electronics Co Ltd | ポリアミド酸エステル組成物 |
| KR100610481B1 (ko) | 2004-12-30 | 2006-08-08 | 매그나칩 반도체 유한회사 | 수광영역을 넓힌 이미지센서 및 그 제조 방법 |
| JP5369629B2 (ja) * | 2008-11-12 | 2013-12-18 | Ｊｎｃ株式会社 | 架橋性ケイ素化合物、その製造方法、架橋性組成物、シロキサンポリマー、シリコーン膜、該架橋性ケイ素化合物の原料となるケイ素化合物、及びその製造方法 |
| JP5610379B2 (ja) | 2008-11-12 | 2014-10-22 | Jnc株式会社 | シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜 |
| JP5803398B2 (ja) * | 2011-08-04 | 2015-11-04 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、及び、電子機器 |
| JP5791983B2 (ja) * | 2011-07-07 | 2015-10-07 | 三井化学株式会社 | 樹脂組成物、これを用いたポリイミド金属積層体、及び電子回路用基板 |
| JP2020033540A (ja) * | 2018-08-28 | 2020-03-05 | 日立化成株式会社 | シルセスキオキサン含有ポリイミド |
| WO2021261403A1 (ja) * | 2020-06-22 | 2021-12-30 | 積水化学工業株式会社 | 積層体、硬化性樹脂組成物、積層体の製造方法、接合電極を有する基板の製造方法、半導体装置及び撮像装置 |
-
2022
- 2022-12-22 TW TW111149517A patent/TW202340324A/zh unknown
- 2022-12-22 KR KR1020247007674A patent/KR20240121703A/ko active Pending
- 2022-12-22 TW TW111149518A patent/TW202336161A/zh unknown
- 2022-12-22 US US18/722,920 patent/US20250054895A1/en active Pending
- 2022-12-22 EP EP22911329.5A patent/EP4455224A4/en active Pending
- 2022-12-22 WO PCT/JP2022/047305 patent/WO2023120627A1/ja not_active Ceased
- 2022-12-22 US US18/720,896 patent/US20250051573A1/en active Pending
- 2022-12-22 EP EP22911327.9A patent/EP4455223A4/en active Pending
- 2022-12-22 JP JP2023503033A patent/JP7522910B2/ja active Active
- 2022-12-22 KR KR1020247007673A patent/KR20240127946A/ko active Pending
- 2022-12-22 JP JP2023503049A patent/JP7425257B2/ja active Active
- 2022-12-22 WO PCT/JP2022/047302 patent/WO2023120625A1/ja not_active Ceased
-
2023
- 2023-12-14 JP JP2023211415A patent/JP2024042696A/ja active Pending
-
2024
- 2024-01-18 JP JP2024005955A patent/JP2024052692A/ja not_active Withdrawn
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